The Octavo Systems OSDZU3 System-in-Package and OSDZU3-REF Development Platform Are in Production
The OSDZU3 System-in-Package, designed around the AMD Zynq® UltraScale+™ MPSoC, pushes the limits of what is possible with SiP integration.
- The OSDZU3 System-in-Package, designed around the AMD Zynq® UltraScale+™ MPSoC, pushes the limits of what is possible with SiP integration.
- To accompany the OSDZU3 SiP and help customers to get started, Octavo Systems has also released the OSDZU3-REF development platform.
- The OSDZU3-REF is an open-source development platform that comes with an OSDZU3 installed and as a 4-layer design.
- Harley Walsh, President of Octavo Systems, expressed his enthusiasm, stating, "Getting the OSDZU3 into production is the culmination of relentless effort and dedication by our exceptional team.