CEVA, Inc.

Lowest power, small form factor Wi-Fi® and Bluetooth® combo module significantly improves battery life

Retrieved on: 
Thursday, March 21, 2019
Telecommunications, Wireless, Computer networking, Bluetooth, Technology, Wi-Fi, Smartphones, CEVA, Inc., Bluetooth Low Energy

SMYRNA, Ga., March 21, 2019 /PRNewswire/ --Murata Manufacturing Co., Ltd. announced that it collaborated with Cypress Semiconductor Corp.to develop the Type 1LV (CYW43012) solution that is the lowest power, small form factor Wi-Fi and Bluetooth module.

Key Points: 
  • SMYRNA, Ga., March 21, 2019 /PRNewswire/ --Murata Manufacturing Co., Ltd. announced that it collaborated with Cypress Semiconductor Corp.to develop the Type 1LV (CYW43012) solution that is the lowest power, small form factor Wi-Fi and Bluetooth module.
  • This product improves battery life in wearables, smart home products, and portable audio applications.
  • Based on the Cypress CYW43012 combo chipset, the ultra-small dual-band Wi-Fi 11a/b/g/n/ (11ac Friendly) +Bluetooth 5.0 moduleprovides data transference rates up to 78Mbps on Wi-Fi and 3Mbps on Bluetooth.
  • With this lowest Wi-Fi power module, we now enable a new class of products that were previously designated for Bluetooth."

DSP Concepts Announces TalkTo™ Audio Front Ends for Voice-Controlled Products

Retrieved on: 
Tuesday, March 12, 2019
Technology, Consumer electronics, Hardware, Software, Audio, Video, VoIP, Fabless semiconductor companies, Tensilica, CEVA, Inc.

DSP Concepts, Inc ., a developer of embedded audio processing solutions, has launched TalkTo, a new brand and a major expansion of its voice recognition technologies.

Key Points: 
  • DSP Concepts, Inc ., a developer of embedded audio processing solutions, has launched TalkTo, a new brand and a major expansion of its voice recognition technologies.
  • TalkTo is a family of software-based Audio Front Ends for voice-controlled products.
  • The demos I've heard of DSP Concepts' TalkTo technology are very impressive, Peter Cooney, founder and director of SAR Insight and Consulting, said.
  • DSP Concepts, Inc. provides embedded audio processing solutions, including its AWE Core audio processing engine, Audio Weaver graphical development environment, and TalkTo line of software-based Audio Front Ends.

Intelligraphics Delivers Windows Embedded Compact 7 (WEC7) IGX Wi-Fi Soft AP For Improved Operational Efficiency and Safety In Mobile Devices

Retrieved on: 
Wednesday, February 27, 2019
Digital technology, Technology, Computing, Digital electronics, Wireless, Wi-Fi, Texas Instruments, Bluetooth, Integrated circuit, Embedded system, CEVA, Inc., Wi-Fi Alliance

Its ease of use, reasonable cost of development and stability makes Windows Embedded a strong platform for broad range of mobile devices and embedded platforms.

Key Points: 
  • Its ease of use, reasonable cost of development and stability makes Windows Embedded a strong platform for broad range of mobile devices and embedded platforms.
  • Previously many popular Wi-Fi Chipsets have been limited to Station mode.
  • Workarounds using Bluetooth have been deployed but are limited by range, throughput and interference issues with existing Wi-Fi networks.
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  • Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog integrated circuits (ICs) and embedded processors.

Eta Wireless Introduces ETA7: First ETAdvanced Power Management IC for 5G Phones

Retrieved on: 
Tuesday, February 26, 2019
Technology, Mobile telecommunications, Wireless, Mobile technology, 5G, Internet of things, Technology forecasting, Wireless networking, Wi-Fi, LTE, CEVA, Inc.

BARCELONA, Spain, Feb. 26, 2019 /PRNewswire/ --Eta Wireless today introduced the first power management solution to address the significant power challenges for 5G.

Key Points: 
  • BARCELONA, Spain, Feb. 26, 2019 /PRNewswire/ --Eta Wireless today introduced the first power management solution to address the significant power challenges for 5G.
  • Called ETA7, the new power management integrated circuit (PMIC) uses the company's ETAdvanced technology to reduce energy consumption up to 50% in 5G phones, wearables, and Internet of Things (IoT) devices.
  • ETA7 is the latest addition of power management solutions from Eta Wireless joining a portfolio of ETA5 addressing power consumption for LTE and ETA6 reducing power for Wi-Fi.
  • The founders of Eta Wireless previously built Eta Devices, a company providing proven power management solutions for mobile base stations.

CEVA Completes its First Test Trial of CEVA-Dragonfly NB2 NB-IoT Silicon at Vodafone Narrowband-IoT Open Lab

Retrieved on: 
Tuesday, February 26, 2019
Technology, Articles, Mobile technology, Internet of things, LTE, Narrowband IoT, Information and communications technology, 3GPP, CEVA, Inc.

Using Vodafone's open lab facilities which provide a realistic end-to-end live environment of the Narrowband-IoT technology, CEVA connected to the Vodafone NB-IoT network and demonstrated end-to-end IP connectivity with its CEVA-Dragonfly NB2 test chip running a 3GPP NB-IoT Rel.14 compliant software stack.

Key Points: 
  • Using Vodafone's open lab facilities which provide a realistic end-to-end live environment of the Narrowband-IoT technology, CEVA connected to the Vodafone NB-IoT network and demonstrated end-to-end IP connectivity with its CEVA-Dragonfly NB2 test chip running a 3GPP NB-IoT Rel.14 compliant software stack.
  • Visit CEVA at #MWC19, February 25-28, hall 7, stand 7A71 and experience the CEVA-Dragonfly NB2 platform, or online at https://www.ceva-dsp.com/product/dragonfly .
  • It incorporates network equipment from three of the most important vendors, and allows for a variety of dedicated test scenarios, e.g.
  • CEVA is the leading licensor of signal processing platforms and artificial intelligence processors for a smarter, connected world.

Avnet Announces First Solution with LTE-M Connectivity that Provides AI and Security at the Edge

Retrieved on: 
Monday, February 25, 2019
Technology, Electronic design automation, Hardware, Internet, Software, Telecommunications, Security, Semiconductor, Mobile, Wireless, Technology, Articles, Mobile technology, Wireless, Internet of things, Ambient intelligence, Digital technology, LTE, CEVA, Inc.

Orange is the first Mobile Operator to harness the power of AI and Security at the Edge for the LTE-M network.

Key Points: 
  • Orange is the first Mobile Operator to harness the power of AI and Security at the Edge for the LTE-M network.
  • By utilizing Avnet SmartEdge Agile and the benefits of LTE-M connectivity, customers have an optimized IoT device that is cost-efficient, certified and ready to use.
  • The device works in conjunction with Octonions Brainium meta-sensing software, which helps developers simplify and overcome the complexity faced with IoT project development, serving as an end-to-end platform solution that provides AI and security at the edge.
  • The AI Brainium solution combined with Orange Live Booster module provides the best out-of-the-box experience to accelerate the industrialization of IoT projects utilizing AI and Edge Computing.

Telit's New WL865E4-P Module Enables Enterprise-Grade Wi-Fi and Bluetooth Low Energy IoT

Retrieved on: 
Monday, February 25, 2019
Wireless, Computing, Technology, Wireless networking, Bluetooth, IEEE 802.11, Wi-Fi, CEVA, Inc., ESP32

The low-power Wi-Fi Bluetooth Low Energy (BLE) combination module is based on the Qualcomm QCA4020 system-on-chip (SoC) and is designed for high-bandwidth applications such as health care, video, smart home and industrial control.

Key Points: 
  • The low-power Wi-Fi Bluetooth Low Energy (BLE) combination module is based on the Qualcomm QCA4020 system-on-chip (SoC) and is designed for high-bandwidth applications such as health care, video, smart home and industrial control.
  • Featuring integrated cryptology hardware, the WL865E4-P enables IoT developers to meet demanding requirements for power consumption, security, performance, size and reliability.
  • The WL865E4-P is the latest addition to Telit's low-power Wi-Fi module portfolio, which features proprietary power-saving technology that surpasses the Wi-Fi standard's ultra-low-power modes.
  • The dual-band, dual-module module supports 802.11 a,b,g and n, as well Bluetooth Low Energy (BLE) 5.0, all in a small footprint (595 sq.

Nurlink Launches NB-IoT and GNSS SoC Powered by CEVA-Dragonfly NB2 IP

Retrieved on: 
Wednesday, February 20, 2019
Satellite navigation systems, Spacecraft, Technology, Satellites, GLONASS, Satellite navigation, Galileo, BeiDou Navigation Satellite System, Global Positioning System, CEVA, Inc.

The SoC also includes an extremely low-power multi-GNSS subsystem, supporting GPS/Beidou/Galileo/GLONASS global navigation systems, to ensure highly-accurate device tracking and locating, worldwide.

Key Points: 
  • The SoC also includes an extremely low-power multi-GNSS subsystem, supporting GPS/Beidou/Galileo/GLONASS global navigation systems, to ensure highly-accurate device tracking and locating, worldwide.
  • "The CEVA-Dragonfly NB2 enabled us to massively accelerate our time-to-market by providing many of the key building blocks for our SoC design, already silicon proven and pre-integrated.
  • Our path from licensing to silicon was achieved in under one year, and we're now engaged with operators worldwide to certify our SoC."
  • Now the drive towards ultra-low cost NB-IoT chipsets and modules has begun and Nurlink, powered by our CEVA-Dragonfly NB2 IP solution, is one of the early entrants into this fast growing space.

ON Semiconductor Introduces the RSL10 Sensor Development Kit for Power-Optimized IoT Applications

Retrieved on: 
Wednesday, February 13, 2019
Energy, Other Energy, Technology, Data management, Semiconductor, Mobile, Wireless, Manufacturing, Engineering, Technology, Wireless, Articles, Wireless networking, Bluetooth, Open standards, Bluetooth Low Energy, Indoor positioning system, Tracking, Internet of things, CEVA, Inc.

The RSL10 Sensor Development Kit brings together the highly integrated RSL10 System-in-Package (RSL10 SIP) with a range of advanced low power sensors from Bosch Sensortec.

Key Points: 
  • The RSL10 Sensor Development Kit brings together the highly integrated RSL10 System-in-Package (RSL10 SIP) with a range of advanced low power sensors from Bosch Sensortec.
  • Commenting on the introduction of the RSL10 Sensor Development Kit, Dr. Peter Weigand, Vice President of Marketing, Bosch Sensortec, said: We were excited to work with ON Semiconductor on the RSL10 Sensor Kit.
  • Wiren Perera, who heads IoT at ON Semiconductor, added: The RSL10 Sensor Development Kit, enabled by the industrys lowest power Bluetooth Low Energy radio, will set the standard for ultra-low-power Bluetooth enabled smart sensor design.
  • The RSL10 Sensor Development Kit is available now from ON Semiconductor alongside a number of other energy-efficient rapid prototyping platforms for IoT , including the Bluetooth IoT Development Kit and the recently-introduced Energy Harvesting Bluetooth Low Energy Switch .

REMINDER: CEVA, Inc. Fourth Quarter and Full Year 2018 Earnings Release and Conference Call Scheduled for February 13

Retrieved on: 
Tuesday, February 12, 2019
CEVA, Inc., NASDAQ, Ceva, Conference call, Economy of the United States, Finance, Companies

MOUNTAIN VIEW, Calif., Feb. 12, 2019 /PRNewswire/ -- CEVA, Inc. (NASDAQ: CEVA), will announce results for the fourth quarter and full year 2018 on February 13, 2019 before the NASDAQ market opens.

Key Points: 
  • MOUNTAIN VIEW, Calif., Feb. 12, 2019 /PRNewswire/ -- CEVA, Inc. (NASDAQ: CEVA), will announce results for the fourth quarter and full year 2018 on February 13, 2019 before the NASDAQ market opens.
  • Following the release, CEVA management will conduct a conference call at 8:30 a.m. Eastern Time to discuss the operating performance for the quarter.
  • The conference call will be available via the following dial in numbers:
    The conference call will also be available live via webcast at the following link: https://www.webcaster4.com/Webcast/Page/984/28990 .
  • Please go to the web site at least fifteen minutes prior to the call to register, download and install any necessary audio software.