Automate Installation Process with Press-Fit Terminal Power Modules for a Solder-Free Solution in High-Volume Manufacturing
To better automate the installation process, Press-Fit terminals are often used because they offer a solder-free solution to mount power modules to the PCB.
- To better automate the installation process, Press-Fit terminals are often used because they offer a solder-free solution to mount power modules to the PCB.
- Microchip Technology (Nasdaq: MCHP) today announces its expansive portfolio of SP1F and SP3F power modules are now available with Press-Fit terminals for high-volume applications.
- Solder-free Press-Fit power module terminals allow for automated or robotic installation, which simplifies and speeds up the assembly process to reduce manufacturing costs.
- “This type of plug-and-play power solution also provides a highly reliable mounting solution for automated or robotic assembly.”
Application note AN4322 provides detailed mounting instructions for SP1F and SP3F Press-Fit power modules.