CAN in Automation

On the Fast Lane: NOVOSENSE's Ongoing Commitment to Automotive Chip Excellence

Retrieved on: 
Wednesday, April 10, 2024

NOVOSENSE, a pioneering force in the automotive chips, recently unveiled several groundbreaking products aimed at enhancing performance, reliability, and efficiency in automotive applications.

Key Points: 
  • NOVOSENSE, a pioneering force in the automotive chips, recently unveiled several groundbreaking products aimed at enhancing performance, reliability, and efficiency in automotive applications.
  • NSHT30-Q1 integrates a complete sensor system on a single chip, including a capacitive RH sensor, CMOS temperature sensor and signal processor, and an I2C digital communication interface.
  • NSD3604/8-Q1 can drive multiple loads and is used in automotive domain control architecture.
  • Find out more about NOVOSENSE' automotive chips, please visit our official website ( https://www.novosns.com/en) .

Tektronix unveils decode, trigger & search support for the CAN XL protocol aimed at the growing intelligent transportation network

Retrieved on: 
Tuesday, March 19, 2024

BEAVERTON, Ore., March 19, 2024 /PRNewswire/ -- Tektronix, Inc, a leading provider in test and measurement solutions, today announced the release of the Tektronix CAN XL (Controller Area Network Extended Length) protocol decoder, enabling engineers incorporating the latest generation of CAN communications, and helping Tektronix customers compete in today's fast-changing technology landscape. With the ability to decode signals representing data packets transmitted using CAN XL frames in a CAN network, the Tektronix CAN XL protocol decoder runs on today's 4, 5, 6 Series MSO Oscilloscopes and also offers critical features such as error detection, analysis and debugging of timing and protocol headers. Tektronix is accelerating CAN XL design and debug workflows with this release, and the intuitive user interface on 4, 5, and 6 Series MSOs helps accelerate CAN XL workflows for the company's growing number of transportation customers.

Key Points: 
  • Tektronix is accelerating CAN XL design and debug workflows with this release, and the intuitive user interface on 4, 5, and 6 Series MSOs helps accelerate CAN XL workflows for the company's growing number of transportation customers.
  • CAN XL is the latest innovation in the CAN (Controller Area Network) protocol family, developed and standardized by the CAN in Automation (CiA) consortium, of which Tektronix is a member.
  • The new standard allows mixed message types - Ethernet tunneling and traditional signal-based CAN – at faster data rates of 20 Mb/s.
  • The package includes the ability to trigger on CAN XL Start of Frame and End of Frame, as well as search through acquired signals to find specific CAN XL packets.

Arasan announces its CAN-XL IP with seamlessly integrated CANsec Accelerator IP

Retrieved on: 
Thursday, August 3, 2023

SAN JOSE, Aug. 3, 2023 /PRNewswire/ -- Arasan now offers its CAN XL IP seamlessly combined with the CANsec Acceleration IP, delivering hardware acceleration for secure CAN Bus transactions. This addition completes our CAN IP Portfolio, alongside CAN FD, CAN 2.0, and TT-CAN, solidifying our decade-long commitment to providing CAN IP cores.

Key Points: 
  • Arasan, a top provider of semiconductor IP for automobile SoCs, introduces a fully integrated solution: CAN-XL IP with CANsec Acceleration IP for secure CAN Bus transactions.
  • SAN JOSE, Aug. 3, 2023 /PRNewswire/ -- Arasan now offers its CAN XL IP seamlessly combined with the CANsec Acceleration IP, delivering hardware acceleration for secure CAN Bus transactions.
  • This addition completes our CAN IP Portfolio, alongside CAN FD, CAN 2.0, and TT-CAN, solidifying our decade-long commitment to providing CAN IP cores.
  • Our portfolio of IP for Automotive SoC's includes UNH Certified and automotive-qualified Ethernet IP Cores for customers looking for higher baud rates than supported by CAN XL, the automotive qualified MIPI Portfolio with CSI-2 IP, DSI-2 IP, C-PHY IP, D-PHY IP, I3C IP, and USB-IF certified USB cores.

Arasan announces its CAN-XL IP with seamlessly integrated CANsec Accelerator IP

Retrieved on: 
Thursday, August 3, 2023

SAN JOSE, Aug. 3, 2023 /PRNewswire/ -- Arasan now offers its CAN XL IP seamlessly combined with the CANsec Acceleration IP, delivering hardware acceleration for secure CAN Bus transactions. This addition completes our CAN IP Portfolio, alongside CAN FD, CAN 2.0, and TT-CAN, solidifying our decade-long commitment to providing CAN IP cores.

Key Points: 
  • Arasan, a top provider of semiconductor IP for automobile SoCs, introduces a fully integrated solution: CAN-XL IP with CANsec Acceleration IP for secure CAN Bus transactions.
  • SAN JOSE, Aug. 3, 2023 /PRNewswire/ -- Arasan now offers its CAN XL IP seamlessly combined with the CANsec Acceleration IP, delivering hardware acceleration for secure CAN Bus transactions.
  • This addition completes our CAN IP Portfolio, alongside CAN FD, CAN 2.0, and TT-CAN, solidifying our decade-long commitment to providing CAN IP cores.
  • Our portfolio of IP for Automotive SoC's includes UNH Certified and automotive-qualified Ethernet IP Cores for customers looking for higher baud rates than supported by CAN XL, the automotive qualified MIPI Portfolio with CSI-2 IP, DSI-2 IP, C-PHY IP, D-PHY IP, I3C IP, and USB-IF certified USB cores.

Keysight Enables Engineers to Verify, Debug CAN XL and Other Automotive Protocols

Retrieved on: 
Thursday, April 21, 2022

Key Points: 
  • View the full release here: https://www.businesswire.com/news/home/20220421005751/en/
    Keysights D9010AUTP decodes the SIC mode and fast mode signal generated by CAN SIC XL transceiver.
  • The CAN XL data phase speed is specified to reach 10 Mbps or more, depending on the transceiver capabilities and physical layer components.
  • It also handles the CAN XL protocols implemented with the CAN HS/FD/SIC transceivers.
  • Our customers span the worldwide communications and industrial ecosystems, aerospace and defense, automotive, energy, semiconductor, and general electronics markets.

SAE International and JEDEC Sign Standards Cooperation Agreement for Microelectronic Use in Aviation, Space and Defense

Retrieved on: 
Wednesday, July 7, 2021

SAE International and JEDEC Solid State Technology Association announced today the signing of a Cooperation Agreement to formalize the partnership in defining technical, reliability and procurement standards enabling the use of microelectronics in critical applications across aviation, space and defense sectors.

Key Points: 
  • SAE International and JEDEC Solid State Technology Association announced today the signing of a Cooperation Agreement to formalize the partnership in defining technical, reliability and procurement standards enabling the use of microelectronics in critical applications across aviation, space and defense sectors.
  • The growing partnership between SAE International and JEDEC brings significant value to our industry and government stakeholders through the advancement of microelectronics standards, said Anduin E. Touw, chair of the SAE committee.
  • The CE-11 Component Parts Committee maintains OEM/User/Government information on passive component usage, reliability, developments, applications and standards.
  • This cooperation with SAE International is essential to creating standards that meet the diverse technical and developmental needs of the aerospace industry, said John Kelly, JEDEC President.

Innodisk Delivers the Future of Automation with CANopen Support

Retrieved on: 
Thursday, January 30, 2020

With Innodisk's introduction of CANopen support in its CAN bus embedded peripherals, Innodisk delivers a powerful solution that helps bring enhanced automation to global technology leaders -- further strengthening Innodisk's position as a key contributor to the future of automation.

Key Points: 
  • With Innodisk's introduction of CANopen support in its CAN bus embedded peripherals, Innodisk delivers a powerful solution that helps bring enhanced automation to global technology leaders -- further strengthening Innodisk's position as a key contributor to the future of automation.
  • With support for the CANopen higher-layer protocol, Innodisk's embedded CAN bus modules are now more versatile, enabling even more sophisticated solutions in robotics, motion control, medical applications, and the automotive industry.
  • CANopen is a communication protocol for embedded systems developed by CAN in Automation, a non-profit consortium of CAN-users and manufacturers.
  • Innodisk's introduction of CANopen demonstrates the company's unwavering dedication to best-in-class software support for its products.

International Group of P&I Clubs Authorizes Wave As Approved Paperless Trading Solution

Retrieved on: 
Monday, January 13, 2020

IG P&I is an international group of 13 individual P&I clubs comprised of members which are collectively accountable for covering approximately 90% of the globe's seaborne trade tonnage.

Key Points: 
  • IG P&I is an international group of 13 individual P&I clubs comprised of members which are collectively accountable for covering approximately 90% of the globe's seaborne trade tonnage.
  • Accordingly, IG P&I's certification of Wave as an approved electronic trading network means that participating members can enjoy all the insurance benefits for all covered liability events from their respective P&I club.
  • The IG P&I approval of the Wave legal framework, certifies the technology underpinning the digitization of physical assets in a decentralized network.
  • IG P&I's recognition overcomes a crucial obstacle towards greater commercial adoption across the seaborne trade industry given the gravity and importance of mutual insurance."

SAE International® Announces Keynote Speakers for 2019 COMVEC™ Technology Connection

Retrieved on: 
Tuesday, June 25, 2019

WARRENDALE, Pa., June 25, 2019 /PRNewswire-PRWeb/ --SAE International announces the lineup of keynote speakers for three days of expert-led panel discussions at COMVEC Technology Connection, which will be held Sept. 9-11, 2019, at the JW Marriott in Indianapolis, IN.

Key Points: 
  • WARRENDALE, Pa., June 25, 2019 /PRNewswire-PRWeb/ --SAE International announces the lineup of keynote speakers for three days of expert-led panel discussions at COMVEC Technology Connection, which will be held Sept. 9-11, 2019, at the JW Marriott in Indianapolis, IN.
  • COMVEC is the leading conference for the community that develops vehicles and equipment spanning the on-highway, off-highway (agricultural, construction, industrial), ground defense, and mining sectors.
  • SAE International is a global association committed to advancing mobility knowledge and solutions for the benefit of humanity.
  • We strive for a better world through the work of our philanthropic SAE Foundation, including programs like A World in Motion and the Collegiate Design Series.