JEDEC memory standards

JEDEC Announces Publication of JEDEC Module Sideband Bus

Retrieved on: 
Tuesday, October 13, 2020
Electronic design automation, Semiconductor, Consumer electronics, Technology, Mobile, Wireless, Hardware, SDRAM, MIPI Alliance, Electronics, I3C, JEDEC, DDR5 SDRAM, Regulation, Standards, MIPI Debug Architecture, JEDEC memory standards

JEDEC Solid State Technology Association , the global leader in standards development for the microelectronics industry, today announced the publication of JESD403-1 JEDEC Module Sideband Bus standard (SidebandBus).

Key Points: 
  • JEDEC Solid State Technology Association , the global leader in standards development for the microelectronics industry, today announced the publication of JESD403-1 JEDEC Module Sideband Bus standard (SidebandBus).
  • SidebandBus was developed in coordination with the MIPI Alliance as both a subset and superset of the MIPI I3C BasicSM serial bus standard.
  • SidebandBus defines the parameters for usage of the system management control bus for the coming generation of DDR5 memory modules and beyond, and is available for download from the JEDEC website .
  • All JEDEC standards are available for download from the JEDEC website.

Tachyum Joins JEDEC Committees Working on Standards for Solid State Memories

Retrieved on: 
Tuesday, February 25, 2020
Networks, Semiconductor, Hardware, Data management, Technology, Computer memory, JEDEC, Inventions, Dynamic random-access memory, Computing, Digital technology, Random-access memory, JEDEC memory standards

Semiconductor startup Tachyum Inc. today announced that it has become members of two JEDEC committees developing standards for solid state memories and DRAM modules that will shape the semiconductor industrys position in the rapidly evolving global marketplace.

Key Points: 
  • Semiconductor startup Tachyum Inc. today announced that it has become members of two JEDEC committees developing standards for solid state memories and DRAM modules that will shape the semiconductor industrys position in the rapidly evolving global marketplace.
  • Tachyum is one of nearly 300 member companies of the JEDEC, the global leader in developing open standards for the microelectronics industry.
  • The company has joined committees JC-42 Solid State Memories, which include all memory-integrated circuits and programmable logic devices, and JC-45 DRAM Modules, addressing architectural, electrical, test and SPD issues related to memory design and manufacturing for commercial applications.
  • JEDEC committees develop open standards that enable innovation by helping commoditize components, which lowers prices yet retains quality and reliability, helping to build a foundation for a successful marketplace.

JEDEC Announces Publication of Serial Presence Detect Support and Module Labels Specifications to Support New Hybrid Memory (NVDIMM)

Retrieved on: 
Tuesday, September 10, 2019
Mobile, Wireless, Technology, Semiconductor, Hardware, Electronic design automation, Data management, Consumer electronics, Computer memory, SDRAM, Registered memory, DDR4 SDRAM, DIMM, Serial presence detect, JEDEC memory standards

JEDEC Solid State Technology Association , the global leader in standards development for the microelectronics industry, today announced the publication of document release 5 of the DDR4 Serial Presence Detect (SPD) Specification .

Key Points: 
  • JEDEC Solid State Technology Association , the global leader in standards development for the microelectronics industry, today announced the publication of document release 5 of the DDR4 Serial Presence Detect (SPD) Specification .
  • With this release of the document, the revision level of all memory types increases to UDIMM (revision 1.2), RDIMM (revision 1.3), LRDIMM (revision 1.4) and NVDIMM (revision 1.2).
  • In addition, JEDEC issues document release 1 of the DDR4 DIMM Labels Specification.
  • These new specifications enable end users to identify the capabilities of this new class of hybrid module, such as capacity, speed, and access time.

Toshiba Memory America Adds BiCS FLASH to Lineup of e-MMC Ver. 5.1 Compliant Embedded Flash Memory Products

Retrieved on: 
Tuesday, February 26, 2019
Technology, Online Retail, Data management, Hardware, Internet, Software, Semiconductor, Retail, Computer data storage, Non-volatile memory, Technology, Computing, Computer memory, Flash memory, Solid-state drive, Toshiba, JEDEC, MultiMediaCard, JEDEC memory standards

e-MMC is a product category for a class of embedded memory products built to the JEDEC e-MMC Standard specification and is a trademark of the JEDEC Solid State Technology Association.

Key Points: 
  • e-MMC is a product category for a class of embedded memory products built to the JEDEC e-MMC Standard specification and is a trademark of the JEDEC Solid State Technology Association.
  • 5.1
    One of standard specifications of embedded flash memory defined by JEDEC.
  • Toshiba Memory America, Inc. is the U.S.-based subsidiary of Toshiba Memory Corporation , a leading worldwide supplier of flash memory and solid state drives (SSDs) .
  • From the invention of flash memory to todays breakthrough 96-layer BiCS FLASH 3D technology, Toshiba continues to lead innovation and move the industry forward.