Lightwave Logic Announces Issuance of U.S. Patent for Breakthrough Chip-Scale Packaging Technique to Enable Foundry-Level Packaging of Polymer Modulators
ENGLEWOOD, Colo., Dec. 12, 2022 /PRNewswire/ -- Lightwave Logic, Inc. (NASDAQ: LWLG), a technology platform company leveraging its proprietary electro-optic polymers to transmit data at higher speeds with less power, today announced the issuance of a U.S. patent, the application of which was announced in June 2022, on a new invention that will enable simplified foundry-level packaging of polymer modulators using chip-scale techniques which can be applied at wafer level, critical for high-volume manufacturing applications.
- in volume) and that eliminates the need for a separate hermetic enclosure or "gold box."
- The sealant process will enable lower cost system implementation in a high-volume foundry environment.
- Specifically, Lightwave Logic's electro-optic polymer modulators will be sealed with low-temperature conformal atomic layer deposition dielectric layers that are supported on a silicon substrate with passive silicon photonics waveguides.
- Lightwave Logic, Inc. (NASDAQ: LWLG) is developing a platform leveraging its proprietary engineered electro-optic (EO) polymers to transmit data at higher speeds with less power.