AOS


Associated tags: AOS, TVS, Power MOSFET, IC, Power semiconductor device, Electronics, LED, IGBT, IPM, Computer, Television, Intellectual property, Silicon carbide, ICS, Telecommunications, Gate driver, Semiconductor, Hardware, Alpha, MOSFET

Alpha and Omega Semiconductor Introduces a 20V, 7A Type-C Sourcing Protection Switch Designed to Enhance USB Type-C Efficiency and Safety

Retrieved on: 
Thursday, April 11, 2024
Technology, Hardware, Semiconductor, Consumer Electronics, Safety, EN, AOS, TSD, ICS, SOA, Lockout, Multimedia, UVLO, PD, USB, MOSFET, Electronics

Designed to enhance USB Type-C efficiency and safety, these new protection Type-C switches have a current-limiting switch targeting applications that require comprehensive protections.

Key Points: 
  • Designed to enhance USB Type-C efficiency and safety, these new protection Type-C switches have a current-limiting switch targeting applications that require comprehensive protections.
  • View the full release here: https://www.businesswire.com/news/home/20240411640894/en/
    The advanced features of the AOZ1377DI capable to support up to 7A at max 23VIN and programmable current limit, and true reverse current blocking protection.
  • The AOZ1377DI has a True Reverse Current Blocking (TRCB) protection, which prevents undesired reverse current from VOUT to VIN.
  • In addition, it has a wealth of protection features, including input Under-Voltage Lock Out (UVLO), Input Over-Voltage Protection (OV), and Thermal Shut Down Protection (TSD).

Alpha and Omega Semiconductor Announces XSPairFET™ Buck-Boost MOSFET for Higher Power USB PD 3.1 EPR Applications

Retrieved on: 
Tuesday, March 26, 2024
Electronic Design Automation, Semiconductor, Consumer Electronics, Technology, Other Technology, Telecommunications, Hardware, ICS, EPR, AOS, PD, USB, PCB, MOSFET, Buck–boost transformer, Multimedia, Video game

Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of discrete power devices, wide bandgap power devices, power management ICs, and modules, today announced its AONZ66412 XSPairFET™ MOSFET designed for Buck-Boost converters in USB PD 3.1 Extended Power Range (EPR) applications.

Key Points: 
  • Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of discrete power devices, wide bandgap power devices, power management ICs, and modules, today announced its AONZ66412 XSPairFET™ MOSFET designed for Buck-Boost converters in USB PD 3.1 Extended Power Range (EPR) applications.
  • The USB PD 3.1 EPR increases the USB-C maximum power up to 240W.
  • These benefits make the AONZ66412 ideal for buck-boost converters in Type-C USB 3.1 EPR applications, including notebook, USB hub, and power bank designs.
  • AONZ66412 has been tested to achieve 97% efficiency @1MHz in typical USB PD 3.1 EPR conditions of 28V input, 17.6V output, and 8A load conditions.

At APEC 2024, Alpha and Omega Semiconductor to Display and Demo its Industry-Leading Power Management Solutions

Retrieved on: 
Thursday, February 22, 2024
Batteries, Hardware, EV, Electric Vehicles, Automotive, Consumer Electronics, Technology, Semiconductor, Other Technology, MOSFET, DC-DC, Intel, Silicon carbide, Mega, NVIDIA, Socs, AEC, APEC, Swap (finance), AOS, ICS, CPU, PC, Conference, BMS, Solar inverter, Universal, AMD, EMI, BLDC, RC, Kyōto Station, Electronics

Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules will showcase its complete line of advanced power management solutions at the Applied Power Electronics Conference (APEC).

Key Points: 
  • Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules will showcase its complete line of advanced power management solutions at the Applied Power Electronics Conference (APEC).
  • The new products are designed to meet key power management challenges in several key application areas and markets AOS focuses on.
  • When paired with AOS’ industry-leading power stages, AOS controllers offer a complete Vcore solution to power next-generation chipset-based SoCs.
  • Motor Drives: AOS introduces a new range of 60V and 100V drivers for power tools, outdoor garden equipment, and e-mobility applications.

Alpha and Omega Semiconductor Announces Application-Specific EZBuck™ Regulator to Power Intel Meteor Lake and Arrow Lake Platforms

Retrieved on: 
Thursday, February 22, 2024
Semiconductor, Other Energy, Apps, Applications, Technology, Other Technology, Energy, Hardware, SCP, OVP, Intel, Multimedia, Silicon, AOS, ICS, Platform, PCB, Telescopic sight

The AOZ22559QI and AOZ22539QI Constant On-Time Buck Converters are offered in a QFN 4 x 4 package, which is the industry’s most compact footprint and is designed to support VCCPRIM_VNNAON rails in Intel Meteor Lake and Arrow Lake platforms.

Key Points: 
  • The AOZ22559QI and AOZ22539QI Constant On-Time Buck Converters are offered in a QFN 4 x 4 package, which is the industry’s most compact footprint and is designed to support VCCPRIM_VNNAON rails in Intel Meteor Lake and Arrow Lake platforms.
  • View the full release here: https://www.businesswire.com/news/home/20240222206409/en/
    AOZ22559QI and AOZ22539QI Constant On-Time Buck Converters Provide Highest Power Density Solution for Intel Meteor Lake and Arrow Lake CPU VCCPRIM_VNNAON Rails (Graphic: Business Wire)
    Intel’s Meteor Lake and Arrow Lake platforms require VCCPRIM_VNNAON rails with high currents, whereas supporting power implementations typically require either a controller with external discrete power FETs or a converter with a large package.
  • The AOZ22559QI and AOZ22539QI include features specifically designed to meet the specifications of the Intel Meteor Lake and Arrow Lake platforms.
  • “The AOZ22559QI and AOZ22539QI offer designers an easy-to-use high-current solution for VCCPRIM_VNNAON rails, providing optimal power support for the Intel Meteor Lake and Arrow Lake platforms.

Alpha and Omega Semiconductor Launches 3-Phase Driver IC, Increasing Battery Life of Cordless Power Tools and E-Mobility

Retrieved on: 
Tuesday, February 20, 2024
Semiconductor, Hardware, Batteries, Consumer Electronics, Technology, MOSFET, PB, Multimedia, Temperature, AOS, ICS, QFN, BOM, BLDC, PCB, Brushless DC electric motor, Electric motor

Available in a compact, 4mm x 4mm QFN-28L package, the highly integrated AOZ32063MQV is a 3-phase driver IC that offers superior driving ability, programmable deadtime, and sleep mode support.

Key Points: 
  • Available in a compact, 4mm x 4mm QFN-28L package, the highly integrated AOZ32063MQV is a 3-phase driver IC that offers superior driving ability, programmable deadtime, and sleep mode support.
  • These capabilities deliver high motor operation efficiency and low standby power consumption that can help greatly increase the battery life of cordless power tools and e-mobility applications.
  • The AOZ32063MQV is also an optimal driver IC solution for 3-phase Brushless DC (BLDC) motor drives.
  • AOS products are offered in packages with Pb-free plating and are compliant with RoHS standards.

Alpha and Omega Semiconductor Announces Innovatively Designed Double-Sided Cooling DFN 5x6 Package

Retrieved on: 
Wednesday, January 24, 2024
Electronic Design Automation, Semiconductor, Consumer Electronics, Technology, Other Technology, Telecommunications, Hardware, AOS, PCB, Temperature, MOSFET, Multimedia, Peter H. Wilson, DFN, FOM, Power, ICS, Printed circuit board

Designers have long trusted AOS power semiconductors as essential components that help them meet a wide variety of high-performance application requirements.

Key Points: 
  • Designers have long trusted AOS power semiconductors as essential components that help them meet a wide variety of high-performance application requirements.
  • AOS’ new top and bottom cooling DFN 5x6 package is designed to achieve the highest heat transfer between the exposed top contact and heat sink due to its large surface contact area construction.
  • The top exposed DFN 5x6 package of the AONA66916 shares the same 5mm x 6mm footprint as AOS’ standard DFN 5x6 package, eliminating the need to modify existing PCB layouts.
  • “Cooling the power MOSFET in high power design can be challenging, and AOS has successfully addressed this essential issue with our advanced top exposed package design.

Alpha and Omega Semiconductor Releases αMOS5™ 600V FRD 95mohm and 125mohm Super Junction MOSFET

Retrieved on: 
Wednesday, January 3, 2024
Technology, EV, Electric Vehicles, Semiconductor, Automotive, Other Energy, Telecommunications, Alternative Energy, Energy, Batteries, Hardware, ICS, H-4, PSFB, AC, Multimedia, Power inverter, HV, MOSFET, SMPS, ESS, FRD, Light, PFC, AOS

High Voltage Super Junction MOSFETs are the dominant choice for topologies such as single/interleaved/dual boost/CrCM TP PFCs, LLC, PSFB, multi-level NPC/ANPC and so forth.

Key Points: 
  • High Voltage Super Junction MOSFETs are the dominant choice for topologies such as single/interleaved/dual boost/CrCM TP PFCs, LLC, PSFB, multi-level NPC/ANPC and so forth.
  • αMOS5™ has been the leading High Voltage Super Junction solution tailored for fast switching, ease-of-use and robustness in mission-critical applications.
  • The two products released, the AOK095A60FD (TO-247) and AOTF125A60FDL (TO-220F), are 600V FRD FETs with 95mohm and 125mohm maximum Rdson, respectively.
  • The AOK095A60FD (600V 95mohm TO-247) is immediately available in production quantities with a lead time of 16 weeks.

Alpha and Omega Semiconductor Announces Automotive Grade 80V and 100V MOSFETs in TO-Leadless Packaging Technology for e-Mobility

Retrieved on: 
Wednesday, December 13, 2023
Batteries, Hardware, EV, Electric Vehicles, Automotive, Consumer Electronics, Technology, Vehicle Technology, Semiconductor, BLDC, EMI, IATF 16949, PPAP, Multimedia, AOS, Metal electrode leadless face, AOI, IATF, ICS, MOSFET, D2PAK, Peter H. Wilson, Electric power, Printed circuit board, Alpha

This new package helps designers meet the ongoing trend to electrify vehicles with the latest battery technology to meet clean energy zero-emission goals.

Key Points: 
  • This new package helps designers meet the ongoing trend to electrify vehicles with the latest battery technology to meet clean energy zero-emission goals.
  • These capabilities make AOS 80V and 100V MOSFETs ideally suited for automotive BLDC motor and battery management applications for e-mobility.
  • View the full release here: https://www.businesswire.com/news/home/20231213534372/en/
    Automotive Grade 80V and 100V MOSFETs in TOLL Packaging Technology (Graphic: Business Wire)
    The AOS automotive TOLL package is designed to achieve the highest current capability using AOS’s innovative approach which utilizes advanced clip technology to achieve a high in-rush current rating.
  • “Using the AOS Automotive TOLL package with clip technology offers significant performance improvements in a robust package.

Alpha and Omega Semiconductor Announces Ultra-Low Reverse Working Voltage TVS Diode for USB4 and Thunderbolt 4 ESD Protection

Retrieved on: 
Wednesday, September 20, 2023
Technology, Hardware, Electronic Design Automation, Semiconductor, Failure, Thunderbolt (interface), USB, IC, Multimedia, VBR, ICS, HDMI, SMD, AOS, FOM, USB4, TVS, ESD, Electronics, Printed circuit board, Alpha, Thunderbolt

Designed to deliver extremely low capacitance and fast response time, the AOZ8S207BLS-01 TVS diode offers superior high-speed data line protection based on AOS’ advanced Ultra-Low Breakdown Voltage (VBR) TVS platform and innovative packaging.

Key Points: 
  • Designed to deliver extremely low capacitance and fast response time, the AOZ8S207BLS-01 TVS diode offers superior high-speed data line protection based on AOS’ advanced Ultra-Low Breakdown Voltage (VBR) TVS platform and innovative packaging.
  • These features, along with the TVS diode’s 0.15pf capacitance, make it ideal for USB4 and Thunderbolt 4 electrostatic discharge (ESD) protection.
  • View the full release here: https://www.businesswire.com/news/home/20230920833080/en/
    Ultra-Low Reverse Working Voltage TVS Diode for USB4 and Thunderbolt 4 ESD Protection (Graphic: Business Wire)
    Low breakdown voltage is essential for ESD protection devices, especially when protecting ICs manufactured with the finest process.
  • This feature-rich TVS diode makes an excellent solution for high-speed data line protection,” said Charles Chen, Marketing Director at AOS.

Alpha and Omega Semiconductor Introduces MRigidCSP™ Package Technology Strengthening its Battery Management MOSFETs

Retrieved on: 
Tuesday, August 29, 2023
Electronic Design Automation, Semiconductor, Consumer Electronics, Technology, Batteries, Hardware, Peter H. Wilson, WL, Failure, Senior, Multimedia, ICS, AOS, Tablet, MOSFET, PCB, ESD, CSP, Safety, Alpha

Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of power discretes, ICs, modules, and digital power solutions, today introduced the company’s MRigidCSP™ packaging technology for battery management applications.

Key Points: 
  • Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of power discretes, ICs, modules, and digital power solutions, today introduced the company’s MRigidCSP™ packaging technology for battery management applications.
  • AOS’ more robust package technology is particularly suited to battery applications in smartphones, tablets, and ultra-thin notebooks.
  • View the full release here: https://www.businesswire.com/news/home/20230829961898/en/
    AOS introduces MRigidCSP™ package technology for battery management applications (Graphic: Business Wire)
    Fast charging, which requires lower power loss in the battery management circuit, is now widely adopted for portable devices.
  • AOS designed the MRigidCSP package technology to be used with high-aspect ratio CSP die sizes, helping to alleviate one of the major causes of battery management application production problems.