MediaTek

FOSSiBOT F106 Pro Debut: Global First Rugged Phone Combining Ample Camp Light And Prominent Speaker

Retrieved on: 
Monday, April 8, 2024
Smartphone, Glass, Camping, MediaTek, SOS, SIM, Sale, AI, RAM, IP68, Music, LED, Video game

FOSSiBOT claims it to be the world's first rugged phone, combining an ample camping light and a prominent speaker, and it's the best rugged smartphone in its range.

Key Points: 
  • FOSSiBOT claims it to be the world's first rugged phone, combining an ample camping light and a prominent speaker, and it's the best rugged smartphone in its range.
  • The FOSSiBOT F106 PRO has a unique design; you can notice it even among dozens of rugged smartphones.
  • The back features cameras, a flashlight, a large speaker cover, and a prominent LED camping light from top to middle.
  • Apart from the large speaker and high-brightness camping light, the upcoming FOSSiBOT F106 Pro is generally a mid-range smartphone.

SK hynix announces semiconductor advanced packaging investment in Purdue Research Park

Retrieved on: 
Wednesday, April 3, 2024
CHIPS, Second Continental Congress, HBM, Congress, MediaTek, Federation, Partnership, Technology policy, SK Hynix, Saab, Research, I-65, News, Rolls-Royce, AI, Social responsibility, Semiconductor, Bayer, Silicon, Workforce, ChatGPT, Purdue Research Park, Policy

WEST LAFAYETTE, Ind., April 03, 2024 (GLOBE NEWSWIRE) -- SK hynix Inc. announced Wednesday (April 3) that it plans to invest close to $4 billion to build an advanced packaging fabrication and R&D facility for AI products in the Purdue Research Park.

Key Points: 
  • WEST LAFAYETTE, Ind., April 03, 2024 (GLOBE NEWSWIRE) -- SK hynix Inc. announced Wednesday (April 3) that it plans to invest close to $4 billion to build an advanced packaging fabrication and R&D facility for AI products in the Purdue Research Park.
  • “We are excited to build a state-of-the-art advanced packaging facility in Indiana,” said SK hynix CEO Kwak Noh-Jung.
  • “SK hynix is the global pioneer and dominant market leader in memory chips for AI,” Purdue President Mung Chiang said.
  • This historic announcement is the next step in Purdue University’s persistent pursuit of semiconductor excellence as part of the Purdue Computes initiative.

Communication Test and Measurement Market worth $14.9 billion by 2029 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Monday, April 8, 2024
Viavi Solutions, LitePoint, POC, Telecom, Telecommunications, Consultant, MIMO, Lab, Rohde & Schwarz, BERT, Measurement, Anomaly, IEEE 802.11be, NetScout Systems, Keysight, FR3, ROI, OTA, Distortion, Communication, RF, Radio frequency, Smartphone, Growth, MediaTek, Spirent, FR1, Research and development, Hertz, Hardware

In the dynamic landscape of the Communication Test and Measurement Market, an array of specialized software plays a pivotal role in ensuring the seamless functionality and robust performance of communication networks.

Key Points: 
  • In the dynamic landscape of the Communication Test and Measurement Market, an array of specialized software plays a pivotal role in ensuring the seamless functionality and robust performance of communication networks.
  • To determine, segment, and forecast the global Communication Test and Measurement Market based on offering, test solution, type of test, end user, and region in terms of value.
  • To analyze the industry trends, patents, and innovations related to the Communication Test and Measurement Market.
  • To analyze the opportunities for stakeholders by identifying the high-growth segments of the Communication Test and Measurement Market.

Communication Test and Measurement Market worth $14.9 billion by 2029 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Monday, April 8, 2024
Viavi Solutions, LitePoint, POC, Telecom, Telecommunications, Consultant, MIMO, Lab, Rohde & Schwarz, BERT, Measurement, Anomaly, IEEE 802.11be, NetScout Systems, Keysight, FR3, ROI, OTA, Distortion, Communication, RF, Radio frequency, Smartphone, Growth, MediaTek, Spirent, FR1, Research and development, Hertz, Hardware

In the dynamic landscape of the Communication Test and Measurement Market, an array of specialized software plays a pivotal role in ensuring the seamless functionality and robust performance of communication networks.

Key Points: 
  • In the dynamic landscape of the Communication Test and Measurement Market, an array of specialized software plays a pivotal role in ensuring the seamless functionality and robust performance of communication networks.
  • To determine, segment, and forecast the global Communication Test and Measurement Market based on offering, test solution, type of test, end user, and region in terms of value.
  • To analyze the industry trends, patents, and innovations related to the Communication Test and Measurement Market.
  • To analyze the opportunities for stakeholders by identifying the high-growth segments of the Communication Test and Measurement Market.

Phison Collaborates with MediaTek to Propel Generative AI Computing and Services

Retrieved on: 
Tuesday, March 26, 2024
Software, Hardware, Data Management, Consumer Electronics, Technology, Artificial Intelligence, Semiconductor, Security, Engineering, Automotive Manufacturing, Aerospace, Manufacturing, AOI, UFS, ONFI, Synthetic media, GPU, MediaTek, Assistant, Professor, SSD, MIPI, GAISF, SDA, DRAM, NVM Express, Knowledge, Blog, Carbon footprint, MultiMediaCard, AI, IEEE-SA, PCI-SIG, Life, JEDEC, Nature, Electronics, Architecture, USB, IP, Ecosystem, UFSA, Solid-state drive, Leonardo da Vinci, Multimedia, Media, Automotive industry, Generative, Medical device

Under the collaboration, Phison's cutting-edge AI computing service, aiDAPTIV+ , will pair with MediaTek's premier generative AI service platform, MediaTek DaVinci, heralding a new epoch for AI computing and application services and accelerating the adoption of generative AI in everyday life.

Key Points: 
  • Under the collaboration, Phison's cutting-edge AI computing service, aiDAPTIV+ , will pair with MediaTek's premier generative AI service platform, MediaTek DaVinci, heralding a new epoch for AI computing and application services and accelerating the adoption of generative AI in everyday life.
  • (Graphic: Phison)
    MediaTek DaVinci is an advanced, open platform for generative AI services, built on the Generative AI Service Framework (GAISF).
  • Phison's aiDAPTIV+ features a pioneering SSD-integrated AI computing architecture that breaks down large AI models for concurrent operation with SSDs.
  • "aiDAPTIV+ is set to revolutionize AI model fine-tuning, and MediaTek DaVinci has already made significant strides in AI services,” said Dr. Wei Lin, CTO, Phison.

Elliptic Labs Chosen for Transsion’s Infinix Note 40 Series Smartphones

Retrieved on: 
Tuesday, March 19, 2024
Apps, Applications, Mobile, Wireless, Technology, Security, Software, Networks, Internet, Hardware, Data Management, Artificial Intelligence, Smartphone, Organization, Transsion, Cheek, Labs, MediaTek, Ellipse, Infinix Mobile, Life, Ear, OEM, System, Consumer electronics

Transsion, the fifth largest smartphone maker globally, is releasing the Infinix Note 40 smartphone series for the global market.

Key Points: 
  • Transsion, the fifth largest smartphone maker globally, is releasing the Infinix Note 40 smartphone series for the global market.
  • The Infinix Note 40 series is comprised of four smartphones: the Infinix Note 40, Note 40 Pro, Note 40 Pro 5G, and Note 40 Pro+ 5G.
  • All four smartphones are driven by Elliptic Labs’ partner MediaTek's chipsets, with MediaTek’s Helio G99 chipset driving both the Note 40 and Note 40 Pro versions and the Dimensity 7050 chipset is at the core of the Note 40 Pro 5G and Note 40 Pro+ 5G smartphones.
  • AI Virtual Smart Sensor, AI Virtual Proximity Sensor, and AI Virtual Smart Sensor Platform are trademarks of Elliptic Labs.

Phison Announces Strategic Partnerships Deploying aiDAPTIV+ at NVIDIA GTC 2024

Retrieved on: 
Monday, March 18, 2024
Software, Hardware, Data Management, Consumer Electronics, Technology, Artificial Intelligence, Semiconductor, Security, Engineering, Audio, Video, Automotive Manufacturing, Manufacturing, GTC, OP, GPU, University, ASUS, MultiMediaCard, Nature, JEDEC, USB, IP, Corporation, UFS, Partnership, 2.0, PCI Express, IEEE-SA, TB, Language, ONFI, GIGABYTE, Memory, NVM Express, Knowledge, Blog, News, AI, CXL, Privacy, Architecture, UFSA, Solid-state drive, Machine learning, Automotive industry, Commodity, PC, MediaTek, SSD, MIPI, SDA, Luigi, PCI-SIG, Electronics, Graphics processing unit, MAINGEAR, Data center, Multimedia, NVIDIA, Video game

Phison Electronics (8299TT), a leading provider of NAND controllers and storage solutions, today announced aiDAPTIV+ partnerships with ASUS, Gigabyte, MAINGEAR , and MediaTek.

Key Points: 
  • Phison Electronics (8299TT), a leading provider of NAND controllers and storage solutions, today announced aiDAPTIV+ partnerships with ASUS, Gigabyte, MAINGEAR , and MediaTek.
  • "MAINGEAR's Pro AI Series workstations, driven by Phison aiDAPTIV+, empower users with large language model AI training prowess without excessive costs.
  • "We continue to uphold our partnership with Phison, aiming to foster innovation and maintain competitiveness in the market."
  • To know more about Phison, please visit Phison Website or Phison Q&A for details.

Ezurio Announces the Sona™ MT320: The First Industrial Grade Wi-Fi 6 + Bluetooth Module Powered by MediaTek Filogic 320 Technology

Retrieved on: 
Thursday, April 4, 2024
Sona, OS, FCC, Certification, MediaTek, CE, Bed, SDIO, Wi-Fi, Partnership, Internet of things, Tungsten, UKCA, Linux, SMARC, SMT, Wi-Fi 6, WPA3, HD, Pump, Bluetooth Special Interest Group, Bluetooth, Mobile phone

AKRON, Ohio, April 4, 2024 /PRNewswire/ -- Ezurio, a global leader in connectivity, today announces the upcoming Sona™ MT320 , the latest addition to their growing Wi-Fi 6 module portfolio.

Key Points: 
  • AKRON, Ohio, April 4, 2024 /PRNewswire/ -- Ezurio, a global leader in connectivity, today announces the upcoming Sona™ MT320 , the latest addition to their growing Wi-Fi 6 module portfolio.
  • The Sona MT320 is the first industrial grade Wi-Fi + Bluetooth module based on the segment leading MediaTek Filogic 320 (MT7921) Wi-Fi 6 chipset.
  • This embedded module series has been designed to work seamlessly with the MediaTek Genio processor family targeted at the industrial IoT sector.
  • The Sona MT320 provides a rugged, compact, and globally certified solution that ensures reliable connectivity and easy integration.

TECNO Unveils AI-Enhanced CAMON 30 Series, Redefining Imaging and Design Excellence in its Class

Retrieved on: 
Wednesday, April 3, 2024
Dark, Emerald, Atmos, Smartphone, Algorithm, MediaTek, Distortion, Memory, Mobile World Congress, Social media, IP54, Sale, Magic, Dolby Atmos, AI, AMOLED, Life, Nature, OIS, Glass, Dust, Sensation, System, Heart, Music, Sony, MWC, Portrait, TSMC

HONG KONG, April 3, 2024 /PRNewswire/ -- Innovative technology brand TECNO unveiled the CAMON 30 Pro 5G, CAMON 30 5G and CAMON 30 models of its newest CAMON 30 Series, delivering an extremely powerful flagship imaging experience in its price bracket, elevating the joy of video and image-making to new heights. The flagship model, CAMON 30 Premier 5G, is set to launch later in April. Building on TECNO's design philosophy for the CAMON range, the CAMON 30 Series empowers modern users to take a leading role in life through professional-level imaging and exquisite, stylish design.

Key Points: 
  • HONG KONG, April 3, 2024 /PRNewswire/ -- Innovative technology brand TECNO unveiled the CAMON 30 Pro 5G, CAMON 30 5G and CAMON 30 models of its newest CAMON 30 Series, delivering an extremely powerful flagship imaging experience in its price bracket, elevating the joy of video and image-making to new heights.
  • Building on TECNO's design philosophy for the CAMON range, the CAMON 30 Series empowers modern users to take a leading role in life through professional-level imaging and exquisite, stylish design.
  • Helping users to shoot flawless group shots and superbly detailed selfies, the CAMON 30 Pro 5G, CAMON 30 5G and CAMON 30 all feature an exceptional 50MP Eye-tracking Autofocus Front Camera.
  • CAMON 30 Pro 5G, CAMON 30 5G and CAMON 30 will be on sale from early April, with Africa as its first launch market.

Tungsten510 SMARC® System-On-Module from Ezurio Combines Superior Edge Processing with Wi-Fi 6 and Bluetooth 5.3 Connectivity

Retrieved on: 
Thursday, March 28, 2024
Cortex, POS, DSP, MediaTek, Memory, Partnership, Internet of things, Physics, Tablet, HDR, Radio, USB, SMARC, SBC, Hertz, SOM, Projection, Android, ARM Cortex-A55, AVP, Mobile phone

AKRON, Ohio, March 28, 2024 /PRNewswire/ -- Ezurio, a global leader in connectivity, today announces the upcoming Tungsten510 system-on-modules (SOM), in a smart mobility architecture (SMARC) form factor, developed in partnership with MediaTek.

Key Points: 
  • The Tungsten510 SMARC is powered by the MediaTek Genio 510 processor and Ezurio's upcoming Sona™ MT320 Wi-Fi 6/Bluetooth 5.3 module, based on the MediaTek Filogic 320 Wi-Fi/Bluetooth combo radio.
  • Together these solutions provide a comprehensive compute and connectivity platform.
  • This high-performance SOM, when used with the SMARC carrier , also serves as a single board computer (SBC) that can significantly speed customer products to market.
  • The Tungsten510 conforms to the SMARC 2.1.1 standard form factor (82mm x 50mm), with a SMARC edge connector, on board ethernet PHYs, and a USB hub controller.