OpenAccess

OpenAccess Color Team Garners Annual Si2 Power of Partnerships Award

Retrieved on: 
Tuesday, July 25, 2023

Technologists from Intel and Microsoft are 2023 winners of the Silicon Integration Initiative Power of Partnerships Award, presented annually to the Si2 volunteer team with the most significant contributions to the electronic design automation industry.

Key Points: 
  • Technologists from Intel and Microsoft are 2023 winners of the Silicon Integration Initiative Power of Partnerships Award, presented annually to the Si2 volunteer team with the most significant contributions to the electronic design automation industry.
  • The Si2 OpenAccess Multi-Patterning Technology (oaxColor) Working Group, led by Benjamin Hoefer of Intel, won the award for developing oaxColor, a managed extension to the OpenAccess API.
  • OpenAccess is one of the most widely used open-reference databases for IC design.
  • Marshall Tiner, Si2 senior director of OpenAccess, said, “The lack of multipattern technology support had impeded the further expansion of OA interoperability in this area.

Cadence Digital and Custom/Analog Design Flows Certified for Samsung Foundry’s SF2 and SF3 Process Technologies

Retrieved on: 
Wednesday, June 28, 2023

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that its digital and custom/analog flows achieved certification for Samsung Foundry’s SF2 and SF3 process technologies.

Key Points: 
  • Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that its digital and custom/analog flows achieved certification for Samsung Foundry’s SF2 and SF3 process technologies.
  • Joint customers are actively developing SF2- and SF3-based designs using the Cadence® flows.
  • Cadence’s comprehensive Cadence RTL-to-GDS design flow that supports Samsung’s SF2 and SF3 technologies provides optimal power, performance and area (PPA).
  • “Through our latest collaboration with Cadence, we’ve seen early customers improve productivity with the Cadence-certified design flows and our advanced SF2 and SF3 process technologies,” said Sangyun Kim, vice president of the Foundry Design Technology Team at Samsung Electronics.

Si2 Board Welcomes New Representatives from Leading EDA Providers

Retrieved on: 
Thursday, November 3, 2022

This change in board leadership represents a deepening in product and R&D involvement by our EDA partners, said Pankaj Kukkal, chair of the Si2 board of directors and vice president of EDA, emulation and post-silicon engineering for Qualcomm Technologies.

Key Points: 
  • This change in board leadership represents a deepening in product and R&D involvement by our EDA partners, said Pankaj Kukkal, chair of the Si2 board of directors and vice president of EDA, emulation and post-silicon engineering for Qualcomm Technologies.
  • Aparna continues to represent Cadence in leadership positions at Si2, IEEE and Accellera, and Daves strategic planning savvy was fundamental in driving Si2 toward its current focus on system-level interoperability.
  • I look forward to helping the board determine the best path forward for Si2 and for the industry as a whole.
  • Si2 has more than 65 members, including semiconductor and fabless manufacturers, foundries and EDA companies.

Si2 Announces New Board Chair at 2022 Annual Members Meeting

Retrieved on: 
Thursday, September 29, 2022

At its recent Annual Members Meeting, Silicon Integration Initiative announced the election of Pankaj Kukkal, vice president of EDA, emulation, and post-silicon engineering for Qualcomm Technologies, as chair of the board of directors.

Key Points: 
  • At its recent Annual Members Meeting, Silicon Integration Initiative announced the election of Pankaj Kukkal, vice president of EDA, emulation, and post-silicon engineering for Qualcomm Technologies, as chair of the board of directors.
  • "Rahul will continue to be an integral part of Si2s board," said John Ellis, Si2 president and CEO.
  • "During his tenure as chair, Si2 created an internal technology incubator to develop new interoperability solutions.
  • The Annual Members Meeting featured an executive round table with Kukkal, Goyal, and former Si2 board chair Leon Stok, vice president of EDA at IBM.

Si2 Names Recipients of Annual Power of Partnerships Award

Retrieved on: 
Wednesday, June 29, 2022

Technologists from Intel, IBM, Microsoft and Cadence Design Systems are this year's Silicon Integration Initiative Power of Partnerships Award winners, recognizing the Si2 volunteer team with the most significant contributions to silicon-to-system implementation.

Key Points: 
  • Technologists from Intel, IBM, Microsoft and Cadence Design Systems are this year's Silicon Integration Initiative Power of Partnerships Award winners, recognizing the Si2 volunteer team with the most significant contributions to silicon-to-system implementation.
  • The OA database creates interoperability between EDA companies and semiconductor designers and manufacturers.
  • The Si2 board of directors is focused on improving OA interoperability and this team has risen to the challenge," said Marshall Tiner, senior director of OA.
  • The Si2 membership includes more than 65 semiconductor and fabless manufacturers, foundries and EDA companies.

Keysight Joins Si2 TITAN to Advance Silicon-to-System Technology Interoperability

Retrieved on: 
Thursday, April 7, 2022

Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world, announced it recently joined the Silicon Integration Initiative (Si2) Technology Interoperability Trajectory Advisory Council ( TITAN ).

Key Points: 
  • Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world, announced it recently joined the Silicon Integration Initiative (Si2) Technology Interoperability Trajectory Advisory Council ( TITAN ).
  • TITAN is a thought leadership forum focused on accelerating ecosystem collaboration with technology interoperability for silicon-to-system success.
  • Our TITAN membership reflects Keysights commitment to contribute to technology interoperability and support industry standards within our PathWave tools and workflows.
  • Keysight has a long history of active participation in Si2 programs, said John Ellis, Si2 president and CEO.

Si2 Reorganizes, Promotes Two Technologists to Bolster Semiconductor Interoperability Programs

Retrieved on: 
Thursday, February 10, 2022

John Ellis, president and CEO, said, Experts throughout the industry consider interoperability in semiconductor design a primary strategy to accelerate innovation and achieve faster time-to-results and time-to-market.

Key Points: 
  • John Ellis, president and CEO, said, Experts throughout the industry consider interoperability in semiconductor design a primary strategy to accelerate innovation and achieve faster time-to-results and time-to-market.
  • With this reorganization, Si2 positions itself to advance its current interoperability activities and identify new opportunities.
  • She will continue driving work in AI/ML and UPM in this new role while developing additional Si2 technical activities in interoperability through the new Si2 TITAN council.
  • In his new position, Tiner oversees the development of OpenAccess, the Si2 flagship product and the semiconductor industrys most widely used database and API for semiconductor design.

Anant Adke of Siemens EDA Joins Si2 Board of Directors

Retrieved on: 
Wednesday, February 2, 2022

Anant Adke, vice president of Engineering, Siemens EDA, has been elected to the Silicon Integration Initiative board of directors.

Key Points: 
  • Anant Adke, vice president of Engineering, Siemens EDA, has been elected to the Silicon Integration Initiative board of directors.
  • View the full release here: https://www.businesswire.com/news/home/20220202005675/en/
    Anant Adke, vice president of Engineering, Siemens EDA, has been elected to the Silicon Integration Initiative board of directors.
  • The addition of Anant continues the strong support Siemens EDA has provided Si2 over the years, said John Ellis, Si2 president and CEO.
  • As a longstanding board member, Siemens EDA strongly supports tool interoperability and the value and cost-savings it provides for the industry.

Si2 Launches TITAN Initiative Advancing Silicon-to-System Technology Interoperability

Retrieved on: 
Tuesday, November 16, 2021

TITAN will work with Si2 member companies to explore a spectrum of technology interoperability gaps between electronic design automation suppliers, cloud providers, foundries, semiconductor and emerging silicon-to-system companies.

Key Points: 
  • TITAN will work with Si2 member companies to explore a spectrum of technology interoperability gaps between electronic design automation suppliers, cloud providers, foundries, semiconductor and emerging silicon-to-system companies.
  • TITAN will generate consensus on technology interoperability in workflows and advise the Si2 board of directors on high-level trends and realizable solutions.
  • In addition, TITAN will bridge established Si2 programs such as the OpenAccess, Compact Model and OpenStandards Coalitions, and Special Interest Groups.
  • TITAN will serve as the trusted technology advisor to the Si2 board of directors, which evaluates and forwards proposals to Si2 technology teams for prioritization and action plans.

Cadence and Samsung Accelerate 3nm Mixed-Signal Silicon

Retrieved on: 
Wednesday, September 8, 2021

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it has collaborated with Samsung Foundry to deliver qualified Mixed-Signal OpenAccess-ready process design kit (PDK) technology files that support a range of Samsung process technologies from 28FDS to GAA base 3nm.

Key Points: 
  • Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it has collaborated with Samsung Foundry to deliver qualified Mixed-Signal OpenAccess-ready process design kit (PDK) technology files that support a range of Samsung process technologies from 28FDS to GAA base 3nm.
  • The Cadence digital and custom flow supports the Cadence Intelligent System Design strategy, enabling customers to achieve system-on-chip (SoC) design excellence.
  • To learn more about the Cadence Mixed-Signal OpenAccess PDK for Samsung technology, visit www.cadence.com/go/Samsung3nmMS .
  • Cadence, the Cadence logo and the other Cadence marks found at www.cadence.com/go/trademarks are trademarks or registered trademarks of Cadence Design Systems, Inc. All other trademarks are the property of their respective owners.