Extrinsic semiconductor

Industry Consortium EEMBC Targets Audio-Processing Performance with New Benchmark

Retrieved on: 
Wednesday, June 22, 2022
Texas Instruments, Industry, Arm, DSP, STMicroelectronics, EEMBC, Renesas Electronics, Extrinsic semiconductor, Intel, Technology, Mobile phone, Infineon Technologies, Fourier

PORTLAND, Ore., June 22, 2022 /PRNewswire/ -- EEMBC is pleased to announce the development of AudioMark , the first end-to-end benchmark specifically focused on audio processing.

Key Points: 
  • PORTLAND, Ore., June 22, 2022 /PRNewswire/ -- EEMBC is pleased to announce the development of AudioMark , the first end-to-end benchmark specifically focused on audio processing.
  • Voice interaction has grown from a specialized interface associated with intelligent speakers to something we encounter every day.
  • It's critical that the industry have an audio benchmark that's flexible, but coherent enough to be meaningful."
  • With AudioMark still in early development, there's a huge opportunity for microprocessor makers to get involved in shaping the benchmark that will help shape the industry.

Industry Consortium EEMBC Targets Audio-Processing Performance with New Benchmark

Retrieved on: 
Wednesday, June 22, 2022
Texas Instruments, Industry, Arm, DSP, STMicroelectronics, EEMBC, Renesas Electronics, Extrinsic semiconductor, Intel, Technology, Mobile phone, Infineon Technologies, Fourier

PORTLAND, Ore., June 22, 2022 /PRNewswire/ -- EEMBC is pleased to announce the development of AudioMark , the first end-to-end benchmark specifically focused on audio processing.

Key Points: 
  • PORTLAND, Ore., June 22, 2022 /PRNewswire/ -- EEMBC is pleased to announce the development of AudioMark , the first end-to-end benchmark specifically focused on audio processing.
  • Voice interaction has grown from a specialized interface associated with intelligent speakers to something we encounter every day.
  • It's critical that the industry have an audio benchmark that's flexible, but coherent enough to be meaningful."
  • With AudioMark still in early development, there's a huge opportunity for microprocessor makers to get involved in shaping the benchmark that will help shape the industry.

pSemi Announces First mmWave Beamformer and Up-down Converter ICs Reach Volume Production

Retrieved on: 
Tuesday, June 21, 2022
Solution, Linearity, GUI, LO, Peregrine, Extrinsic semiconductor, IMS, Technology, Electronics, Semiconductor, High-pass filter, Graphical user interface, Dune, RF Micro Devices, Peregrine Semiconductor, IOT, API, RFIC, EIRP, RMS, Marketing, EVM, History, Software, Communication, Array gain, ICS, Cable television, Computer data storage, Sales, RF, Industry, Harp

DENVER, June 21, 2022 /PRNewswire/ -- INTERNATIONAL MICROWAVE SYMPOSIUM (IMS) – In IMS Booth #7078, pSemi® Corporation, a Murata company focused on semiconductor integration, announces the production readiness of two new mmWave ICs targeted for active antenna systems in 5G base stations, 5G customer premises equipment and point-to-point radio communication applications. In addition to the 8-channel beamforming front end and dual-channel up-down converter ICs, pSemi offers a complete support package of tools and technical expertise to simplify mmWave design and development. The new RF SOI ICs are the latest in our mmWave portfolio that offers full IF-to-RF coverage across the n257, n258, and n260 bands in the industry's smallest form factors.

Key Points: 
  • In addition to the 8-channel beamforming front end and dual-channel up-down converter ICs, pSemi offers a complete support package of tools and technical expertise to simplify mmWave design and development.
  • Read more for the highlights or click to access the beamformer and up-down converter product briefs.
  • Additionally, the PE128300 dual-channel up-down converter IC offers:
    Highly integrated solution Industry's first dual-channel up-down converter saves expensive real estate with the smallest footprint.
  • For more information on the beamformer and up-down converter RFICs, contact the pSemi team.

Silicon Carbide (SiC) Patent Landscape Report 2022: Market Revenues Exceeded $1Billion in 2021 - Market is Growing Fast, Driven by the Adoption of SiC Technology in Electric Vehicle (EV) Applications

Retrieved on: 
Wednesday, June 15, 2022
CAGR, Wolfspeed, Fuji Electric, Silicon carbide, Industry, Invention, STMicroelectronics, Patent, ST, Epitaxial graphene growth on silicon carbide, EV, SICC, Rohm, SKC, Denso, Toshiba, Technology, North American Toyota-Denso Oza, Publication, MOSFET, Leadership, Adoption, Kwansei Gakuin University, Extrinsic semiconductor, Sumitomo Electric Industries, Mitsubishi Electric, Hitachi, II-VI, Panasonic, IP, Toyota, Valašská Senice, Microsoft Excel, Soitec, Toyota Tsusho, Hospitality industry, Renewable energy, 3D printing, Cassette tape, Infineon Technologies

DUBLIN, June 15, 2022 /PRNewswire/ --The "Silicon Carbide (SiC) Patent Landscape 2022" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • DUBLIN, June 15, 2022 /PRNewswire/ --The "Silicon Carbide (SiC) Patent Landscape 2022" report has been added to ResearchAndMarkets.com's offering.
  • The Silicon Carbide (SiC) power device market is growing fast, driven by the adoption of SiC technology in electric vehicle (EV) applications.
  • In this context, the publisher is releasing a new patent landscape report which aims to provide a comprehensive view of the power SiC patent landscape along the whole supply chain/value chain (bulk SiC & bare SiC wafers, epitaxial SiC substrates, SiC devices, SiC modules and circuits).
  • ), priority date, title, abstract, patent assignees, patent's current legal status, and segments (bulk SiC, epitaxial SiC substrates, SiC diodes, planar SiC MOSFETs, trench SiC MOSFETs, SiC modules, circuits, etc.).

Silicon Carbide (SiC) Patent Landscape 2022: Focus on the Top IP Players' Patent Portfolios - ResearchAndMarkets.com

Retrieved on: 
Tuesday, June 14, 2022
Chemicals, Plastics, Manufacturing, II-VI, SKC, EV, Leadership, Hitachi, Toyota, North American Toyota-Denso Oza, Wolfspeed, SICC, Silicon carbide, Microsoft Excel, IP, Patent, Invention, MOSFET, Toshiba, Epitaxial graphene growth on silicon carbide, Denso, Kwansei Gakuin University, Extrinsic semiconductor, STMicroelectronics, Toyota Tsusho, Publication, Technology, Panasonic, Adoption, Rohm, Industry, Fuji Electric, Sumitomo Electric Industries, ST, Soitec, Valašská Senice, Mitsubishi Electric, CAGR, Hospitality industry, Renewable energy, 3D printing, Cassette tape, Infineon Technologies

The "Silicon Carbide (SiC) Patent Landscape 2022" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Silicon Carbide (SiC) Patent Landscape 2022" report has been added to ResearchAndMarkets.com's offering.
  • The Silicon Carbide (SiC) power device market is growing fast, driven by the adoption of SiC technology in electric vehicle (EV) applications.
  • What's more, the technology coverage along the value chain and the geographical coverage of the patent portfolios are narrowly related to the business strategy of IP players.
  • Although historical IP players (Wolfspeed, SiCrystal, II-VI) keeps filing new patents, indicating a continuous improvement of their technology, Sumitomo Electric and Showa Denko took the IP leadership in the SiC substrate patent landscape.

Global and Taiwan Semiconductor Market Report 2022

Retrieved on: 
Friday, June 10, 2022
UMC, VIS, GlobalFoundries, SIMC, SK Hynix, TI, Renesas Electronics, Micrometre, STMicroelectronics, Samsung, Intel, NXP, Tower Semiconductor, Industry, SMIC, YMTC, TSMC, OSAT, IDMS, Renewable energy, Semiconductor, Extrinsic semiconductor, Infineon Technologies

DUBLIN, June 10, 2022 /PRNewswire/ --The "Global Semiconductor Industry Trends and Foundry Capacity Deployment" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • DUBLIN, June 10, 2022 /PRNewswire/ --The "Global Semiconductor Industry Trends and Foundry Capacity Deployment" report has been added to ResearchAndMarkets.com's offering.
  • This report provides an overview of the development of the global semiconductor market and three Taiwanese three semiconductor sub-industry sectors; looks into the development of regional semiconductor supply chains and the deployment major stakeholders such as foundries like Samsung, TSMC, and UMC, chipmakers like Samsung, Intel, and Micron, and analog/auto semiconductor suppliers like Infineon, NXP, and STMicro.
  • As the supply crunch of semiconductors continues in 2022, foundries and OSAT service providers are striving to expand production capacity.
  • Development of the global and Taiwan semiconductor industry, touching on their market value for the period 2015-2022.

Global and Taiwan Semiconductor Market Trends and Foundry Capacity Deployment Report 2022 - ResearchAndMarkets.com

Retrieved on: 
Wednesday, June 8, 2022
Technology, Semiconductor, UMC, VIS, GlobalFoundries, SIMC, SK Hynix, TI, Renesas Electronics, Micrometre, STMicroelectronics, Samsung, Intel, NXP, Tower Semiconductor, Industry, SMIC, YMTC, TSMC, OSAT, IDMS, Semiconductor, Extrinsic semiconductor, Infineon Technologies

The "Global Semiconductor Industry Trends and Foundry Capacity Deployment" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Global Semiconductor Industry Trends and Foundry Capacity Deployment" report has been added to ResearchAndMarkets.com's offering.
  • As the supply crunch of semiconductors continues in 2022, foundries and OSAT service providers are striving to expand production capacity.
  • Development of the global and Taiwan semiconductor industry, touching on their market value for the period 2015-2022.
  • Deployment of four leading foundries in Taiwan, including TSMC, UMC, PSMC, and VIS, and includes a monthly capacity of their fabs and their deliverables.

Worldwide In-Vehicle Networking Industry to 2027 - Featuring Atmel, Infineon Technologies and Microchip Technology Among Others

Retrieved on: 
Tuesday, June 7, 2022
NXP Semiconductors, Microchip Technology, Extrinsic semiconductor, Ansoff Matrix, Xilinx, Observation, Infineon Technologies, COVID-19, STMicroelectronics, Cisco Systems, Porter's five forces analysis, Global, Investment, Growth, Geography, Emotion, Risk, Sierra Wireless, Continental, Market development, Continental AG, Industry, Competitive analysis, Atmel, SWOT, CAGR, USD, Impact, Retail, Risk management

The Global In-Vehicle Networking Market is estimated to be USD 1.26 Bn in 2022 and is projected to reach USD 2.05 Bn by 2027, growing at a CAGR of 10.21%.

Key Points: 
  • The Global In-Vehicle Networking Market is estimated to be USD 1.26 Bn in 2022 and is projected to reach USD 2.05 Bn by 2027, growing at a CAGR of 10.21%.
  • Market dynamics are forces that impact the prices and behaviors of the Global In-Vehicle Networking Market stakeholders.
  • Based on the SWOT analysis conducted on the industry and industry players, The analyst has devised suitable strategies for market growth.
  • The report also includes the regulatory scenario in the industry, which will help you make a well-informed decision.

ATREG Announces Official Closing of onsemi’s South Portland, Maine Fab Sale

Retrieved on: 
Friday, June 3, 2022
Semiconductor, Engineering, Technology, Manufacturing, Software, Other Manufacturing, LinkedIn, Extrinsic semiconductor, Blog, CEO, Engineering, Technology, Acquisition, Diodes Incorporated, Twitter, Metal fabrication

ATREG, Inc., which specializes in helping advanced technology companies divest and acquire infrastructure-rich manufacturing assets (semiconductor fabs and cleanrooms) worldwide, announced today that the acquisition of onsemis operational 200mm manufacturing fab located in South Portland, Maine, USA (SPFAB) by Diodes Incorporated has officially closed.

Key Points: 
  • ATREG, Inc., which specializes in helping advanced technology companies divest and acquire infrastructure-rich manufacturing assets (semiconductor fabs and cleanrooms) worldwide, announced today that the acquisition of onsemis operational 200mm manufacturing fab located in South Portland, Maine, USA (SPFAB) by Diodes Incorporated has officially closed.
  • This fab divestment is part of onsemis fab-liter manufacturing strategy aimed at sustainable financial performance through gross margins expansion.
  • We are grateful to the ATREG team for helping us engineer this win-win transaction with Diodes.
  • For more information, please visit our web site, read our blog, or follow us on LinkedIn and Twitter.

Diodes Incorporated Completes Acquisition of onsemi’s South Portland, Maine Wafer Fabrication Facility and Operations

Retrieved on: 
Friday, June 3, 2022
Telecommunications, Other Manufacturing, Hardware, Consumer Electronics, Technology, Automotive Manufacturing, Semiconductor, Manufacturing, Coronavirus, Time, Russell 3000 Index, Environment, Diodes Incorporated, Standard, Nasdaq, Extrinsic semiconductor, Growth, Private Securities Litigation Reform Act, Risk, DIOD, Acquisition, COVID-19, BiCMOS, ICS, Epidemic, Engineering, Russell, Cyprus Securities and Exchange Commission, Mission statement, Instability, CMOS, Electronic component, Risk management, Diode

Diodes Incorporated (Diodes) (Nasdaq: DIOD) today announced it has completed the transaction to acquire onsemis wafer fabrication facility and operations located in South Portland, Maine (SPFAB).

Key Points: 
  • Diodes Incorporated (Diodes) (Nasdaq: DIOD) today announced it has completed the transaction to acquire onsemis wafer fabrication facility and operations located in South Portland, Maine (SPFAB).
  • As previously announced, Diodes will integrate the South Portland facility and fab operations, including the transfer of SPFAB employees to Diodes.
  • As part of a multi-year wafer supply agreement, Diodes will continue to manufacture onsemis products from SPFAB as onsemi completes the transferring of this production into its other wafer fabs.
  • DIODES is a trademark of Diodes Incorporated in the United States and other countries.