Peter H. Wilson

Alpha and Omega Semiconductor Announces Innovatively Designed Double-Sided Cooling DFN 5x6 Package

Retrieved on: 
Wednesday, January 24, 2024
Electronic Design Automation, Semiconductor, Consumer Electronics, Technology, Other Technology, Telecommunications, Hardware, AOS, PCB, Temperature, MOSFET, Multimedia, Peter H. Wilson, DFN, FOM, Power, ICS, Printed circuit board

Designers have long trusted AOS power semiconductors as essential components that help them meet a wide variety of high-performance application requirements.

Key Points: 
  • Designers have long trusted AOS power semiconductors as essential components that help them meet a wide variety of high-performance application requirements.
  • AOS’ new top and bottom cooling DFN 5x6 package is designed to achieve the highest heat transfer between the exposed top contact and heat sink due to its large surface contact area construction.
  • The top exposed DFN 5x6 package of the AONA66916 shares the same 5mm x 6mm footprint as AOS’ standard DFN 5x6 package, eliminating the need to modify existing PCB layouts.
  • “Cooling the power MOSFET in high power design can be challenging, and AOS has successfully addressed this essential issue with our advanced top exposed package design.

Alpha and Omega Semiconductor Announces Automotive Grade 80V and 100V MOSFETs in TO-Leadless Packaging Technology for e-Mobility

Retrieved on: 
Wednesday, December 13, 2023
Batteries, Hardware, EV, Electric Vehicles, Automotive, Consumer Electronics, Technology, Vehicle Technology, Semiconductor, BLDC, EMI, IATF 16949, PPAP, Multimedia, AOS, Metal electrode leadless face, AOI, IATF, ICS, MOSFET, D2PAK, Peter H. Wilson, Electric power, Printed circuit board, Alpha

This new package helps designers meet the ongoing trend to electrify vehicles with the latest battery technology to meet clean energy zero-emission goals.

Key Points: 
  • This new package helps designers meet the ongoing trend to electrify vehicles with the latest battery technology to meet clean energy zero-emission goals.
  • These capabilities make AOS 80V and 100V MOSFETs ideally suited for automotive BLDC motor and battery management applications for e-mobility.
  • View the full release here: https://www.businesswire.com/news/home/20231213534372/en/
    Automotive Grade 80V and 100V MOSFETs in TOLL Packaging Technology (Graphic: Business Wire)
    The AOS automotive TOLL package is designed to achieve the highest current capability using AOS’s innovative approach which utilizes advanced clip technology to achieve a high in-rush current rating.
  • “Using the AOS Automotive TOLL package with clip technology offers significant performance improvements in a robust package.

Alpha and Omega Semiconductor Introduces MRigidCSP™ Package Technology Strengthening its Battery Management MOSFETs

Retrieved on: 
Tuesday, August 29, 2023
Electronic Design Automation, Semiconductor, Consumer Electronics, Technology, Batteries, Hardware, Peter H. Wilson, WL, Failure, Senior, Multimedia, ICS, AOS, Tablet, MOSFET, PCB, ESD, CSP, Safety, Alpha

Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of power discretes, ICs, modules, and digital power solutions, today introduced the company’s MRigidCSP™ packaging technology for battery management applications.

Key Points: 
  • Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of power discretes, ICs, modules, and digital power solutions, today introduced the company’s MRigidCSP™ packaging technology for battery management applications.
  • AOS’ more robust package technology is particularly suited to battery applications in smartphones, tablets, and ultra-thin notebooks.
  • View the full release here: https://www.businesswire.com/news/home/20230829961898/en/
    AOS introduces MRigidCSP™ package technology for battery management applications (Graphic: Business Wire)
    Fast charging, which requires lower power loss in the battery management circuit, is now widely adopted for portable devices.
  • AOS designed the MRigidCSP package technology to be used with high-aspect ratio CSP die sizes, helping to alleviate one of the major causes of battery management application production problems.

Alpha and Omega Semiconductor Introduces Latest 80V Power MOSFET With Shield Gate Technology

Retrieved on: 
Tuesday, November 16, 2021
Technology, Hardware, Semiconductor, Telecommunications, ICS, Efficiency, MOSFET, AOS, Power MOSFET, Technology, Power, Multimedia, Peter H. Wilson, DFN, Solution, Temperature, D2PAK, BLDC, Electric power industry, Electric motor

Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of power semiconductors, power ICs, and digital power products, today announced the release of our latest 80V Power MOSFET using patented Shield Gate Technology which is optimized for higher switching frequencies used in telecom and server power supply to achieve higher efficiency compared to the previous generation.

Key Points: 
  • Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of power semiconductors, power ICs, and digital power products, today announced the release of our latest 80V Power MOSFET using patented Shield Gate Technology which is optimized for higher switching frequencies used in telecom and server power supply to achieve higher efficiency compared to the previous generation.
  • The new 80V Power MOSFET technology has lower switching losses in hard switching, topologies and have less voltage overshoot than the previous generation.
  • The 80V MOSFET family of devices offers the highest levels of power density and energy efficiency, which are essential in solar, power supplies, and battery power applications such as in eScooters.
  • View the full release here: https://www.businesswire.com/news/home/20211116005568/en/
    Latest 80V Power MOSFET with Shield Gate Technology (Graphic: Business Wire)
    AONR66820 and AONS66811 are Power MOSFETs in DFN3.3x3.3 and DFN 5x6 package, respectively.