Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
Santa Clara, California--(Newsfile Corp. - March 25, 2024) - Eliyan ("Eliyan") Corporation, credited for the invention of the semiconductor industry's highest-performance and most efficient chiplet interconnect, today announced the closing of its latest funding round, totaling $60 million.