Gov. Holcomb, IEDC announce generational multi-billion-dollar investment to make Indiana leader in semiconductor packaging
The facility will also develop future generations of chips and house an advanced packaging R&D line.
- The facility will also develop future generations of chips and house an advanced packaging R&D line.
- “We are excited to build a state-of-the-art advanced packaging facility in Indiana,” said SK hynix CEO Kwak Noh-Jung.
- “We believe this project will lay the foundation for a new Silicon Heartland; a semiconductor ecosystem centered in the Midwest Triangle.
- The IEDC also committed up to $45 million through the Industrial Development Grant Fund to support infrastructure improvements surrounding the new plant.