Microelectronics

JCET Accelerates Technology Upgrades and Transformation in 2022, Maintaining a Leading Edge in High Value-added Applications

Retrieved on: 
Thursday, March 30, 2023

SHANGHAI, March 30, 2023 /PRNewswire/ -- JCET Group (SSE: 600584), a leading global provider of integrated circuit (IC) manufacturing and technology services, today announced its full year financial results for the year ended December 31, 2022. According to the financial report, in 2022 JCET achieved revenue of RMB 33.76 billion, an increase of 10.7% year-on-year, and net profit attributable to owners of the parent of RMB 3.23 billion, an increase of 9.2% year-on-year.

Key Points: 
  • With net capex investments of RMB 1.24 billion, free cash flow for the quarter was RMB 0.39 billion.
  • Full Year 2022 Financial Highlights:
    Revenue was RMB 33.76 billion, an increase of 10.7% year-on-year.
  • The company's XDFOI™ high-density multi-dimensional heterogeneous integration chiplet technologies have entered the stage of high volume manufacturing (HVM).
  • During the reporting period, the profit and revenue contributed by high-performance, high-density system-level packaging technology and fan-out wafer-level packaging technology showed solid growth year-on-year.

JCET Accelerates Technology Upgrades and Transformation in 2022, Maintaining a Leading Edge in High Value-added Applications

Retrieved on: 
Thursday, March 30, 2023

SHANGHAI, March 30, 2023 /PRNewswire/ -- JCET Group (SSE: 600584), a leading global provider of integrated circuit (IC) manufacturing and technology services, today announced its full year financial results for the year ended December 31, 2022. According to the financial report, in 2022 JCET achieved revenue of RMB 33.76 billion, an increase of 10.7% year-on-year, and net profit attributable to owners of the parent of RMB 3.23 billion, an increase of 9.2% year-on-year.

Key Points: 
  • With net capex investments of RMB 1.24 billion, free cash flow for the quarter was RMB 0.39 billion.
  • Full Year 2022 Financial Highlights:
    Revenue was RMB 33.76 billion, an increase of 10.7% year-on-year.
  • The company's XDFOI™ high-density multi-dimensional heterogeneous integration chiplet technologies have entered the stage of high volume manufacturing (HVM).
  • During the reporting period, the profit and revenue contributed by high-performance, high-density system-level packaging technology and fan-out wafer-level packaging technology showed solid growth year-on-year.

SRC Publishes Interim Microelectronics and Advanced Packaging Technologies Roadmap, Seeks Public Comments

Retrieved on: 
Wednesday, March 1, 2023

SRC was the only awardee chosen to focus on these emerging technologies, due to its strong history of thought leadership and continued innovation.

Key Points: 
  • SRC was the only awardee chosen to focus on these emerging technologies, due to its strong history of thought leadership and continued innovation.
  • The new paradigm uses system-scale design and architecture to integrate electronics, photonics, and micromechanical chiplets, taking into account cross-platform issues and relying critically on the rise of advanced packaging technologies.
  • SRC is actively seeking public feedback on the interim MAPT roadmap.
  • Through its interdisciplinary research programs, SRC plays an indispensable role in addressing global challenges, using research and development strategies, and advanced tools and technologies.

The Global Near Field Communication (NFC) Chips Market is forecast to grow by $3083.48 mn during 2022-2027, accelerating at a CAGR of 12.78% during the forecast period

Retrieved on: 
Tuesday, February 21, 2023

This study identifies the increasing demand for smart parking as one of the prime reasons driving the near field communication (NFC) chips market growth during the next few years.

Key Points: 
  • This study identifies the increasing demand for smart parking as one of the prime reasons driving the near field communication (NFC) chips market growth during the next few years.
  • Also, mobile phone OEMs coming up with MST technology and strategic alliances and partnerships will lead to sizable demand in the market.
  • The analyst presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters.
  • Technavio's market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast the accurate market growth.

Wolfspeed and ZF Announce Partnership for Future Silicon Carbide Semiconductor Devices

Retrieved on: 
Wednesday, February 1, 2023

Wolfspeed, Inc. (NYSE: WOLF), the global leader in Silicon Carbide technology and ZF, a global technology company enabling next generation mobility, today announced a strategic partnership that includes the creation of a joint innovation lab to drive advances in Silicon Carbide systems and devices for mobility, industrial and energy applications.

Key Points: 
  • Wolfspeed, Inc. (NYSE: WOLF), the global leader in Silicon Carbide technology and ZF, a global technology company enabling next generation mobility, today announced a strategic partnership that includes the creation of a joint innovation lab to drive advances in Silicon Carbide systems and devices for mobility, industrial and energy applications.
  • The partnership also includes a significant investment by ZF to support the planned construction of the world’s most advanced and largest 200mm Silicon Carbide device fab in Ensdorf, Germany.
  • Additional collaboration partners will be invited to participate in the innovation process, establishing an end-to-end, European Silicon Carbide innovation network.
  • ZF and Wolfspeed previously announced a strategic partnership in 2019 to create industry-leading, highly efficient electric drivelines with a Silicon Carbide inverter, and these new initiatives represent the next generation of innovation for the partners.

MITRE Embedded Capture the Flag Competition to Boost Student Skills for Growing Job Market

Retrieved on: 
Tuesday, December 6, 2022

To help prepare students for jobs in this multi-billion-dollar market , MITRE is running an Embedded Capture the Flag (eCTF) competition from January to April in 2023.

Key Points: 
  • To help prepare students for jobs in this multi-billion-dollar market , MITRE is running an Embedded Capture the Flag (eCTF) competition from January to April in 2023.
  • New this year, the eCTF is inviting external sponsors to help upscale the competition and allow more students to participate.
  • In the 2023 competition, teams will design and implement a key fob system for a car door lock.
  • MITRE provides the resources to complete the competition, however teams may choose to purchase additional resources to aid with development or attacking.

Sortera Alloys Honored by Goldman Sachs for Entrepreneurship

Retrieved on: 
Wednesday, October 12, 2022

FORT WAYNE, Ind., Oct. 12, 2022 /PRNewswire/ -- Sortera Alloys, Inc., an innovative industrial scrap metal sorting and recycling company powered by artificial intelligence, data analytics, and advanced sensors, today announced that the company's co-founder, CTO and Board Member, Dr. Nalin Kumar has been recognized by Goldman Sachs as one of the Most Exceptional Entrepreneurs of 2022 at its Builders and Innovators Summit in Healdsburg, California.

Key Points: 
  • Goldman Sachs selected Dr. Kumar from multiple industries to be honored at the two-day event.
  • "We're delighted to recognize Dr. Nalin Kumar as one of the most exceptional entrepreneurs of 2022," said David M. Solomon, Chairman and CEO of Goldman Sachs.
  • Sortera Alloys brings state-of-the-art artificial intelligence and machine learning data analytics to the recycling industry.
  • Sortera is led by a team of seasoned innovators in the fields of advanced materials, electronic instrumentation, and equipment development.

Microelectronics Technology Vision Opportunity Monthly Service - ResearchAndMarkets.com

Retrieved on: 
Friday, September 23, 2022

The "Microelectronics Technology TechVision Opportunity Engine" newsletter has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Microelectronics Technology TechVision Opportunity Engine" newsletter has been added to ResearchAndMarkets.com's offering.
  • The Microelectronics TechVision Opportunity Engine (TOE) captures global electronics-related innovations and developments on a weekly basis.
  • This monthly TOE highlights innovation features, value propositions, and the industry impact of 12 innovations along a particular theme, and includes strategic insights on the technology from a global perspective.
  • Strategic insights include insights on IP, competitive landscape, key research focus areas, key success factors for technology adoption, and noteworthy funding details.

Powering the Future: RIT educates engineers to help solve global chip shortage

Retrieved on: 
Friday, May 20, 2022

ROCHESTER, N.Y., May 20, 2022 /PRNewswire-PRWeb/ -- Microelectronic engineering students buzz around the Rochester Institute of Technology cleanroom applying specialized chemicals on semiconductor wafers. It is the first of many precisely controlled steps needed to convert the wafer into computer chips, tech used in today's electronic devices.

Key Points: 
  • Supply chain disruptions and a strong demand for consumer electronics during the pandemic led to a global chip shortage.
  • The shortage has highlighted the need to strengthen the domestic semiconductor industry and has put a new emphasis on microelectronic engineering education.
  • Since then, RIT has graduated more than 1,500 engineers trained to make semiconductor devices.
  • "We've all heard about the chip shortage and the desire to bring more semiconductor manufacturing back to the U.S.

Appointment of Valli Murugappan as Sales Director for the Asia Pacific Region

Retrieved on: 
Thursday, March 31, 2022

MELVILLE, N.Y., March 31, 2022 /PRNewswire/ --Micross Components, Inc. ("Micross"), a leading global provider of mission-critical microelectronic components and services for high-reliability aerospace, defense, space, medical, and industrial applications, is pleased to announce the appointment of Valli Murugappan to the position of Sales Director for the Asia Pacific (APAC) region.

Key Points: 
  • MELVILLE, N.Y., March 31, 2022 /PRNewswire/ --Micross Components, Inc. ("Micross"), a leading global provider of mission-critical microelectronic components and services for high-reliability aerospace, defense, space, medical, and industrial applications, is pleased to announce the appointment of Valli Murugappan to the position of Sales Director for the Asia Pacific (APAC) region.
  • Valli will operate from Singapore, and will be responsible for leading and coordinating all sales and customer success activities within the APAC region.
  • Prior to joining Micross, Valli served as the Senior Director of APAC at Data Device Corporation for 12 years, and prior to DDC as the APAC Regional Manager for Curtis Wright for 2 years.
  • We are excited to have such a capable and accomplished leader as Valli serve and expand our semiconductor and microelectronic distribution and supply chain services for the Asia Pacific market."