Rohm

ROHM’s Fourth Generation SiC MOSFETs to be Used in Hitachi Astemo’s Inverters for Electric Vehicles

Retrieved on: 
Tuesday, January 10, 2023

Santa Clara, CA and Kyoto, Japan, Jan. 10, 2023 (GLOBE NEWSWIRE) -- ROHM Semiconductor today announced the adoption of its new fourth generation SiC MOSFETs and gate driver ICs in electric vehicle inverters from Hitachi Astemo, Ltd. , a leading Japanese automotive parts manufacturer.

Key Points: 
  • Santa Clara, CA and Kyoto, Japan, Jan. 10, 2023 (GLOBE NEWSWIRE) -- ROHM Semiconductor today announced the adoption of its new fourth generation SiC MOSFETs and gate driver ICs in electric vehicle inverters from Hitachi Astemo, Ltd. , a leading Japanese automotive parts manufacturer.
  • As the electrification of cars rapidly advances towards achieving a decarbonized society, the development of electric powertrain systems that are more efficient, compact, and lightweight is currently underway.
  • As the first supplier in the world to begin mass production of SiC MOSFETs in 2010, ROHM continues to develop market-leading SiC power device technologies.
  • However, this marks the first time SiC devices will be adopted for the main inverter circuit to further improve performance.

ROHM’s New MOSFETs Contribute to Higher Efficiency and Safer Operation with an Original Insulation Structure

Retrieved on: 
Monday, December 19, 2022

In recent years, the increasing sophistication and power requirements of compact devices have resulted in larger batteries that reduce the space available for mounting components.

Key Points: 
  • In recent years, the increasing sophistication and power requirements of compact devices have resulted in larger batteries that reduce the space available for mounting components.
  • To meet this need, the development of MOSFETs in wafer-level, chip-size packages (WLCSP) that contribute to greater miniaturization while maintaining the necessary characteristics is becoming mainstream in the industry.
  • ROHM leverages its strengths as an IC manufacturer to significantly reduce wiring resistance, which has increased with conventional discrete processes.
  • At the same time, ROHM’s unique package structure provides insulated protection for the side walls (unlike standard products in the same package with no protection).

Metal Exchange Corporation Names New CEO

Retrieved on: 
Thursday, December 8, 2022

ST. LOUIS, Dec. 08, 2022 (GLOBE NEWSWIRE) -- Metal Exchange Corporation , an industry leader in non-ferrous metal trading and manufacturing, announced today that Matt Rohm, current President and Chief Operating Officer (COO), will be promoted to Chief Executive Officer (CEO) of Metal Exchange Corporation effective Jan. 1, 2023. At that time, current CEO Rick Merluzzi will assume the title of Executive Vice Chairman, serving as an advisor to Executive Chairman Mike Lefton on key strategic initiatives for the organization, through the end of 2023.

Key Points: 
  • ST. LOUIS, Dec. 08, 2022 (GLOBE NEWSWIRE) -- Metal Exchange Corporation , an industry leader in non-ferrous metal trading and manufacturing, announced today that Matt Rohm, current President and Chief Operating Officer (COO), will be promoted to Chief Executive Officer (CEO) of Metal Exchange Corporation effective Jan. 1, 2023. At that time, current CEO Rick Merluzzi will assume the title of Executive Vice Chairman, serving as an advisor to Executive Chairman Mike Lefton on key strategic initiatives for the organization, through the end of 2023.
  • Prior to being named President and COO earlier this year, Rohm joined the Metal Exchange family as Chief Financial Officer in 2016.
  • Merluzzi added, "I am honored to have led Metal Exchange as its CEO and am grateful for the many opportunities and experiences I've had throughout my career.
  • Given the strength of our people, and their dedication to our culture and purpose, I believe Metal Exchange is well-positioned to grow and thrive for years to come."

ROHM Delivers the Industry’s Highest Rated Power Shunt Resistors in the 0508 Size, Contributes to Greater Miniaturization

Retrieved on: 
Thursday, December 8, 2022

ROHM has also strengthened their considerable lineup with two updated general-purpose MCR series shunt resistors ( MCR10L and MCR18L ).

Key Points: 
  • ROHM has also strengthened their considerable lineup with two updated general-purpose MCR series shunt resistors ( MCR10L and MCR18L ).
  • At the same time, manufacturers of applications utilizing higher board densities are demanding even smaller shunt resistors.
  • To meet these needs, the new LTR10L series delivers the industry's highest rated power and best-in-class temperature coefficient of resistance (TCR) in a compact 0508-size (0.5 inch × 0.8 inch) / 1220-size (1.25 mm × 2.0 mm) that contributes to both high reliability and greater miniaturization.
  • Higher rated power enables the same performance in a smaller size, contributing to product miniaturization.

ROHM and BASiC Semiconductor Form a Strategic Partnership

Retrieved on: 
Thursday, December 1, 2022

Santa Clara, CA and Kyoto, Japan, Dec. 01, 2022 (GLOBE NEWSWIRE) -- ROHM Semiconductor and Shenzhen BASiC Semiconductor today announced they have entered into a strategic partnership agreement on SiC power devices for automotive applications.

Key Points: 
  • Santa Clara, CA and Kyoto, Japan, Dec. 01, 2022 (GLOBE NEWSWIRE) -- ROHM Semiconductor and Shenzhen BASiC Semiconductor today announced they have entered into a strategic partnership agreement on SiC power devices for automotive applications.
  • Going forward, both ROHM and BASiC Semiconductor will contribute to technological innovation in the automotive sector by accelerating the development of innovative power solutions centered on SiC.
  • Isao Matsumoto, President and CEO of ROHM Co., Ltd.
    We are extremely pleased to enter into a strategic partnership with BASiC Semiconductor to provide competitive SiC solutions for the new energy vehicle market.
  • About Shenzhen BASiC Semiconductor Ltd.
    Shenzhen BASiC Semiconductor Ltd., a leading company in Chinas next-generation power semiconductor industry, is engaged in R&D in a variety of fields, from SiC power device materials manufacturing, chip design and production expertise to packaging, testing, and drive applications using advanced SiC core technologies.

ROHM Develops Ultra-Low-Power, On-Device Learning Edge AI Chip

Retrieved on: 
Tuesday, November 29, 2022

Santa Clara, CA and Kyoto, Japan, Nov. 29, 2022 (GLOBE NEWSWIRE) -- ROHM Semiconductor todayannouncedthey have developed an on-device learning [1] AI chip (SoC with on-device learning AI accelerator) for edge computer endpoints in the IoT field.

Key Points: 
  • Santa Clara, CA and Kyoto, Japan, Nov. 29, 2022 (GLOBE NEWSWIRE) -- ROHM Semiconductor todayannouncedthey have developed an on-device learning [1] AI chip (SoC with on-device learning AI accelerator) for edge computer endpoints in the IoT field.
  • So, the AI chip that performs learning requires substantial computing power that necessarily consumes a large amount of power.
  • Based on an on-device learning algorithm developed by Professor Matsutani of Keio University, ROHMs newly developed AI chip mainly consists of an AI accelerator (AI-dedicated hardware circuit) and ROHMs high-efficiency 8-bit CPU tinyMicon MatisseCORE.
  • Going forward, ROHM plans to incorporate the AI accelerator used in this AI chip into various IC products for motors and sensors.

ROHM, Mazda, and Imasen Sign a Joint Agreement to Develop Inverters for e-Axle Using ROHM SiC Power Modules

Retrieved on: 
Tuesday, November 22, 2022

At the same time, ROHM will contribute to the creation industry-leading compact, high efficiency electrical units by developing and supplying advanced SiC power modules that provide improved performance.

Key Points: 
  • At the same time, ROHM will contribute to the creation industry-leading compact, high efficiency electrical units by developing and supplying advanced SiC power modules that provide improved performance.
  • Through this collaboration, ROHM will develop even more competitive SiC MOSFETs and modules by working backwards from the finished vehicle to understand the performance and optimal drive method required of power semiconductors.
  • And to further contribute to society, ROHM will clarify the direction ROHM should take while raising awareness among all Group employees.
  • In addition to bare chips, ROHM is currently developing products with discrete packages, and this collaboration will allow the company to develop and offer power modules equipped with the latest (4th Generation) SiC MOSFETs.

Rogers Announces Leadership Transition

Retrieved on: 
Thursday, November 17, 2022

Rogers Corporation (NYSE:ROG) (Rogers) today announced that Bruce D. Hoechner, President and Chief Executive Officer, has decided to retire, effective December 31, 2022.

Key Points: 
  • Rogers Corporation (NYSE:ROG) (Rogers) today announced that Bruce D. Hoechner, President and Chief Executive Officer, has decided to retire, effective December 31, 2022.
  • The Rogers Board of Directors plans to appoint Colin Gouveia, Senior Vice President and General Manager of Rogers Elastomeric Material Solutions (EMS) business unit, to succeed him.
  • View the full release here: https://www.businesswire.com/news/home/20221117006018/en/
    Peter C. Wallace, Rogers Board Chair, said, Bruce has been instrumental in establishing Rogers as a global leader in innovative advanced materials-based solutions used in electric vehicles, ADAS and other fast-growing markets.
  • Since joining Rogers in 2019, he has provided leadership across the organization and transformed EMS to take full advantage of fast-growing markets like electric vehicles.

Nexeo Plastics Signs Agreement With Roehm America to Distribute Additional PMMA Materials in Mexico

Retrieved on: 
Wednesday, October 12, 2022

Key Points: 
  • View the full release here: https://www.businesswire.com/news/home/20221012005792/en/
    Nexeo Plastics' extensive distribution network shortens order to delivery times.
  • Nexeo Plastics already carries Roehms full PMMA product line in the United States and Canada, as well as its medical grade resins in Mexico.
  • This agreement gives Nexeo Plastics customers in the Americas access to Roehms entire PMMA product line.
  • We are excited about this expanded collaboration with Roehm as it enhances the number of quality materials and solutions available to our customers in Mexico and throughout Latin America.

EQS-News: Vitesco Technologies Group AG: Capital Market Day 2022: Vitesco Technologies presents its expected business development for electrification

Retrieved on: 
Tuesday, October 11, 2022

Vitesco Technologies, a leading international developer and manufacturer of state-of-the-art powertrain technologies for sustainable mobility, presented its current strategy and projected business performance through 2030 to prospective investors and analysts at todays Capital Market Day 2022.

Key Points: 
  • Vitesco Technologies, a leading international developer and manufacturer of state-of-the-art powertrain technologies for sustainable mobility, presented its current strategy and projected business performance through 2030 to prospective investors and analysts at todays Capital Market Day 2022.
  • The majority will have Vitesco Technologies components on board: e-axles, battery management systems, inverters and numerous other products.
  • In the last two six-month periods alone, Vitesco Technologies recorded orders worth around 10billion in electrification business.
  • Vitesco Technologies revealed its expectations for 2026 at the Capital Market Day.