Design Automation Conference

Automate Registration is Open for 2024 Show

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Thursday, September 7, 2023
Automotive Manufacturing, Aerospace, Supply Chain Management, Manufacturing, Logistics, Machinery, Machine Tools, Metalworking & Metallurgy, Construction & Property, Health, General Health, Building Systems, Transport, Other Technology, General Automotive, Telecommunications, Retail, Software, Artificial Intelligence, Hardware, Electronic Design Automation, Consumer Electronics, Automotive, Technology, Semiconductor, Agriculture, Other Energy, Natural Resources, Apps, Applications, Other Manufacturing, Textiles, Steel, Packaging, Energy, Engineering, Chemicals, Plastics, Learning, Prevalence, McCormick Place, Intelligence, Automation, AI, Design Automation Conference, Robotics, Conference, Consumer electronics, A3

Registration is open for Automate 2024 —the largest robotics and automation trade show in North America—the Association for Advancing Automation (A3) announced today.

Key Points: 
  • Registration is open for Automate 2024 —the largest robotics and automation trade show in North America—the Association for Advancing Automation (A3) announced today.
  • The Automate Show, May 6-9, 2024, will be a historic one—held at Chicago’s renowned McCormick Place and expected to be 25% larger than the previous record in Detroit in 2023.
  • In conjunction with the free show, the paid Automate Conference will feature more than 100 talks from the world’s top industry experts.
  • But Automate is the only show where attendees will see the most cutting-edge solutions first—for every application and industry.

Ausdia to Demonstrate Timevision, the leading Design Constraint Verification and Management Solution at DVCon India

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Tuesday, September 12, 2023
Technology, Mobile, Wireless, Semiconductor, Automotive, General Automotive, Security, Software, Hardware, Electronic Design Automation, Spreadsheet, STA, Design Automation Conference, DAC, Conference, SDC

Ausdia , the leading developer of design constraints verification and management solutions and silver sponsor of DVCon India 2023, will showcase its flagship platform Timevision™ at the upcoming conference being held September 13-14, 2023 in Bangalore, India.

Key Points: 
  • Ausdia , the leading developer of design constraints verification and management solutions and silver sponsor of DVCon India 2023, will showcase its flagship platform Timevision™ at the upcoming conference being held September 13-14, 2023 in Bangalore, India.
  • This groundbreaking approach allows STA engineers to dramatically increase their productivity by operating as constraint synthesizers, rather than line-by-line writers and debuggers.
  • DVCon India is the yearly regional conference in India of DVCon.
  • DVCon is the premier conference on the application of languages, tools and methodologies for the design and verification of electronic systems and integrated circuits.

Workato Announces Winners of 2023 Automate Impact Awards

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Wednesday, September 6, 2023
Software, Technology, Artificial Intelligence, Data Management, Cloud, Media, Food, Monk, Anti Additive Association, Digital Impact Awards Africa, Marketing, DoorDash, Performing arts of Australia, HubSpot, Automation, Organization, Snowflake, CRM, United Kingdom, Growth, AI, Design Automation Conference, Tag cloud, Business, Conference, Enbridge, Data science, Sales, Video game

Workato , the leading AI-powered enterprise automation platform, announced the winners of this year’s Impact Awards at the company’s customer conference, Automate 2023.

Key Points: 
  • Workato , the leading AI-powered enterprise automation platform, announced the winners of this year’s Impact Awards at the company’s customer conference, Automate 2023.
  • “We are excited to have announced the winners of the Impact Awards at this year’s in-person Automate Conference.
  • From myself and our entire Workato team, we’d like to extend congratulations to everyone involved,” said Vijay Tella, co-founder, and CEO of Workato.
  • The North American winners were acknowledged and presented their respected awards in person at Automate 2023.

Workato Introduces “The New Automation Mindset” Book, a Blueprint for Harnessing the Power of AI and Automation

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Tuesday, August 29, 2023
Entertainment, Security, Technology, Software, Books, Artificial Intelligence, Internet, Cloud, Era, Human, Education, Gartner, Editorial, Software engineering, Workiva, Research, Automation, Movement, Wiley, Thought, Target, Organization, Amazon, Barnes, The, Book, Computer History Museum, Publishing, Improper integral, Google Cloud, Platform ecosystem, Lenovo, Magic, Growth, CIO, AI, Design Automation Conference, Distinguishing, Conference, Management, Customer service, Medical device, Noble, Broadcom Inc.

AI presents the opportunity to take the work we started at Workato 10 years ago to a whole new level.

Key Points: 
  • AI presents the opportunity to take the work we started at Workato 10 years ago to a whole new level.
  • This is a blueprint on how every organization can harness generative AI and automation to transform.”
    “The New Automation Mindset” takes an in-depth look at how technologies like generative AI, and low-code, cloud-native automation have propelled organizations into this new AI era.
  • But, without a new mindset and unique blueprint, the reality is that no technology – not even AI – will break loose the stalled digital transformation movement.
  • To harness The New Automation Mindset, leaders must adopt a growth (reimagining AI + Automation), scale (across the enterprise with governance), and process (orchestrating end-to-end) mindset.

Workato Named to Constellation ShortList™ for AI-Driven Cognitive Applications

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Tuesday, August 22, 2023
Software, Technology, Artificial Intelligence, Other Technology, Constellation, LLM, Rationalization, Automation, Investment, Machine learning, Improper integral, AI, Design Automation Conference, API, Research, News, Conference, Sales

Workato , the leading AI-powered enterprise automation platform, today announced it was named to the Constellation ShortList™ for AI-Driven Cognitive Applications in Q3 2023 .

Key Points: 
  • Workato , the leading AI-powered enterprise automation platform, today announced it was named to the Constellation ShortList™ for AI-Driven Cognitive Applications in Q3 2023 .
  • Workato was also included on Constellation ShortList™ Integration Platform as a Service (iPaaS).
  • “We are honored to be included on the Constellation ShortList™ for AI-Driven Cognitive Applications in Q3 2023.
  • The Workato platform enables enterprises to automate their business processes across the organization by integrating their applications, data, and experiences.

Ansys and Altium Boost Electronics Design with Digital Continuity

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Tuesday, July 11, 2023
Communication, ECAD, ALU, Workflow, Electronics, Internet of things, ANSYS, CAD, IC, Booth, Head, ASX, Design Automation Conference, ICS, Risk, Engineering, Translation, PCB, Polychlorinated biphenyl, Invention, Transport, Conference, DAC, Software, 3D printing, Information technology, Mobile phone, Printed circuit board, Ansys, Altium

PITTSBURGH, July 11, 2023 /PRNewswire/ -- Altium and Ansys (NASDAQ: ANSS) are partnering to improve the electronic design and development process by digitally connecting Altium's electronic computer-aided design (ECAD) tools and Ansys Electronics Desktop. This bidirectional integration, set to be available in the second half of 2023, creates a new level of digital continuity while helping to reduce development time and the risk of design errors.

Key Points: 
  • Altium and Ansys are creating an open, digital bridge between ECAD and simulation to help accelerate electronic design and reduce errors
    The bidirectional integration will provide continuous data exchange between Ansys and Altium electronics design packages, replacing import and export translation, and manual communication
    PITTSBURGH, July 11, 2023 /PRNewswire/ -- Altium and Ansys (NASDAQ: ANSS) are partnering to improve the electronic design and development process by digitally connecting Altium's electronic computer-aided design (ECAD) tools and Ansys Electronics Desktop .
  • Ansys and Altium will demonstrate the integration during the 2023 Design Automation Conference (DAC) in San Francisco.
  • Comprehensive electronic design requires an evaluation of signal and power integrity, electromagnetic compatibility, thermal mechanical stresses, and electronics reliability.
  • From individual inventors to multinational corporations, more PCB designers and engineers choose Altium software to design and realize electronics-based products.

Xpeedic Launches High-Speed Digital Signal Integrity, Power Integrity Suite at Design Automation Conference

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Monday, July 10, 2023
Hermes, IBIS, Comparison of EM simulation software, EDA, TSV, 3DIC, Statistics, Design Automation Conference, AC, Temperature, DOE, COM, DDR4, LPDDR5X, GUI, PEC, LPDDR, IEEE MTT-S International Microwave Symposium, IMS, AMI, JEDEC, D2D, Silicon, Conference, DAC, FEM, Video game, Mobile phone, Printed circuit board

EDA 2023 Suite Includes 2.5/3DIC SI/PI Simulation for Advanced Packaging,3D EM Simulation, SI/PI and Multiphysics Analysis, High-Speed System Simulation

Key Points: 
  • EDA 2023 Suite Includes 2.5/3DIC SI/PI Simulation for Advanced Packaging,3D EM Simulation, SI/PI and Multiphysics Analysis, High-Speed System Simulation
    SAN FRANCISCO, July 10, 2023 (GLOBE NEWSWIRE) -- Xpeedic today launched its high-speed digital signal integrity and power integrity (SI/PI) suite with significant features and upgrades to advanced packaging and high-speed design domains as the 60th Design Automation Conference (DAC) opens at Moscone Center West here.
  • The Xpeedic EDA 2023 Suite includes 2.5D and 3D signal integrity and power integrity simulation for advanced packaging, along with three platforms to support 3D Electromagnetic (EM) simulation, multi-domain co-simulation and high-speed system simulation.
  • It allows rapid analysis of signal, power, and temperature to ensure compliance with defined specifications, facilitating design iterations.
  • The Xpeedic EDA 2023 Suite for high-speed digital SI/PI and multi-physics simulation platforms is shipping now.

Ausdia Introduces Spreadsheet Constraints at the 60th Design Automation Conference

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Friday, July 7, 2023
Electronic Design Automation, Semiconductor, Data Management, Technology, Software, Hardware, NXP Semiconductors, GDSII, RTL, Spreadsheet, Design Automation Conference, SOC, SDC, DFT, NXP, Conference, DAC, Audit

DESIGN AUTOMATION CONFERENCE – Ausdia , the leading developer of design constraints verification and management solutions, introduced a significant enhancement to its SDC platform at the 60th Design Automation Conference (DAC) 2023.

Key Points: 
  • DESIGN AUTOMATION CONFERENCE – Ausdia , the leading developer of design constraints verification and management solutions, introduced a significant enhancement to its SDC platform at the 60th Design Automation Conference (DAC) 2023.
  • Timevision SC allows constraint developers to both read and write timing constraints in a Spreadsheet format – typically ExcelTM.
  • Users can also export existing SDC to SC (Spreadsheet Constraints) format for simplified review and porting.
  • Ausdia is highlighting the Timevision platform in booth #2311 at the Design Automation Conference (DAC) at the San Francisco Moscone Convention Center, San Francisco, CA from July 10 - 12, 2023.

Primarius to Showcase DTCO-Enabled EDA Solutions at DAC Powered by Next-Generation SPICE and FastSPICE Technology

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Thursday, July 6, 2023
DRAM, SPICE, Flash, EDA, Ageing, AC, Design Automation Conference, Moscone Center, Device, SRAM, PDK, PCell, DTCO, Conference, DAC, Cassette tape, Mobile phone, Computer data storage

“Visitors to our DAC booth will see the breadth of solutions to ensure designers meet time-to-market windows and optimize their designs for better yield, power, performance and area,” remarks Dr. Lianfeng Yang, President at Primarius Technologies.

Key Points: 
  • “Visitors to our DAC booth will see the breadth of solutions to ensure designers meet time-to-market windows and optimize their designs for better yield, power, performance and area,” remarks Dr. Lianfeng Yang, President at Primarius Technologies.
  • NanoSpice X shows significant new improvements in large post-layout SPICE simulation for full-chip analog designs with complicated digital circuits where huge power and ground nets slowed SPICE simulation previously.
  • Both circuit analysis solutions offer comprehensive high-yield and signal integrity analysis, aging and EM/IR simulation and advanced circuit checking capabilities.
  • To arrange a meeting or demonstration of the Primarius Technologies product portfolio, send email to: [email protected] .

PDF Solutions Announces Its Participation in DAC 2023 and SEMICON West 2023

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Thursday, July 6, 2023
Amazon Web Services, Expert, Design Automation Conference, Assembly line, Future, Amazon, Connect the dots, Moscone Center, PDF Solutions, PDF, AWS, DAC, Conference, KPI-driven code analysis, Television, Asset management

SANTA CLARA, Calif., July 06, 2023 (GLOBE NEWSWIRE) -- PDF Solutions, Inc. (Nasdaq: PDFS), a leading provider of comprehensive data solutions for the semiconductor ecosystem, today announced its participation to the Design Automation Conference (DAC 2023 https://www.dac.com/) being held July 9th to July 13th and to SEMI.org’s SEMICON West 2023 (https://expo.semi.org/west2023/public/Enter.aspx) being held July 11th to July 13th.

Key Points: 
  • SANTA CLARA, Calif., July 06, 2023 (GLOBE NEWSWIRE) -- PDF Solutions, Inc. (Nasdaq: PDFS), a leading provider of comprehensive data solutions for the semiconductor ecosystem, today announced its participation to the Design Automation Conference (DAC 2023 https://www.dac.com/) being held July 9th to July 13th and to SEMI.org’s SEMICON West 2023 (https://expo.semi.org/west2023/public/Enter.aspx) being held July 11th to July 13th.
  • PDF Solutions’ Exensio Analytics solutions will be demonstrated at the Amazon Web Services (AWS) Booth #1841.
  • PDF Solutions’ Exensio Analytics solutions interoperation with proteanTecs solutions will be shown daily at 11:30am at proteanTecs’ Booth #1834.
  • PDF Solutions’ Exensio Analytics solutions interoperation with proteanTecs solutions will be shown daily at 2:30pm at proteanTecs’ Booth #2449.