TIA

Semtech Demonstrates World’s First 50G Higher Speed PON Compliant Chipset at OFC 2023

Retrieved on: 
Tuesday, March 7, 2023
Apps, Applications, Mobile, Wireless, Technology, Semiconductor, Security, Software, Networks, Internet, Electronic Design Automation, Data Management, Cloud, Corporation, OFC, Noise, Semtech, Growth, OLT, NRZ, PMD, ITU, Internet of things, PON, TIA, Mobile phone

Semtech Corporation (Nasdaq: SMTC), a high-performance semiconductor, IoT systems and Cloud connectivity service provider, today demonstrated the first PMD chipset to comply with the timing and performance requirements of the ITU standard for 50G HS-PON (Higher Speed PON) Optical Line Terminal (OLT) applications.

Key Points: 
  • Semtech Corporation (Nasdaq: SMTC), a high-performance semiconductor, IoT systems and Cloud connectivity service provider, today demonstrated the first PMD chipset to comply with the timing and performance requirements of the ITU standard for 50G HS-PON (Higher Speed PON) Optical Line Terminal (OLT) applications.
  • “50G PON enables multi-gigabit broadband services for homes and businesses and will drive new use cases for the PON market,” said Jacqui Adams, senior product line manager for Semtech’s Signal Integrity Products Group.
  • The PON-X GN7161 combo chip is a fully integrated solution for OLT transmit and receive signals.
  • The PON-X™ HS-PON solutions will be demonstrated at the Semtech booth #1901 during OFC 2023.

Semtech Unveils New Products for Next-Gen Data Centers, PON and 5G Wireless Networks to Address Increasing Data Demands

Retrieved on: 
Tuesday, March 7, 2023
Data Management, Semiconductor, IOT (Internet of Things), Technology, Networks, Internet, Hardware, Cloud, Business Integration Group, Inc., Corporation, Digital, OFC, Signal integrity, Artificial intelligence, Semtech, Copper, Mixed-signal integrated circuit, Cloud computing, Signal, Broadcom Inc., MOPA, Internet of things, PON, Tias, TIA, Marketing, Video game, Road, Internet service provider

The new products provide customers with the low power, low cost and low-latency solutions needed for hyperscale data center applications, wireless infrastructure, and access and enterprise networking.

Key Points: 
  • The new products provide customers with the low power, low cost and low-latency solutions needed for hyperscale data center applications, wireless infrastructure, and access and enterprise networking.
  • The digital revolution—spurred by the rapid adoption of IoT-based technology, Artificial Intelligence (AI), automotive, Cloud services, mobile subscriptions and more—is rapidly increasing worldwide data usage that drives the need for higher data rates in data center, PON and wireless networks.
  • Semtech’s optical networking platform provides the backbone IC technology to support these higher rates and global data usage.
  • By improving networks at the chip level, Semtech is allowing our customers to prepare their networks for the exponential growth in data demands expected in the next few years.

Semtech Unveils FiberEdge® Octal Linear Transimpedance Amplifier for 800G and 1.6T Data Center Applications

Retrieved on: 
Tuesday, March 7, 2023
Data Management, Semiconductor, Technology, Telecommunications, Networks, Internet, Hardware, Cloud, Silicon, Corporation, COB, Tias, Semtech, TIA, Chip on board, Internet of things, Computer data storage

Semtech Corporation (Nasdaq: SMTC), a high-performance semiconductor, IoT systems and Cloud connectivity service provider, today announced the expansion of its optical networking portfolio with sample availability of the FiberEdge® GN1825 octal transimpedance amplifier (TIA).

Key Points: 
  • Semtech Corporation (Nasdaq: SMTC), a high-performance semiconductor, IoT systems and Cloud connectivity service provider, today announced the expansion of its optical networking portfolio with sample availability of the FiberEdge® GN1825 octal transimpedance amplifier (TIA).
  • “At 800G and beyond a beachfront layout on the TIAs enables improved and easy optical fiber coupling layout in optical transceivers,” said Nicola Bramante, senior product line manager for Semtech’s Signal Integrity Products Group.
  • The FiberEdge GN1825 is a PAM4 56GBd 500μm-pitch octal TIA, available as flip-chip bare die, designed for 800GBASE-DR8, 2x400GBASE-DR4/LR4/FR4 and 1.6TBASE-DR16 optical transceivers, Chip on Board (COB) optical assemblies and silicon photonics (SiPh).
  • With its high gain, high bandwidth, high stability, low power, low group delay variation and feature richness, the GN1825 enables fast deployment into very-high density single mode fiber applications into the terabits generation.

Semtech Announces Production of Best-in-Class Reduced Pitch FiberEdge® Linear Transimpedance Amplifier for 400G and 800G Data Center Applications

Retrieved on: 
Tuesday, March 7, 2023
Data Management, Semiconductor, IOT (Internet of Things), Technology, Networks, Internet, Hardware, Cloud, FR4, Corporation, PAM4, QSFP-DD, Audio power amplifier, COB, Chip on board, Silicon, OSFP, Internet of things, Tias, Semtech, TIA, LR4, Video game

Semtech Corporation (Nasdaq: SMTC), a high-performance semiconductor, IoT systems and Cloud connectivity service provider, today announced production availability of the FiberEdge® GN1814, part of its portfolio of PAM4 Transimpedance Amplifiers (TIAs).

Key Points: 
  • Semtech Corporation (Nasdaq: SMTC), a high-performance semiconductor, IoT systems and Cloud connectivity service provider, today announced production availability of the FiberEdge® GN1814, part of its portfolio of PAM4 Transimpedance Amplifiers (TIAs).
  • “The production availability of the FiberEdge GN1814 enables qualification testing of the latest optical transceiver technology in data centers by our customers and system vendors who demand exceptional quality and performance,” said Nicola Bramante, senior product line manager for Semtech’s Signal Integrity Products Group.
  • “The reduced pitch of the new FiberEdge GN1814, combined with all the latest features from Semtech’s FiberEdge PAM4 TIAs and rigorous quality methodologies, enables the rapid deployment of next generation 100G/lane OSFP and QSFP-DD optical transceivers.”
    This is the newest product in Semtech’s optical networking portfolio that provides high-performance signal integrity for optical module solutions used by leading companies in the data center/enterprise networking, wireless infrastructure and passive optical network markets.
  • The FiberEdge GN1814 is a 56GBd feature-rich quad 500μm-pitch low power, low cost, low noise and high gain TIA, available as wire-bondable bare die, designed for 400GBASE-DR4, FR4, LR4 and 800GBASE-DR8 PAM4 optical transceivers, Chip on Board (COB) optical assemblies and silicon photonics (SiPh).

Eoptolink Showcasing Industry Most Power-Efficient 800G Optical Transceivers at OFC 2023

Retrieved on: 
Wednesday, March 8, 2023
TFLN, DSP, OFC, SZSE, TIA, PIC, OSFP, Telecommunications

CHENGDU, China and FREMONT, Calif. , March 8, 2023 /PRNewswire/ -- Eoptolink Technology Inc., Ltd. (SZSE: 300502), a leading provider of optical transceiver solutions and services, has announced that it will showcase its newest and most power-efficient 800G optical transceivers at OFC 2023.

Key Points: 
  • CHENGDU, China and FREMONT, Calif. , March 8, 2023 /PRNewswire/ -- Eoptolink Technology Inc., Ltd. (SZSE: 300502), a leading provider of optical transceiver solutions and services, has announced that it will showcase its newest and most power-efficient 800G optical transceivers at OFC 2023.
  • The company has continuously pushed the power limits of high-speed transceivers, and it is currently sampling the second generation of 800G DR8+ and 2xFR4 silicon photonics-based transceivers.
  • Eoptolink has also launched 5nm DSP-based EML and silicon photonics 800G transceivers with power consumption of
  • A live demonstration all these low power 800G transceivers will be shown at Eoptolink's booth #3327 at OFC 2023 in San Diego.

Senator Mark Warner to be Featured Speaker at BEAD Success Summit

Retrieved on: 
Tuesday, March 7, 2023
CHIPS, Consultant, Telecommunications Industry Association, Senate, Commerce, Science, Senate Intelligence Committee report on Russian interference in the 2016 United States presidential election, Civil Procedure Rule Committee, Infrastructure Investment and Jobs Act, IIJA, Internet service provider, Access, Senior advisor, Office of Inspector General, U.S. Department of Health and Human Services, United States Senate Finance Subcommittee on Energy, Natural Resources, and Infrastructure, Federal, Warner, TIA, Nextel Communications, U.S. Department of Commerce Office of Security, Intelligence Committee, Equity, Broadband

ARLINGTON, Va., March 7, 2023 /PRNewswire/ -- The Telecommunications Industry Association (TIA), the trusted industry association for the connected world, today announced it confirmed U.S. Senator Mark Warner from Virginia as a featured speaker at the BEAD Success Summit, taking place April 19 – 20 in Arlington, Virginia.

Key Points: 
  • Senator Mark Warner from Virginia as a featured speaker at the BEAD Success Summit , taking place April 19 – 20 in Arlington, Virginia.
  • "We are honored to have Senator Warner confirmed as a featured speaker at the BEAD Success Summit in his home state of Virginia," said David Stehlin, CEO of TIA.
  • TIA also recently announced Kevin Gallagher, Senior Advisor to the Secretary of the U.S. Department of Commerce – the lead agency administrating the BEAD Program – as a featured speaker for the event.
  • For more information on the BEAD Success Summit, visit www.BEADSuccessSummit.com .

Senator Mark Warner to be Featured Speaker at BEAD Success Summit

Retrieved on: 
Tuesday, March 7, 2023
CHIPS, Consultant, Telecommunications Industry Association, Senate, Commerce, Science, Senate Intelligence Committee report on Russian interference in the 2016 United States presidential election, Civil Procedure Rule Committee, Infrastructure Investment and Jobs Act, IIJA, Internet service provider, Access, Senior advisor, Office of Inspector General, U.S. Department of Health and Human Services, United States Senate Finance Subcommittee on Energy, Natural Resources, and Infrastructure, Federal, Warner, TIA, Nextel Communications, U.S. Department of Commerce Office of Security, Intelligence Committee, Equity, Broadband

ARLINGTON, Va., March 7, 2023 /PRNewswire/ -- The Telecommunications Industry Association (TIA), the trusted industry association for the connected world, today announced it confirmed U.S. Senator Mark Warner from Virginia as a featured speaker at the BEAD Success Summit, taking place April 19 – 20 in Arlington, Virginia.

Key Points: 
  • Senator Mark Warner from Virginia as a featured speaker at the BEAD Success Summit , taking place April 19 – 20 in Arlington, Virginia.
  • "We are honored to have Senator Warner confirmed as a featured speaker at the BEAD Success Summit in his home state of Virginia," said David Stehlin, CEO of TIA.
  • TIA also recently announced Kevin Gallagher, Senior Advisor to the Secretary of the U.S. Department of Commerce – the lead agency administrating the BEAD Program – as a featured speaker for the event.
  • For more information on the BEAD Success Summit, visit www.BEADSuccessSummit.com .

Semtech and Broadcom Demonstrate Industry’s First 200G/lane Electrical-to-Optical Link at OFC 2023

Retrieved on: 
Thursday, March 2, 2023
Technology, Mobile, Wireless, Semiconductor, Engineering, Telecommunications, Manufacturing, Networks, Internet, Hardware, Cloud, PAM4, Exhibition, Semtech, OFC, Anti-Müllerian hormone, DSP, Ecosystem, Marketing, Corporation, Broadcom Inc., Communication, Keysight, TIA, TBPS, Internet of things, Optics

Semtech Corporation (Nasdaq: SMTC), a high-performance semiconductor, IoT systems and Cloud connectivity service provider, today announced the successful demonstration of a 200G per lane (200G/lane) optical transmission link enabled by Semtech’s latest FiberEdge® 200G PAM4 PMDs and Broadcom’s latest generation DSP PHY.

Key Points: 
  • Semtech Corporation (Nasdaq: SMTC), a high-performance semiconductor, IoT systems and Cloud connectivity service provider, today announced the successful demonstration of a 200G per lane (200G/lane) optical transmission link enabled by Semtech’s latest FiberEdge® 200G PAM4 PMDs and Broadcom’s latest generation DSP PHY.
  • Further, it is a highly scalable solution enabling optical modules to support data rates up to 3.2 Tbps.
  • Rapid deployment of the next generation of 51.2T switches in data center networks and high-performance computing is contingent on the maturity of optics based on next generation 200G/lane optical modules.
  • “Semtech’s and Broadcom’s successful demonstration of the 200Gb/s optical link is another important milestone for the industry towards ubiquitous future 800G and 1.6T networks.

POET Technologies Introduces “POET Infinity” – a Chiplet-based Transmitter Platform for 400G, 800G and 1.6T Data Center Solutions

Retrieved on: 
Thursday, March 2, 2023
POET, Laser, Electronics, OFC, Conference, DSP, Communication, Programmable interrupt controller, PTK, OSFP, Infinity, DML, TMX Group, TIA, Die (integrated circuit), Printed circuit board, Exhibition

TORONTO, March 02, 2023 (GLOBE NEWSWIRE) -- POET Technologies Inc. (“POET” or the “Company”) (TSX Venture: PTK; NASDAQ: POET), the designer and developer of the POET Optical Interposer™ and Photonic Integrated Circuits (PICs) for the data center, telecommunication and artificial intelligence markets, today announced “POET Infinity™”, a chiplet-based transmitter platform for 400G, 800G and 1.6T pluggable transceivers and co-packaged optics solutions.

Key Points: 
  • TORONTO, March 02, 2023 (GLOBE NEWSWIRE) -- POET Technologies Inc. (“POET” or the “Company”) (TSX Venture: PTK; NASDAQ: POET), the designer and developer of the POET Optical Interposer™ and Photonic Integrated Circuits (PICs) for the data center, telecommunication and artificial intelligence markets, today announced “POET Infinity™”, a chiplet-based transmitter platform for 400G, 800G and 1.6T pluggable transceivers and co-packaged optics solutions.
  • POET will showcase a live demonstration of early samples at the 2023 Optical Fiber Communication Conference and Exhibition (OFC) in San Diego from March 7-9 in Booth #5311.
  • The POET Infinity chiplet incorporates 100G PAM4 directly modulated lasers (DML), DML drivers and an integrated optical multiplexer for a complete 400GBASE-FR4 transmitter solution on a chip.
  • The small size of the chiplet and a daisy chain architecture enable side-by-side placement of multiple chiplets to achieve 800G and 1.6T speeds.

MACOM to Showcase Latest Semiconductor Innovations at Optical Networking and Communications (OFC) Conference

Retrieved on: 
Wednesday, March 1, 2023
Consumer Electronics, Technology, Semiconductor, Other Technology, Telecommunications, Software, Networks, Internet, VoIP, Mobile, Wireless, Hardware, Cloud, EML, ACC, PURE, Optical networking, OFC, APD, TIA, PON, TIDEL Park Coimbatore, Conference, Global Communications Conference, DSP, Mobile phone, Printed circuit board, NRZ

MACOM Technology Solutions Inc. (“MACOM”) today announced that it will host live demonstrations of its products at the Optical Networking and Communications Conference (“OFC”) in San Diego, California, March 7–9, 2023, Booth #3927.

Key Points: 
  • MACOM Technology Solutions Inc. (“MACOM”) today announced that it will host live demonstrations of its products at the Optical Networking and Communications Conference (“OFC”) in San Diego, California, March 7–9, 2023, Booth #3927.
  • MACOM’s optical and high-speed data IC design, product management and applications engineering teams will provide in-depth explanations of MACOM’s advanced semiconductor solutions and benefits.
  • Customers will have the opportunity to ask questions and interact with MACOM staff during the demonstrations.
  • These demonstrations, feature new product additions to MACOM’s broad portfolio of optical and high speed analog and mixed signal solutions.