StratEdge Brings Packaging Innovation to IMAPS Device Packaging
StratEdge Corporation , leader in the design, production, and assembly of high-performance semiconductor packages for demanding applications, today announced it will showcase its latest package manufacturing innovations at the IMAPS Device Packaging Conference in Fountain Hills, Arizona, March 19-20, 2024.
- StratEdge Corporation , leader in the design, production, and assembly of high-performance semiconductor packages for demanding applications, today announced it will showcase its latest package manufacturing innovations at the IMAPS Device Packaging Conference in Fountain Hills, Arizona, March 19-20, 2024.
- In addition to our innovative packaging solutions, StratEdge will be showcasing its expanded automated package assembly capabilities.
- “StratEdge is dedicated to advancing packaging technologies that power the next generation of high-performance devices,” said Casey Krawiec, VP of Global Sales at StratEdge.
- “Due to the twin challenges of rising labor costs and a tighter labor market, StratEdge has invested heavily in automation.