Dielectric loss

DuPont Wins Five 2022 R&D 100 Awards

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Tuesday, August 23, 2022
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WILMINGTON, Del., Aug. 23, 2022 /PRNewswire/ -- DuPont (NYSE: DD) todayannounced that it has been named winner of five 2022 R&D100 Awards in the Mechanical/Materials category.

Key Points: 
  • WILMINGTON, Del., Aug. 23, 2022 /PRNewswire/ -- DuPont (NYSE: DD) todayannounced that it has been named winner of five 2022 R&D100 Awards in the Mechanical/Materials category.
  • TheR&D 100 Awards, sponsored by R&D World Magazine, recognizes the 100 most innovative technologies of the previous year.
  • The awards add to DuPont's impressive streak of new product innovation, having 22 finalists and 10 R&D 100 winners in the last five years.
  • DuPont, the DuPont Oval Logo, and all trademarks and service marks denoted with ,SMorare owned by affiliates of DuPont de Nemours, Inc. unless otherwise noted.

Celestica Partners with ECM to Bring their Patented Technology Solutions to the Aerospace and Defense Market

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Monday, October 11, 2021
Technology, Dielectric loss, Electronics, ITAR, A&D, CLS, AUSA, Engineering, ECM, Aluminium, PCB, License, GLOBE, Sound, Industry, Software, Association of British HealthTech Industries, TSX, Return loss, Drawing board, EMI, CEO, NYSE, Solution, Partnership, Sand, Printed circuit board, Gerber, ATR, 3D printing, Risk management

Celestica will provide complete product lifecycle support from engineering and prototyping to new product introduction and full-scale production of motors.

Key Points: 
  • Celestica will provide complete product lifecycle support from engineering and prototyping to new product introduction and full-scale production of motors.
  • engineering, manufacturing, testing, and after-sales support provides our customers with the full product lifecycle solutions they need to gain a significant competitive advantage, said Jack Jacobs, Vice President of Aerospace and Defense at Celestica.
  • This design was recently recognized with a Platinum 2021 Technology Innovators Award by Military & Aerospace Electronics and Intelligent Aerospace.
  • Based on the recommendations of an independent panel of industry judges, this prestigious award recognizes companies offering substantial military, aerospace, and avionics design solutions.

Hitachi Chemical Launches Mass Production of 5G-Compatible Printed Wiring Board Material “MCL-HS200” With Low Transmission Loss and Low Warpage Properties

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Friday, August 21, 2020
Other Manufacturing, Technology, Mobile, Wireless, Semiconductor, Chemicals, Plastics, Manufacturing, Networks, Hardware, Consumer electronics, Electromagnetism, Force, Electrical engineering, Physical sciences, Electronic engineering, Electronics manufacturing, Printed circuit board, Relative permittivity, Dielectric loss, Dielectric

By applying low polarity resin materials and low dielectric glass cloth, Hitachi Chemical achieved lower transmission loss properties (low dielectric loss tangent) and lower dielectric constant*2, reducing signal delay.

Key Points: 
  • By applying low polarity resin materials and low dielectric glass cloth, Hitachi Chemical achieved lower transmission loss properties (low dielectric loss tangent) and lower dielectric constant*2, reducing signal delay.
  • In addition, Hitachi Chemical attained superior low warpage properties required for thinner modules by using low coefficient of thermal expansion (CTE) resins and increasing the filler content.
  • Hitachi Chemical will continue to contribute to more advanced functional printed wiring boards through our superior technologies and new product development.
  • MCL-HS200 is a printed wiring board material with low transmission loss and low warpage properties, designed for 5G-compatible radio frequency front-end (RFFE) modules*3 and antenna in package (AiP) *4.