Microchip Technology

Microchip Technology to Present at the Raymond James Instutional Investors Conference

Retrieved on: 
Monday, March 4, 2024
CFO, Senior, Microchip Technology, Integrated circuit, Raymond James Financial, Risk, Conference, Eastern Time Zone, Mobile phone

CHANDLER, Ariz., March 04, 2024 (GLOBE NEWSWIRE) -- (NASDAQ:MCHP) – Microchip Technology Incorporated, a leading provider of smart, connected, and secure embedded control solutions, today announced that the Company will present at the Raymond James Institutional Investor Conference on Wednesday, March 6, 2024 at 9:15 a.m. (Eastern Time).

Key Points: 
  • CHANDLER, Ariz., March 04, 2024 (GLOBE NEWSWIRE) -- (NASDAQ:MCHP) – Microchip Technology Incorporated, a leading provider of smart, connected, and secure embedded control solutions, today announced that the Company will present at the Raymond James Institutional Investor Conference on Wednesday, March 6, 2024 at 9:15 a.m. (Eastern Time).
  • A live webcast of the presentation will be made available by Raymond James, and can be accessed on the Microchip website at www.microchip.com .
  • Microchip Technology Incorporated is a leading provider of smart, connected and secure embedded control solutions.
  • Note: The Microchip name and logo are registered trademarks of Microchip Technology Inc. in the USA and other countries.

Microchip Technology to Present at the Morgan Stanley Technology, Media & Telecom Conference

Retrieved on: 
Monday, March 4, 2024
Microchip Technology, Pacific Ocean, Integrated circuit, Risk, Conference, Morgan Stanley, Pacific Time Zone, Mobile phone

CHANDLER, Ariz., March 04, 2024 (GLOBE NEWSWIRE) -- Microchip Technology Incorporated, a leading provider of smart, connected, and secure embedded control solutions, today announced that the Company will present at the Morgan Stanley Technology, Media & Telecom Conference on Wednesday, March 6, 2024 at 3:35 p.m. (Pacific Time).

Key Points: 
  • CHANDLER, Ariz., March 04, 2024 (GLOBE NEWSWIRE) -- Microchip Technology Incorporated, a leading provider of smart, connected, and secure embedded control solutions, today announced that the Company will present at the Morgan Stanley Technology, Media & Telecom Conference on Wednesday, March 6, 2024 at 3:35 p.m. (Pacific Time).
  • A live webcast of the presentation will be made available by Morgan Stanley, and can be accessed on the Microchip website at www.microchip.com .
  • Microchip Technology Incorporated is a leading provider of smart, connected and secure embedded control solutions.
  • Note: The Microchip name and logo are registered trademarks of Microchip Technology Inc. in the USA and other countries.

Microchip Launches New dsPIC® DSC-Based Integrated Motor Drivers that Bring Controllers, Gate Drivers and Communications to a Single Device

Retrieved on: 
Monday, February 26, 2024
AC/DC, LDO, Simulink, Tiantong (Satellite), Torque, USB, MOSFET, MCAF, Microcontroller, Integrated circuit, GUI, MCSK, BOM, FD, MCU, Ecosystem, FOC, BLDC, VDC, Microchip Technology, DSC, Digital signal controller, DIM, PCB, MCHP, Hertz, CPU, Electric motor

“By integrating multiple device functions into one chip, the dsPIC DSC-based integrated motor drivers can reduce system-level costs and board space.”

Key Points: 
  • “By integrating multiple device functions into one chip, the dsPIC DSC-based integrated motor drivers can reduce system-level costs and board space.”
    The integrated motor driver devices can be powered by a single power supply up to 29V (operation) and 40V (transient).
  • Operating between 70—100 MHz, the dsPIC DSC-based integrated motor drivers provide high CPU performance and can support efficient deployment of FOC and other advanced motor control algorithms.
  • To learn more about Microchip’s growing portfolio of integrated motor drivers visit the dsPIC DSC-Based integrated motor drivers webpage.
  • The MCSK includes a dsPIC33CK low-voltage motor control development board, a 24V three-phase BLDC motor, an AC/DC adapter, a USB cable and other accessories.

Microchip Expands its mSiC™ Solutions with the 3.3 kV XIFM Plug-and-Play mSiC Gate Driver to Accelerate the Adoption of High-Voltage SiC Power Modules

Retrieved on: 
Tuesday, February 20, 2024
Silicon, Temperature, Transport, Integrated circuit, Silicon carbide, UVLO, NTC, Microchip Technology, MCHP, KV

To speed time to market, the complex development work of designing, testing and qualifying a gate driver circuit design is already completed with this plug-and-play solution.

Key Points: 
  • To speed time to market, the complex development work of designing, testing and qualifying a gate driver circuit design is already completed with this plug-and-play solution.
  • The XIFM digital gate driver is a compact solution that features digital control, an integrated power supply and a robust fiber-optic interface that improves noise immunity.
  • This gate driver has preconfigured “turn-on/off” gate drive profiles that are tailored to optimize module performance.
  • The 3.3 kV XIFM plug-and-play mSiC gate driver is now available for purchase.

IoT Chips Market to Reach $ 1.7 Trillion, Globally, by 2032 at 14.3% CAGR: Allied Market Research

Retrieved on: 
Friday, March 8, 2024
Internet, Sensor, Investment, Internet of things, Electronics, Microchip Technology, Intel, Qualcomm, Customization, IOT, Video game

WILMINGTON, Del., March 8, 2024 /PRNewswire/ -- Allied Market Research published a report, titled, "IoT Chips Market by Hardware (Processor, Sensor, Connectivity IC, Memory Device, Logic Device, and Others) and Industry Vertical (Healthcare, Consumer Electronics, Industrial, Automotive, Banking Financial Services & Insurance, Retail, and Others): Global Opportunity Analysis and Industry Forecast, 2023-2032." According to the report, the global IOT chips market was valued at $432 billion in 2022, and is projected to reach $1.7 trillion by 2032, growing at a CAGR of 14.3% from 2023 to 2032.

Key Points: 
  • However, the Sensor segment is projected to manifest the highest CAGR of 16.55% from 2023 to 2032.
  • Get Customized Reports with your Requirements:
    Request Customization - IoT Chips Market by Hardware, by Industry Vertical : Global Opportunity Analysis and Industry Forecast, 2023-2032
    The industry segment to maintain its leadership status throughout the forecast period.
  • However, Asia-Pacific is projected to manifest the highest CAGR of 15.70% from 2023 to 2032.
  • In June 2021, Qualcomm launched seven of its new IoT chipsets that were targeted at devices meant for logistics, warehousing, smart cameras, video collaboration, and retail.

IoT Chips Market to Reach $ 1.7 Trillion, Globally, by 2032 at 14.3% CAGR: Allied Market Research

Retrieved on: 
Friday, March 8, 2024
Internet, Sensor, Investment, Internet of things, Electronics, Microchip Technology, Intel, Qualcomm, Customization, IOT, Video game

WILMINGTON, Del., March 8, 2024 /PRNewswire/ -- Allied Market Research published a report, titled, "IoT Chips Market by Hardware (Processor, Sensor, Connectivity IC, Memory Device, Logic Device, and Others) and Industry Vertical (Healthcare, Consumer Electronics, Industrial, Automotive, Banking Financial Services & Insurance, Retail, and Others): Global Opportunity Analysis and Industry Forecast, 2023-2032." According to the report, the global IOT chips market was valued at $432 billion in 2022, and is projected to reach $1.7 trillion by 2032, growing at a CAGR of 14.3% from 2023 to 2032.

Key Points: 
  • However, the Sensor segment is projected to manifest the highest CAGR of 16.55% from 2023 to 2032.
  • Get Customized Reports with your Requirements:
    Request Customization - IoT Chips Market by Hardware, by Industry Vertical : Global Opportunity Analysis and Industry Forecast, 2023-2032
    The industry segment to maintain its leadership status throughout the forecast period.
  • However, Asia-Pacific is projected to manifest the highest CAGR of 15.70% from 2023 to 2032.
  • In June 2021, Qualcomm launched seven of its new IoT chipsets that were targeted at devices meant for logistics, warehousing, smart cameras, video collaboration, and retail.

Radiation Hardened Electronics Market worth $2.1 billion by 2029 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Wednesday, March 6, 2024
Mercury Systems, SRAM, Microchip Technology, FD-SOI, Renesas Electronics, PCB Piezotronics, Integrated circuit, Organization, BFSI, Transport, FPGA, Analog Devices, Architecture, Configuration, Hardware, Memory, USB flash drive, Electronics, Defense, GSI, AMD, DSP, RF, ROW, SSD, Telecommunications, Teledyne Technologies, Infineon Technologies, External, Radiation, MCU, SOI, Texas Instruments, Operating system, Honeywell, Middleware, Silicon, BAE Systems, GCC, Deployment, ASIC, STMicroelectronics, Data center, COVID-19, MPU, Internal, Consumer electronics

Mixed-signal ICs component to hold the significant market size of radiation-hardened electronics industry during the forecast period.

Key Points: 
  • Mixed-signal ICs component to hold the significant market size of radiation-hardened electronics industry during the forecast period.
  • Analog devices play a crucial role in the semiconductor industry, where analog-to-digital conversion is extensively required in microcontrollers and signal processing.
  • The system can be implemented as a hybrid microcircuit, a single IC chip, or a printed circuit board.
  • For use in space and other related applications, these devices need to be hardened against the effects of radiation in digital and analog circuits.

Radiation Hardened Electronics Market worth $2.1 billion by 2029 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Wednesday, March 6, 2024
Mercury Systems, SRAM, Microchip Technology, FD-SOI, Renesas Electronics, PCB Piezotronics, Integrated circuit, Organization, BFSI, Transport, FPGA, Analog Devices, Architecture, Configuration, Hardware, Memory, USB flash drive, Electronics, Defense, GSI, AMD, DSP, RF, ROW, SSD, Telecommunications, Teledyne Technologies, Infineon Technologies, External, Radiation, MCU, SOI, Texas Instruments, Operating system, Honeywell, Middleware, Silicon, BAE Systems, GCC, Deployment, ASIC, STMicroelectronics, Data center, COVID-19, MPU, Internal, Consumer electronics

Mixed-signal ICs component to hold the significant market size of radiation-hardened electronics industry during the forecast period.

Key Points: 
  • Mixed-signal ICs component to hold the significant market size of radiation-hardened electronics industry during the forecast period.
  • Analog devices play a crucial role in the semiconductor industry, where analog-to-digital conversion is extensively required in microcontrollers and signal processing.
  • The system can be implemented as a hybrid microcircuit, a single IC chip, or a printed circuit board.
  • For use in space and other related applications, these devices need to be hardened against the effects of radiation in digital and analog circuits.

Microchip’s Low-Cost PolarFire® SoC Discovery Kit Makes RISC-V® and FPGA Design More Accessible for a Wider Range of Embedded Engineers

Retrieved on: 
Thursday, February 15, 2024
ISA, FP5, Student, Silicon, MIPI, Marketing, Growth, Integrated circuit, SPI, Curriculum, Learning, ASU, AMP, University, Engineering, Microchip Technology, Arizona State University, Click, MCHP, I2C, FPGA, CPU, Video game

To fill this gap and help empower innovation, Microchip Technology (Nasdaq: MCHP) has launched the PolarFire® SoC Discovery Kit .

Key Points: 
  • To fill this gap and help empower innovation, Microchip Technology (Nasdaq: MCHP) has launched the PolarFire® SoC Discovery Kit .
  • By offering a user-friendly, feature-rich development kit for embedded processing and compute acceleration, Microchip is making emerging technology more accessible to engineers at all levels.
  • This full-featured, yet low-cost kit allows rapid testing of application concepts, developing firmware applications, programming and debugging user code.
  • The PolarFire SoC Discovery Kit is available starting at $132 for the general public and only $99 through Microchip’s Academic Program.

TimeProvider® 4500 Series is the Industry’s First Grandmaster to Provide High-Speed Network Interfaces up to 25 Gbps

Retrieved on: 
Wednesday, February 14, 2024
Regeneration, GNSS, Investment, Transport, Data-rate units, Integrated circuit, 5G, Precision Time Protocol, GUI, PTP, GPS, Satellite navigation, QZSS, Microchip Technology, FCAPS, MCHP, GALILEO, Security, Video game

Depending on the specific sites, the grandmaster could serve very few or a large number of gNodeB base stations.

Key Points: 
  • Depending on the specific sites, the grandmaster could serve very few or a large number of gNodeB base stations.
  • The TimeProvider 4500 grandmaster offers the flexibility to connect to various generations of network elements, which helps to preserve operators’ infrastructure investments.
  • The TimeProvider 4500 clock is the first 1588 grandmaster with 25 Gbps support.
  • A customer can connect the TimeProvider 4500 clock to various network devices using a choice of 1 Gbps, 10 Gbps or 25 Gbps network links.