Intel

Supermicro Expands Edge Compute Portfolio to Accelerate IoT and Edge AI Workloads with New Generation of Embedded Solutions

Retrieved on: 
Tuesday, April 9, 2024
Cloud, HDMI, Temperature, Intel, GPU, Intel Core, Network, Memory, Environment, Internet of things, PCI Express, AI, NANO, DIN, RAM, Intel Atom, Dust, Robotics, Housing, Gigabit Ethernet, Ecosystem, TB, Atom, Total, Video game

SAN JOSE, Calif. and NUREMBERG, Germany, April 9, 2024 /PRNewswire/ -- Supermicro, Inc. (NASDAQ: SMCI), a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, announces a new generation of IoT and embedded systems designed to enhance performance and increase power-efficiency for intelligent applications at the remote edge. With the addition of these new models, including support for the new Intel® Atom® x7000RE processor, Supermicro further enhances its diverse infrastructure solutions to deliver computing and AI performance to the intelligent edge.

Key Points: 
  • With the addition of these new models, including support for the new Intel® Atom® x7000RE processor, Supermicro further enhances its diverse infrastructure solutions to deliver computing and AI performance to the intelligent edge.
  • "Our building block architecture allows us to design and deliver a wide range of AI servers that give enterprises the solutions they need, from the edge to the cloud.
  • "They are depending on our ecosystem to deliver solutions for low-power, price-sensitive, and space-constrained environments that can address the wide variety of workloads across the edge."
  • Addressing the need for an economical solution to run AI inferencing workloads at the edge, Supermicro also introduces the 1U SYS-111AD-WRN2.

DFI Elevates Electric Vehicle Charging Experience at Embedded World 2024

Retrieved on: 
Monday, April 8, 2024
DFI, Intel, XMX, GM, Intel Arc, FHD, Embedded, EDGE Group, Kyōto Station, Transport, VM, City, Electronics, System, BenQ, CMS, AIOT, CPU, UI, Video game

TAIPEI, April 8, 2024 /PRNewswire/ -- At Embedded World 2024, DFI, the world's leading brand in embedded motherboards and industrial computers, unveiled its groundbreaking EV Charger application, responding to the surge in electric vehicle (EV) usage and the corresponding need for an extensive EV charging infrastructure. Powered by the 13th Gen Intel Core i9-13900TE processor and Intel Arc GPU, DFI's embedded solution enhances AI capabilities at edge in the expanding EV market.

Key Points: 
  • TAIPEI, April 8, 2024 /PRNewswire/ -- At Embedded World 2024 , DFI , the world's leading brand in embedded motherboards and industrial computers, unveiled its groundbreaking EV Charger application, responding to the surge in electric vehicle (EV) usage and the corresponding need for an extensive EV charging infrastructure.
  • Powered by the 13th Gen Intel Core i9-13900TE processor and Intel Arc GPU, DFI's embedded solution enhances AI capabilities at edge in the expanding EV market.
  • "DFI leverages virtual machine (VM) virtualization technology to introduce a robust Workload Consolidation platform that can run multiple operating systems simultaneously with just one Intel CPU for applications such as EV charging."
  • DFI President Alexander Su said, "We're proud to offer solutions enhancing user experiences and promoting sustainability in the AIOT era."

Motivair to Exhibit AI-Ready Liquid Cooling Technology at Data Center World

Retrieved on: 
Friday, April 5, 2024
Intel, Science, H100, Corporation, HPC, Research, Big data, Artificial intelligence, Booth, AMD, NVIDIA, Communications satellite

BUFFALO, N.Y., April 5, 2024 /PRNewswire-PRWeb/ -- Motivair Corporation, a global leader and innovator in cooling digital infrastructure and mission-critical applications, will exhibit at Data Center World in Washington, D.C., at Booth 555.

Key Points: 
  • Motivair Corporation, a global leader and innovator in cooling digital infrastructure, artificial intelligence applications, high-wattage processors, and mission-critical applications, will exhibit at Data Center World in Washington, D.C., at Booth 555
    BUFFALO, N.Y., April 5, 2024 /PRNewswire-PRWeb/ -- Motivair Corporation, a global leader and innovator in cooling digital infrastructure and mission-critical applications, will exhibit at Data Center World in Washington, D.C., at Booth 555.
  • The event, April 15-18, is the only global industry event that combines real-world, practitioner, and thought leader expertise with in-depth research and data, and access to a full spectrum of solution providers driving the data center and digital infrastructure industry forward.
  • Stop at booth 555 to learn how Motivair is delivering reliable cooling technology that enables the world to solve complex thermal challenges and advances in technology, business, and science.
  • Attendees can also visit the Motivair booth to see displays of its End-to-End Liquid Cooling Portfolio designed exclusively for HPC, Artificial Intelligence, and Big Data users, including its Coolant Distribution Units (CDUs) and the ChilledDoor®.

Luxshare-TECH Preview for OFC 2024: Optical Interconnect Products Inject New Vitality into the AI Industry

Retrieved on: 
Monday, March 25, 2024
Arista, OSFP, Intel, Artificial intelligence, DPO, AI, DR4, Printed circuit board

Luxshare-TECH will showcase its latest AI and data center optical interconnect products and solutions at OFC 2024.

Key Points: 
  • Luxshare-TECH will showcase its latest AI and data center optical interconnect products and solutions at OFC 2024.
  • Visit Luxshare-TECH booth #3044 to see demonstrations of these innovative products and solutions and explore the bright future of optical interconnects.
  • As a leading player in the optical interconnect industry, Luxshare-TECH is committed to providing innovative and high-quality products and solutions that empower the AI industry.
  • Luxshare-TECH invites you to visit booth #3044 to learn more about its latest AI and data center optical interconnect products and solutions.

Avant Technologies to Build First AI-Focused Data Center in Milwaukee

Retrieved on: 
Monday, March 25, 2024
Magnet, Microsoft, Intel, Growth, University, Big Tech, Marquette University, GE HealthCare, MSOE, Workforce, OTCQB

Avant’s initial data center is set to be built in Milwaukee, Wisconsin.

Key Points: 
  • Avant’s initial data center is set to be built in Milwaukee, Wisconsin.
  • Avant expects its state-of-the-art facility to be operational in the first half of 2025.
  • Microsoft is expanding its recent billion-dollar investment with a new data center south of Milwaukee, while Google established a Madison office focused on data center optimization.
  • The combination of Milwaukee as a thriving tech scene, strong investment hub, established tech giants, a growing talent pool, and affordability make Milwaukee the perfect inaugural location for Avant's future success.

Sekur Private Data Ltd. Adds US Tech Disruptor and Innovator to Board of Advisors

Retrieved on: 
Thursday, March 21, 2024
Microsoft, Intel, Special forces, Machine learning, Federal Supreme Court, University, Growth, Data science, Aswath Damodaran, Partnership, Information commissioner, Data mining, Risk, Knowledge, Internet, FRA, Neural network, Predictive analytics, Business intelligence, Behavior informatics, IP, Privacy, Swiss Federal Constitution, Artificial intelligence, Cryptocurrency

He adds unparalleled expertise and strategic vision to Sekur's disruptive approach to new and unique privacy and cybersecurity solutions.

Key Points: 
  • He adds unparalleled expertise and strategic vision to Sekur's disruptive approach to new and unique privacy and cybersecurity solutions.
  • Michael Giuliano is an American entrepreneur and scholar that has independently designed, developed, patented, and commercialized products in excess of $2B USD.
  • He has a mastery level in the areas of Data Science, Artificial Intelligence, Machine Learning, Neural Networks, Quantitative Analytics, Predictive Analytics, Business Intelligence, Organizational Change.
  • He is an active board member for top echelon leadership organizations including Special Forces, Cyber, Tactical, and Corporations.

Cultural Intelligence Leader Collage Group Announces First Chief Marketing Officer, Elizabeth Jackson, as Company Accelerates Growth

Retrieved on: 
Wednesday, March 20, 2024
Campbell Soup Company, Software as a service, Growth, Playtex, Procter, Church & Dwight, Timex, VF Corporation, Research, Cultural intelligence, Rest, CPG, P&L, Foodservice, KVH, CMO, Intel, Marketing, Procter & Gamble, Energizer

Bethesda, MD, March 20, 2024 (GLOBE NEWSWIRE) -- Today Collage Group , a leading provider of Cultural Intelligence, announced Elizabeth Jackson as the company’s first Chief Marketing Officer – a pillar in fueling the organization’s growth.

Key Points: 
  • Bethesda, MD, March 20, 2024 (GLOBE NEWSWIRE) -- Today Collage Group , a leading provider of Cultural Intelligence, announced Elizabeth Jackson as the company’s first Chief Marketing Officer – a pillar in fueling the organization’s growth.
  • As a seasoned CMO, she possesses more than 30 years of experience in marketing, strategy, insights, and new product innovation.
  • “A highly skilled business leader and entrepreneur, Elizabeth brings a passion for research, data, and insights, as well as expertise in brand-building, lead generation, and expansion into new verticals,” said CEO and Co-Founder David Wellisch.
  • Jackson will focus on accelerating adoption of the product in the market and developing long-term strategic growth plans.

Nano Dimension Announces Another Deep Learning AI Patent Granted to its DeepCube Technology

Retrieved on: 
Tuesday, March 19, 2024
Intel, Artificial neural network, Patent, Artificial intelligence, AI, Software, Confidentiality, AMD, 3D printing, Data

Waltham, Mass., March 19, 2024 (GLOBE NEWSWIRE) --  Nano Dimension Ltd. (Nasdaq: NNDM) (“Nano Dimension” or the “Company”), a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (“AM”) 3D printing solutions, today announced that a patent was granted for technology developed by its industrial artificial intelligence (“AI”) group, DeepCube, that enables better training and optimization of decentralized deep learning-based AI models.

Key Points: 
  • The new patent addresses this challenge by ultimately training and improving the AI models on customers’ premises, without Nano Dimension having direct access to the new data or model.
  • This patent is another key component in Nano Dimension’s efforts to transform DeepCube from a solely in-house AI group to a leading industrial AI solution provider.
  • Nano Dimension’s DeepCube alone has 50 patent applications filed, of which 27 have already been granted.
  • Yoav Stern, Chief Executive Officer and Member of the Board of Directors of Nano Dimension, stated: “Nano Dimension’s leadership in AI continues to make progress.

Arizona State University and Deca Technologies to Pioneer North America’s First R&D Center for Advanced Fan-Out Wafer-Level Packaging

Retrieved on: 
Tuesday, March 19, 2024
CHIPS, Intel, Arizona State University, FOWLP, Development, Amkor Technology, Research, Electronics, Artificial intelligence, ASU, SWAP, Science, Faculty, Student, Heart, Deca, Machine learning, Government, TSMC, Telescopic sight

TEMPE, Ariz., March 19, 2024 (GLOBE NEWSWIRE) -- Arizona State University (ASU) and Deca Technologies (Deca), a premier provider of advanced wafer- and panel-level packaging technology, today announced a groundbreaking collaboration to create North America’s first fan-out wafer-level packaging (FOWLP) research and development center.

Key Points: 
  • TEMPE, Ariz., March 19, 2024 (GLOBE NEWSWIRE) -- Arizona State University (ASU) and Deca Technologies (Deca), a premier provider of advanced wafer- and panel-level packaging technology, today announced a groundbreaking collaboration to create North America’s first fan-out wafer-level packaging (FOWLP) research and development center.
  • The center will combine state-of-the-art advanced-packaging technology, equipment, processes, materials, expertise and training, fostering the development of new capabilities from proof of concept to pilot scale.
  • In collaboration with Deca, ASU is committed to establishing onshore access to these advanced-packaging capabilities.
  • The Gen 2 M-Series including Adaptive Patterning technology brings unprecedented scaling to higher densities for heterogeneous integration and chiplet applications.

OSS Wins U.S. Intelligence AI Project for Liquid Immersion-Cooled Storage Server at the Edge

Retrieved on: 
Tuesday, March 12, 2024
Department of Defence, Intel, SDS, Intelligence, Navy, OSS, NVM Express, HPC, Electronics, Artificial intelligence, Acquisition, AI, Water, Centauri, Solid-state drive, Machine learning, Defense, Video game

Procured through a global defense prime contractor, the win represents the first liquid immersion-cooled high-performance compute solution for a U.S. intelligence agency mobile ground station application and a new intelligence community end user for OSS.

Key Points: 
  • Procured through a global defense prime contractor, the win represents the first liquid immersion-cooled high-performance compute solution for a U.S. intelligence agency mobile ground station application and a new intelligence community end user for OSS.
  • OSS will integrate two 3U-SDS units into a liquid immersion-cooled system which will be a part of a deployable ground station at the edge.
  • The custom storage accelerator system will be ruggedized for the harshest of edge environments.
  • The OSS SDS storage system is also available for commercial and industrial use and can be ordered directly from OSS sales engineers at [email protected] or +1 (877) 438-2724.