Adhesive bonding

Global $2.7B Cross Laminated Timber Industry, 2028 - Europe Estimated to Have a $1.5 Billion Share in 2028 - ResearchAndMarkets.com

Retrieved on: 
Wednesday, December 22, 2021
Forest Products, Natural Resources, CLT, USD, School, Light, Building material, Solution, Forest, Wood, Adhesive bonding, Steel, CAGR, Adoption, Engineered wood

The global cross laminated timber market is expected to reach USD 2.7 billion by 2028, according to the report.

Key Points: 
  • The global cross laminated timber market is expected to reach USD 2.7 billion by 2028, according to the report.
  • The market is expected to expand at a CAGR of 13.6% from 2021 to 2028.
  • Growing demand for lightweight, durable, and sustainable construction materials in residential, institutional, and commercial applications is anticipated to benefit market growth.
  • Rising corporate-related construction activities in commercial, industrial, and office sectors are projected to have a positive impact on market growth

DNP Develops Lead Frame for Miniaturized, Highly Reliable Semiconductor Package QFN(Quad Flat Non-leaded)

Retrieved on: 
Thursday, October 28, 2021
Semiconductor, Automotive Manufacturing, Technology, Manufacturing, Other Manufacturing, Hardware, Dai, JEDEC, Technology, QFN, Industry, Heat, View, Moisture sensitivity level, Communication, Semiconductor, MSL, Photomask, Absorption, Joint Electronics Type Designation System, Multimedia, DNP, Solution, Printing, Adhesive bonding, FY, Printed circuit board

View the full release here: https://www.businesswire.com/news/home/20211027005428/en/

Key Points: 
  • View the full release here: https://www.businesswire.com/news/home/20211027005428/en/
    Newly developed lead frame (Photo: Business Wire)
    By providing this high definition, highly reliable lead frame we aim to expand the use of semiconductor Quad Flat Non-leaded package (QFN) for vehicles.
  • DNP has taken advantage of our microfabrication technology developed over many years to successfully achieve the configuration of lead frame silver plated area of 25um.
  • It has also been possible to maintain high level reliability by improving the adhesion of the mold compound and the lead frame.
  • DNP will propose the newly developed high definition, highly reliable lead frame to post-processing manufacturers and expand this business.