Nordic Semiconductor

GlobalFoundries Unveils Power-Efficient Advancements to 22FDX® Platform at Annual Tech Summit

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Wednesday, September 27, 2023
OIC Science and Technology Summit, Life, Noise, Internet of things, GlobalFoundries, EVP, Temperature, SOC, Bluetooth Low Energy, GFS, SRAM, Radio, Nordic Semiconductor, GF, Safety, Mobile phone, Nordic

MUNICH, Germany, Sept. 27, 2023 (GLOBE NEWSWIRE) -- Today at its annual Technology Summit in Europe, GlobalFoundries (GF) (Nasdaq: GFS) announced advancements to its industry-leading 22FDX® (22nm FD-SOI) platform, introducing a suite of innovative features and enhancements.

Key Points: 
  • MUNICH, Germany, Sept. 27, 2023 (GLOBE NEWSWIRE) -- Today at its annual Technology Summit in Europe, GlobalFoundries (GF) (Nasdaq: GFS) announced advancements to its industry-leading 22FDX® (22nm FD-SOI) platform, introducing a suite of innovative features and enhancements.
  • These enhancements represent a strategic response to the growing demand for better power efficiency and top-tier performance in both IoT and automotive applications.
  • The new features include ultra-low power memory, designed to operate with exceptional energy efficiency, even in the most power-sensitive environments.
  • The technology also offers optimized energy management, allowing for intelligent power consumption and improved battery life in a variety of devices.

Laird Connectivity Combines Bluetooth LE and Ultra-Wideband (UWB) in a Seamless Solution for Proximity and Pinpoint Accuracy with the Sera NX040

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Thursday, September 21, 2023
MCU, CE, MIC, FCC, Internet of things, BOM, Seraing, UWB, Wireless, SOC, Bluetooth Low Energy, UKCA, Nordic Semiconductor, Bluetooth Special Interest Group, ISED, Command, Architecture, Sera, Silicon, LE, NXP, Memory, SDK, Software, Satellite navigation device

AKRON, Ohio, Sept. 21, 2023 /PRNewswire/ -- Laird Connectivity, a global leader in wireless technology, today announces the upcoming Sera NX040 ultra-wideband (UWB) and Bluetooth Low Energy (LE) product range. This lineup of new UWB modules seamlessly integrates the cutting edge Trimension™ SR040 chipset UWB silicon from NXP with the processing and Bluetooth LE capabilities of Nordic Semiconductor's nRF52833 system-on-chip (SoC). This innovative combination, paired with Laird Connectivity's added value hardware, software, and services, brings new possibilities for UWB to grow beyond consumer and automotive segments into mainstream IoT devices.

Key Points: 
  • The Sera NX040 module is a UWB tag solution that allows developers to deliver granular locationing and positioning that yields much higher accuracy compared to RSSI-only proximity applications in industrial and medical environments.
  • "The Sera NX040 is our flagship solution for UWB-based designs," says Jonathan Kaye, VP Product Management, Laird Connectivity.
  • The Sera NX040 provides real added value hardware and software capabilities to accelerate the development of UWB/Bluetooth LE applications.
  • For more information about the Sera NX040, visit: www.lairdconnect.com/sera-nx040-series
    To learn more about Laird Connectivity, visit: www.lairdconnect.com

Competition Remains Fierce in the Wireless IoT Connectivity Market as LPWA Networks Reach 5.3 Billion Connections in 2030

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Wednesday, September 20, 2023
SRW, IEEE 802.11ah, Bluetooth Low Energy, Wi-Fi, LPWAN, BLE, NR, Internet of things, Sierra Wireless, Research, History, LoRa, Bluetooth, Wi-Fi Alliance, Texas Instruments, Nordic Semiconductor, LPWA, Device, ZETA, Mobile phone

According to global intelligence firm ABI Research, Low-Power Wide Area Networks (LPWAN) will reach 5.3 billion connections in 2030.

Key Points: 
  • According to global intelligence firm ABI Research, Low-Power Wide Area Networks (LPWAN) will reach 5.3 billion connections in 2030.
  • But regardless of technology, LPWA solutions are increasingly confronted with complexity concerns as IoT users demand user-friendly, end-to-end IoT systems.
  • Though the wireless IoT networking market has a history of intense competition, trends in hybrid use cases suggest some IoT vendors are leaning toward collaboration.
  • These findings are from ABI Research's Connecting the IoT: Wide-Area and Short-Range Wireless Technologies Market Analysis application analysis report.

Competition Remains Fierce in the Wireless IoT Connectivity Market as LPWA Networks Reach 5.3 Billion Connections in 2030

Retrieved on: 
Wednesday, September 20, 2023
SRW, IEEE 802.11ah, Bluetooth Low Energy, Wi-Fi, LPWAN, BLE, NR, Internet of things, Sierra Wireless, Research, History, LoRa, Bluetooth, Wi-Fi Alliance, Texas Instruments, Nordic Semiconductor, LPWA, Device, ZETA, Mobile phone

According to global intelligence firm ABI Research, Low-Power Wide Area Networks (LPWAN) will reach 5.3 billion connections in 2030.

Key Points: 
  • According to global intelligence firm ABI Research, Low-Power Wide Area Networks (LPWAN) will reach 5.3 billion connections in 2030.
  • But regardless of technology, LPWA solutions are increasingly confronted with complexity concerns as IoT users demand user-friendly, end-to-end IoT systems.
  • Though the wireless IoT networking market has a history of intense competition, trends in hybrid use cases suggest some IoT vendors are leaning toward collaboration.
  • These findings are from ABI Research's Connecting the IoT: Wide-Area and Short-Range Wireless Technologies Market Analysis application analysis report.

Laird Connectivity and Wirepas Enter Partnership to Broaden Massive IoT Implementations on Bluetooth Low Energy (LE) Devices

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Tuesday, September 12, 2023
Partnership, Silicon Labs, Internet of things, Wireless, DVK, Bluetooth Low Energy, Silicon, Bluetooth, Nordic Semiconductor, Laird, LE, RF, Software, Mobile phone, Mary Wirepa

AKRON, Ohio, Sept. 12, 2023 /PRNewswire/ -- Laird Connectivity, a global leader in wireless technology, and Wirepas, a leading provider of mesh connectivity, today announced they have joined forces to deliver combined hardware and software solutions connecting Bluetooth Low Energy (LE) modules for massive IoT implementations.

Key Points: 
  • "Together, Wirepas and Laird Connectivity solve a pressing problem for industrial-grade IoT: how to wirelessly connect billions of devices with diverse and evolving network requirements," said Teppo Hemiä, CEO of Wirepas.
  • Detailed applications notes and sample applications for use with these modules are available from the Laird Connectivity Wirepas partner page.
  • Laird Connectivity offers Wirepas evaluation versions of the standard development kits (DVK) for each module that are pre-programed with licensed Wirepas keys.
  • To find out how to receive a preprogrammed DVK for testing, or for more information about the Wirepas & Laird Connectivity partnership, visit: https:/lairdconnect.com/partners/technology/wirepas

Power Management IC Market to Grow by USD 9.309 billion from 2022 to 2027 | Growing trend of smart buildings drives the market growth - Technavio

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Saturday, September 2, 2023
Sample, Semtech, ABB, Vishay Intertechnology, Telecom, NXP Semiconductors, ROHM, Big data, Infineon Technologies, Semiconductor industry, Qualcomm, STMicroelectronics, Electronics, Onsemi, Automotive industry, Microchip Technology, Allegro, Mitsubishi Electric, Collection, Investment, Monolithic Power Systems, Consumer, Qorvo, Nordic Semiconductor, Transport, Analog Devices, Texas Instruments, Consumer electronics, Retail, Geography

NEW YORK, Sept. 2, 2023 /PRNewswire/ -- The power management IC market size is estimated to grow by USD 9.309 billion from 2022 to 2027.

Key Points: 
  • NEW YORK, Sept. 2, 2023 /PRNewswire/ -- The power management IC market size is estimated to grow by USD 9.309 billion from 2022 to 2027.
  • The increasing trend of smart building drives the power management IC market growth during the forecast period.
  • The main advantage of power management IC is that it enables the collection of big data and processing it into actionable insights.
  • The increasing developments in the power management IC industry is an emerging trend in the market during the forecast period.

indie Semiconductor Extends Radar Leadership with World’s First 240 GHz Silicon Transceiver

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Monday, August 28, 2023
Semiconductor, Vehicle Technology, Technology, Automotive, Software, Gulden, Okinawa Autotech, Hertz, Electronics, Radar, RFE, Nordic Semiconductor, Euro, Silicon, SVP, Safety, Television, Internet service provider, EU

indie Semiconductor (Nasdaq: INDI), an Autotech solutions innovator, has launched the world’s first commercial fully integrated 240 GHz radar front-end (RFE) silicon transceiver.

Key Points: 
  • indie Semiconductor (Nasdaq: INDI), an Autotech solutions innovator, has launched the world’s first commercial fully integrated 240 GHz radar front-end (RFE) silicon transceiver.
  • This device builds upon the success of indie’s previously released 120 GHz solution, expanding the Company’s portfolio of short-range, high precision and high resolution terahertz frequency radar solutions.
  • "The launch of our 240 GHz transceiver solution marks a significant leap forward in radar technology," Dr. Peter Gulden, SVP of indie Semiconductor's Radar Systems and Software.
  • The TRA240091 is a cascadable radar front-end with an operating bandwidth of up to 45 GHz at 240 GHz.

Seamless Connectivity Drives Global Bluetooth 5.0 Market: Expected to Reach $8.25 Billion by 2028 - ResearchAndMarkets.com

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Tuesday, August 15, 2023
Software, Mobile, Wireless, Networks, Internet, Hardware, Data Management, Consumer Electronics, IOT (Internet of Things), Technology, Audio, Video, Wearables, Mobile Technology, Telecommunications, Bluetooth Low Energy, Communication, NXP Semiconductors, BLE, Internet of things, Broadcom Inc., Microchip Technology, Tablet, Qualcomm, Investment, Bluetooth, Nordic Semiconductor, Ecosystem, Bluetooth mesh networking, Silicon Labs, Population growth, Consumer electronics, Mobile phone

Bluetooth 5.0 Revolutionizing Wireless Communication:

Key Points: 
  • Bluetooth 5.0 Revolutionizing Wireless Communication:
    Bluetooth is a wireless communication technology enabling seamless connectivity between electronic devices without the need for cables or wires.
  • In 2022, the global Bluetooth 5.0 market was valued at US$4.01 billion and is projected to reach US$8.25 billion by 2028.
  • The growing preference for wireless connectivity and seamless integration among devices has fueled demand for Bluetooth 5.0-enabled products.
  • Bluetooth 5.0 also supports multi-device connectivity, enabling users to stream audio to multiple speakers or headphones simultaneously, enhancing the user experience.

FREYR Battery Announces Appointments to Senior Management and Board of Directors

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Thursday, August 10, 2023
Technology, Environment, Sustainability, Batteries, Alternative Energy, Energy, Online, Intelligence, ASA, Operation, Microsystems Software, Inc. v. Scandinavia Online AB, NTNU, Schibsted, Innovation system, Microsoft, MBA, McKinsey & Company, SMB, Security, WW, Partner, INSEAD, Nordea, Battery, Distribution, Chairperson, Nordic Semiconductor, MSFT, Growth, Norwegian Institute of Technology, NYSE, Automation, Management, Parallels, Birger, Atlantic Ocean

FREYR Battery (NYSE: FREY) (“FREYR”), a developer of clean, next-generation battery cell production capacity, has announced two appointments to strengthen the company’s leadership capabilities and accelerate key strategic initiatives.

Key Points: 
  • FREYR Battery (NYSE: FREY) (“FREYR”), a developer of clean, next-generation battery cell production capacity, has announced two appointments to strengthen the company’s leadership capabilities and accelerate key strategic initiatives.
  • The appointments to the senior management and Board of Directors, are as follows:
    Birger Steen, currently Board Chair of Nordic Semiconductor ASA and Pagero AB, has been appointed FREYR’s Chief Executive Officer effective as of August 21st and to the Board of Directors, effective August 9th.
  • Torstein Dale Sjøtveit, FREYR’s Founder and Executive Chair, has retired, effective August 9th.
  • “At FREYR, our Board of Directors and senior management are determined to push the frontiers of innovation and apply new technologies to next-generation battery manufacturing.

Leading Semiconductor Industry Players Join Forces to Accelerate RISC-V

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Friday, August 4, 2023
Product management, NXP Semiconductors, Semiconductor, Qualcomm, EU, Joint Artificial Intelligence Center, Senior, Electronics, Internet of things, Nordic, Wireless, Multimedia, Central processing unit, IP, Nordic Semiconductor, Architecture, Knowledge, Ecosystem, NXP, ARIC, Video game, Management, Cryptocurrency, Infineon Technologies

BERLIN, Aug. 4, 2023 /PRNewswire/ -- Semiconductor industry players Robert Bosch GmbH, Infineon Technologies AG, Nordic Semiconductor, NXP® Semiconductors, and Qualcomm Technologies, Inc., have come together to jointly invest in a company aimed at advancing the adoption of RISC-V globally by enabling next-generation hardware development.

Key Points: 
  • Formed in Germany, this company will aim to accelerate the commercialization of future products based on the open-source RISC-V architecture.
  • The company will be a single source to enable compatible RISC-V based products, provide reference architectures, and help establish solutions widely used in the industry.
  • The company calls on industry associations, leaders, and governments, to join forces in support of this initiative which will help increase the resilience of the broader semiconductor ecosystem.
  • "We are excited to come together with other industry players to drive the expansion of the RISC-V ecosystem through development of next-generation hardware.