Microelectronics

Sono-Tek Announces Preliminary Record Revenue and Operating Income for Fiscal Year 2022 and Provides First Quarter FY2023 Revenue Guidance

Retrieved on: 
Wednesday, March 16, 2022
Unemployment, Time, Solution, Genomics, Technology, GLOBE, News, Workforce, Microelectronics, COVID-19, Water, NASDAQ, Projection, Awareness, Glass, Company, Travel, CEO, Contract, Growth, Efficiency, Maintenance, Video game, Nasdaq

MILTON, NY, March 16, 2022 (GLOBE NEWSWIRE) -- via NewMediaWire -- Sono-Tek Corporation (NASDAQ: SOTK), the leading developer and manufacturer of ultrasonic coating systems, today announced preliminary sales and operating income for its fiscal year ended February 28, 2022 (“FY2022”).

Key Points: 
  • The Companys preliminary estimate of operating income for FY2022 is approximately $1.8 million, a 38% increase over the Companys historic high operating income of $1.3 million that was set in the prior fiscal year.
  • Dr. Christopher L. Coccio, Sono-TeksChairman and CEO, commented, Sono-Tek had a great year, achieving another record in both revenue and operating income, which increased by 16% and 38%, respectively.
  • We reported positive gains in all quarters over the prior fiscal years results, in revenue and net income, and revenue showed steady growth from quarter to quarter, with the fourth quarter being the strongest of the year with $5 million in revenue.
  • The Companys final financial results will be announced upon completion of the annual year-end audit, which is expected in May 2022.

2021 Microelectronics Technology TechVision Opportunity Engine - ResearchAndMarkets.com

Retrieved on: 
Thursday, November 25, 2021
Technology, Semiconductor, Other Technology, Data Management, Adoption, TOE, Technology, Microelectronics, Industry, PRAM, Gallium nitride, Silicon carbide, NRAM, Research, Light-emitting diode, MRAM, Mark (given name), OLED, Electronics, Gallium arsenide, CNTS, IP, Television

The "Microelectronics Technology TechVision Opportunity Engine" newsletter has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Microelectronics Technology TechVision Opportunity Engine" newsletter has been added to ResearchAndMarkets.com's offering.
  • The Microelectronics TechVision Opportunity Engine (TOE) captures global electronics-related innovations and developments on a weekly basis.
  • This monthly TOE highlights innovation features, value propositions, and the industry impact of 12 innovations along a particular theme, and includes strategic insights on the technology from a global perspective.
  • Strategic insights include insights on IP, competitive landscape, key research focus areas, key success factors for technology adoption, and noteworthy funding details.

inTEST Names Richard Rogoff Vice President of Corporate Development

Retrieved on: 
Wednesday, September 29, 2021
Automotive Manufacturing, Aerospace, Manufacturing, Other Manufacturing, Engineering, U.S. Securities and Exchange Commission, Goal, Annual report, Public expenditure, Small Business Saturday, Integrated Management Concept, Rochester, Solution, Risk, Private Securities Litigation Reform Act, INSEAD, Culture, Microelectronics, Form 10-K, CEO, Terminology, EMS, Growth, Telecommunication, Corporation, COVID-19, MBA, NYSE, BS, Rochester Institute of Technology - Dubai, Corporate development, Semiconductor, Management, Risk management

inTEST Corporation (NYSE American: INTT), a global supplier of innovative test and process solutions for use in manufacturing and testing across a wide range of markets, including automotive, defense/aerospace, industrial, medical, semiconductor and telecommunications, today announced the appointment of Richard Rogoff to the newly created position of Vice President of Corporate Development effective October 1, 2021.

Key Points: 
  • inTEST Corporation (NYSE American: INTT), a global supplier of innovative test and process solutions for use in manufacturing and testing across a wide range of markets, including automotive, defense/aerospace, industrial, medical, semiconductor and telecommunications, today announced the appointment of Richard Rogoff to the newly created position of Vice President of Corporate Development effective October 1, 2021.
  • Mr. Rogoff will be a member of the leadership team and report to inTESTs President and CEO Richard N. Nick Grant, Jr.
  • With nearly 30 years of business development, operational, financial, and international expertise, Mr. Rogoff most recently has advised many clients on their M&A processes including working with inTEST over the last six months.
  • He held the positions of Vice President and Business Unit Manager for advanced packaging and flat panel display lithography systems and later managed the companys newly formed M&A integration office as Vice President Strategic Initiatives and Integration Management Office.

CAES and SkyWater to Expand US Strategic Radiation Hardened Semiconductor Platform

Retrieved on: 
Monday, June 14, 2021
Technology, Mobile, Wireless, Nanotechnology, Automotive Manufacturing, Aerospace, Manufacturing, Defense, Other Defense, Contracts, Networks, Semiconductor, Security, Consumer electronics, Satellite, Radiation, Ionizing radiation, Physical sciences, Carcinogens, Mutagens, Radiation protection, Radioactivity, Radiobiology, Supply chain, Microelectronics, Radiation hardening, CAES, SkyWater Technology, CAES, SKYWATER TECHNOLOGY

The evolution of this strategic RadHard microelectronic design and manufacturing ecosystem will strengthen SkyWaters DOD-accredited Trusted, on-shore semiconductor supply chain.

Key Points: 
  • The evolution of this strategic RadHard microelectronic design and manufacturing ecosystem will strengthen SkyWaters DOD-accredited Trusted, on-shore semiconductor supply chain.
  • By partnering with CAES, we expect to accelerate our on-shore, Trusted ecosystem for strategic defense missions that require extremely specialized, radiation-immune microelectronic process technologies.
  • CAES is excited to partner with SkyWater and provide our expertise in trusted radiation hardened design and qualification to help strengthen the strategic, Trusted supply chain with products designed and manufactured here in America, said Mike Kahn, president and CEO of CAES.
  • We look forward to playing our part in close collaboration with SkyWater to meet the most demanding national security missions.

NexLogic Technologies, Inc. Announces Installation of Finetech FINEPLACER® lambda Sub-Micron Die Bonder on Its PCB Microelectronics Assembly Floor

Retrieved on: 
Monday, February 22, 2021
Technology, Science and technology, Electrical engineering, Packaging, Electronics manufacturing, Semiconductor device fabrication, Electronic engineering, Printed circuit board, Microelectromechanical systems, Integrated circuit packaging, Integrated circuit, Microelectronics

SAN JOSE, Calif., Feb. 22, 2021 /PRNewswire-PRWeb/ --NexLogic Technologies, Inc., an EMS provider offering both PCB SMT and microelectronics assemblies , announces the installation of a highly advanced Finetech FINEPLACER lambda sub-micron die bonder system in its PCB microelectronics assembly line.

Key Points: 
  • SAN JOSE, Calif., Feb. 22, 2021 /PRNewswire-PRWeb/ --NexLogic Technologies, Inc., an EMS provider offering both PCB SMT and microelectronics assemblies , announces the installation of a highly advanced Finetech FINEPLACER lambda sub-micron die bonder system in its PCB microelectronics assembly line.
  • According to the manufacturer, Finetech, the new die bonder has accuracies of 0.5 m and is designed for precision die attach and advanced chip packaging.
  • Technology is pushing the limits to the point where now this type of accuracy for die bonding is needed for our PCB microelectronics assembly."
  • NexLogic's new Finetech FINEPLACER lambda sub-micron die bonder will be used for state-of-the-art projects involving sensor, diode, micro-electro-mechanical systems (MEMS), biosensor applications.

Cabot Microelectronics Corporation Announces It is Now CMC Materials, Inc. and Declares Quarterly Cash Dividend

Retrieved on: 
Thursday, October 1, 2020
CMC, Microelectronics, SEMI, Technology, Companies

Aurora, IL, Oct. 01, 2020 (GLOBE NEWSWIRE) -- Cabot Microelectronics Corporation (Nasdaq: CCMP), a global supplier of consumable materials to semiconductor manufacturers and pipeline companies, announces its name change and rebranding to CMC Materials, Inc., effective today.

Key Points: 
  • Aurora, IL, Oct. 01, 2020 (GLOBE NEWSWIRE) -- Cabot Microelectronics Corporation (Nasdaq: CCMP), a global supplier of consumable materials to semiconductor manufacturers and pipeline companies, announces its name change and rebranding to CMC Materials, Inc., effective today.
  • Our new company name and brand, CMC Materials, unify the Cabot Microelectronics team.
  • As part of the companys comprehensive rebranding, CMC Materials has launched a new website ( www.cmcmaterials.com ), which highlights the technologies that CMC Materials enables for semiconductor manufacturers and pipeline companies.
  • CMC Materials mission is to create value by delivering high-performing and innovative solutions that solve its customers greatest challenges.

Cabot Microelectronics Corporation Announces Intent to Launch New Corporate Brand

Retrieved on: 
Tuesday, September 1, 2020
Cabot, Microelectronics

The rebranding strategy reflects the companys ongoing commitment to innovation and technology leadership, providing critical, enabling materials to its global customers, and preparation for future growth.

Key Points: 
  • The rebranding strategy reflects the companys ongoing commitment to innovation and technology leadership, providing critical, enabling materials to its global customers, and preparation for future growth.
  • Cabot Microelectronics Corporation, headquartered in Aurora, Illinois, is a leading global supplier of consumable materials to semiconductor manufacturers and pipeline companies.
  • Cabot Microelectronics Corporation is also a leading provider of performance materials to pipeline operators.
  • For more information about Cabot Microelectronics Corporation, visit www.cabotcmp.com , or contact Colleen Mumford, Vice President, Communications and Marketing, at 630-499-2600.

Cabot Microelectronics Corporation to Release Financial Results for Third Quarter of Fiscal 2020 After Market Close on August 5, 2020

Retrieved on: 
Thursday, June 25, 2020
Electronics, Microelectronics, Cabot

Earnings release and slide presentation available: Wednesday, August 5, after market close

Key Points: 
  • Earnings release and slide presentation available: Wednesday, August 5, after market close
    International: (778) 560-2685
    Webcast and presentation: The earnings press release and slide presentation will be available in the Investor Relations section of the companys website, ir.cabotcmp.com .
  • Cabot Microelectronics Corporation, headquartered in Aurora, Illinois, is a leading global supplier of consumable materials to semiconductor manufacturers and pipeline companies.
  • Cabot Microelectronics Corporation is also a leading provider of performance materials to pipeline operators.
  • For more information about Cabot Microelectronics Corporation, visit www.cabotcmp.com , or contact Colleen Mumford, Vice President, Communications and Marketing, at 630-499-2600.

Cabot Microelectronics Corporation Declares Quarterly Cash Dividend

Retrieved on: 
Tuesday, June 9, 2020
Cabot, Microelectronics

Aurora, IL, June 09, 2020 (GLOBE NEWSWIRE) -- Cabot Microelectronics Corporation (Nasdaq: CCMP) today announced that its Board of Directors has declared a quarterly cash dividend of $0.44 per share ($1.76 per share on an annualized basis) on the company's common stock.

Key Points: 
  • Aurora, IL, June 09, 2020 (GLOBE NEWSWIRE) -- Cabot Microelectronics Corporation (Nasdaq: CCMP) today announced that its Board of Directors has declared a quarterly cash dividend of $0.44 per share ($1.76 per share on an annualized basis) on the company's common stock.
  • Cabot Microelectronics Corporation, headquartered in Aurora, Illinois, is a leading global supplier of consumable materials to semiconductor manufacturers and pipeline companies.
  • Cabot Microelectronics Corporation is also a leading provider of performance materials to pipeline operators.
  • For more information about Cabot Microelectronics Corporation, visit www.cabotcmp.com , or contact Colleen Mumford, Vice President, Communications and Marketing, at 630-499-2600.

Cabot Microelectronics Corporation to Release Financial Results for Second Quarter of Fiscal 2020 After Market Close on May 6, 2020

Retrieved on: 
Monday, April 6, 2020
Electronics, Microelectronics, Cabot, Electronics, Microelectronics, Cabot

Earnings release and slide presentation available: Wednesday, May 6, after market close

Key Points: 
  • Earnings release and slide presentation available: Wednesday, May 6, after market close
    International: (825) 312-2296
    Webcast and presentation: The earnings press release and slide presentation will be available in the Investor Relations section of the companys website, ir.cabotcmp.com .
  • Cabot Microelectronics Corporation, headquartered in Aurora, Illinois, is a leading global supplier of consumable materials to semiconductor manufacturers and pipeline companies.
  • Cabot Microelectronics Corporation is also a leading provider of performance materials to pipeline operators.
  • For more information about Cabot Microelectronics Corporation, visit www.cabotcmp.com , or contact Colleen Mumford, Vice President, Communications and Marketing, at 630-499-2600.