TFLN

IDTechEx Release New Global Silicon Photonics and Photonic Integrated Circuits Market Report

Retrieved on: 
Friday, April 19, 2024
Lithium, PIC, AI, Coherence, Research, Photonic integrated circuit, Silicon, Die (integrated circuit), TFLN, Lidar, Growth, Microscope

BOSTON, April 19, 2024 /PRNewswire/ -- IDTechEx Research, a trusted provider of independent market intelligence, announces the availability of a new report, " Silicon Photonics and Photonic Integrated Circuits 2024-2034: Market, Technologies, and Forecasts ".

Key Points: 
  • BOSTON, April 19, 2024 /PRNewswire/ -- IDTechEx Research, a trusted provider of independent market intelligence, announces the availability of a new report, " Silicon Photonics and Photonic Integrated Circuits 2024-2034: Market, Technologies, and Forecasts ".
  • This new report looks at key market players, emerging materials (such as TFLN, and BTO), and new applications such as AI, to forecast the growth of the Silicon Photonics and Photonic Integrated Circuit (PIC) market.
  • Detailed examination of the latest innovations in Silicon Photonics and Photonic Integrated Circuits is provided, alongside key technical trends, analysis across the value chain, major player analysis, and granular market forecasts.
  • This PIC and Silicon Photonics market report provides the following information:
    Benchmarks and comparisons of photonic materials, with an industry breakdown by material.

IDTechEx Release New Global Silicon Photonics and Photonic Integrated Circuits Market Report

Retrieved on: 
Friday, April 19, 2024
Lithium, Programmable interrupt controller, PIC, AI, Coherence, Research, Photonic integrated circuit, Silicon, Die (integrated circuit), TFLN, Lidar, Growth, Microscope

BOSTON, April 19, 2024 /PRNewswire/ -- IDTechEx Research, a trusted provider of independent market intelligence, announces the availability of a new report, " Silicon Photonics and Photonic Integrated Circuits 2024-2034: Market, Technologies, and Forecasts ".

Key Points: 
  • BOSTON, April 19, 2024 /PRNewswire/ -- IDTechEx Research, a trusted provider of independent market intelligence, announces the availability of a new report, " Silicon Photonics and Photonic Integrated Circuits 2024-2034: Market, Technologies, and Forecasts ".
  • This new report looks at key market players, emerging materials (such as TFLN, and BTO), and new applications such as AI, to forecast the growth of the Silicon Photonics and Photonic Integrated Circuit (PIC) market.
  • Detailed examination of the latest innovations in Silicon Photonics and Photonic Integrated Circuits is provided, alongside key technical trends, analysis across the value chain, major player analysis, and granular market forecasts.
  • This PIC and Silicon Photonics market report provides the following information:
    Benchmarks and comparisons of photonic materials, with an industry breakdown by material.

HyperLight Expands Electro-Optical Modulator Product Line to 110GHz, 65GHz, and 20GHz with Sub-Volt Half-Wave Voltage

Retrieved on: 
Wednesday, March 20, 2024
Technology, Mobile, Wireless, Semiconductor, Engineering, Telecommunications, Nanotechnology, Manufacturing, Internet, Hardware, Conference, EOM, Thorlabs, MX110, TFLN, Modulation, Hertz, Programmable interrupt controller, PIC, Multimedia, Mobile phone

HyperLight, the leading provider of integrated electro-optical modulators (EOMs), is proud to announce the expansion of its intensity modulator series.

Key Points: 
  • HyperLight, the leading provider of integrated electro-optical modulators (EOMs), is proud to announce the expansion of its intensity modulator series.
  • This announcement underscores HyperLight’s continued commitment to cutting edge innovation of photonics integrated circuits (PICs).
  • HyperLight is adding a new low half-wave-voltage (Vπ) 65 GHz Intensity Modulator to its modulator line-up.
  • Concurrently, HyperLight is unveiling the 20 GHz Ultra Low Vπ Intensity Modulator, achieving a groundbreaking Vπ of

NTT to Host Upgrade 2024 Global Research & Innovation Summit

Retrieved on: 
Monday, March 11, 2024
Technology, Security, Other Technology, Health Technology, Software, Networks, Internet, Health, Data Management, IOT (Internet of Things), Pixar, Wireless network, PHI, Information, POC, LLM, The Walt Disney Company, Reality, Photosynthesis, Research, Microsoft, Instrument, MEI, Lucasfilm, CO2, Master of ceremonies, Privacy, Metreon, Physics, Climate change, Luhn algorithm, Intelligence, Nippon Telegraph and Telephone, NTT Data, AI, Student, TFLN, Sustainability, Machine learning, CIS, Data wrangling, Public sector, APN, Cloud computing, NTT, Ecosystem, DARPA, Mobile phone

NTT Research, Inc. , a division of NTT (TYO:9432), today announced plans to hold Upgrade 2024 , NTT’s Global Research & Innovation Summit, on April 10-11, 2024.

Key Points: 
  • NTT Research, Inc. , a division of NTT (TYO:9432), today announced plans to hold Upgrade 2024 , NTT’s Global Research & Innovation Summit, on April 10-11, 2024.
  • Day 2 (April 11) of Upgrade 2024 will kick-off at the Metreon with remarks by NTT Research President Gomi.
  • The second, on basic research, features NTT Venture Capital (VC) Founding Partner Vab Goel, NTT Senior Executive Vice President CTO Katsuhiko Kawazoe and NTT Research President Gomi.
  • NTT Research invites business leaders, students, academics, researchers and journalists to attend, as well as NTT customers, employees, partners and stakeholders.

Quantum Computing Inc. Selects Tempe, Arizona as the Site for its Quantum Photonic Chip Foundry

Retrieved on: 
Thursday, September 21, 2023
Lithium, CHIPS, News, Workforce, Science, State, GE HealthCare, Institute for Supply Management, University, Nanophotonics, Innovation, Research, Government, Sale, CHIPS and Science Act, U.S. News & World Report, Creativity, Organization, Motorola, QCI, Machine learning, Linear Technology, Texas Instruments, Engineering, Economic development, Iridium, Honeywell, Artificial intelligence, ASU, Environment, Arizona State University Research Park, TFLN, Microscope, Video game

A characteristic feature of these chips is heightened scalability and performance advantages such as speed, accuracy and ultra low electric power consumption.

Key Points: 
  • A characteristic feature of these chips is heightened scalability and performance advantages such as speed, accuracy and ultra low electric power consumption.
  • Lithium niobate nanophotonic circuits (quantum chips) will be used in QCi's products and for general sale in the market as well.
  • The selection of this site aims to promote cooperation, creativity and leverage the park's pre-existing infrastructure and skilled workforce.
  • "The quantum photonic chip facility is poised to make a significant impact in the United States by becoming the first US-based developer and producer of thin film lithium niobate chips.

NTT Research Announces Plans to Double the Size of its Optics Lab

Retrieved on: 
Wednesday, March 15, 2023
Technology, Science, Other Technology, Research, Silicon, Ames Research Center, Swinburne University of Technology, OPOS, CIM, University of Notre Dame, Stanford University, Tokyo Institute of Technology, CIMS, California Institute of Technology, MIT, Physics, Quantum optics, NTT, Computer, Algorithm, SAT, Astronomy, University, Coherence, Ising, Cornell University, See, Applied Physics Letters, PHI, TFLN, Nippon Telegraph and Telephone, Phi Lab, 3D printing, Medical imaging

NTT Research, Inc. , a division of NTT (TYO:9432), today announced plans to double the size of its optical research facility in 2023.

Key Points: 
  • NTT Research, Inc. , a division of NTT (TYO:9432), today announced plans to double the size of its optical research facility in 2023.
  • “We are excited to announce these expansion plans,” PHI Lab Director Yoshihisa Yamamoto said.
  • This hybrid-remote smart workplace, named the NTT OneVision Center, features collaboration-focused spaces, working pods and offices for research staff.
  • It is also conducting joint research with the NASA Ames Research Center in Silicon Valley and 1QBit, a private quantum computing software company.

HyperLight Announces Thin-film Lithium Niobate Transmitter Chips Supporting Energy Efficient 1.6 Tbps Transceiver Modules

Retrieved on: 
Tuesday, March 7, 2023
Technology, Mobile, Wireless, Semiconductor, Engineering, Telecommunications, Nanotechnology, Manufacturing, Internet, Hardware, McGill University, PIC, Electricity, TFLN, Arista Networks, Canada Research Chair, Silicon, OSFP, DCI, Cloud computing, Computer, Video game, Computer data storage, Sorrell Hiperlight

Traditionally, high-performance solutions such as bulk lithium niobate have been used in the telecommunication industry, while lower cost solutions such as silicon photonics PICs are deployed in datacom applications.

Key Points: 
  • Traditionally, high-performance solutions such as bulk lithium niobate have been used in the telecommunication industry, while lower cost solutions such as silicon photonics PICs are deployed in datacom applications.
  • For datacom direct-detection links, HyperLight’s Tx PICs are demonstrated in 200 Gbps per lane 800G-DR4 OSFP modules.
  • In addition, HyperLight’s PICs have the potential to be employed in direct linear drive standard form factor modules to reduce energy to 5 pJ/bit.
  • “We are excited to see that our technology is providing our customers key advantages from datacenter, DCI to long-haul communications.”

Linktel Live OFC Demo of 800G OSFP TFLN on MultiLane BERT

Retrieved on: 
Wednesday, March 8, 2023
TFLN, Thin film, BERT, SAN, Business development, Ecosystem, Computer data storage

SAN DIEGO, March 8, 2023 /PRNewswire/ -- Linktel Technologies Co., Ltd. (OFC Booth #2531) and MultiLane, Inc. (Booth #5809) are conducting live BERT demo of 800G OSFP with TFLN (Thin Film LiNbO3) technology platform.

Key Points: 
  • SAN DIEGO, March 8, 2023 /PRNewswire/ -- Linktel Technologies Co., Ltd. (OFC Booth #2531) and MultiLane, Inc. (Booth #5809) are conducting live BERT demo of 800G OSFP with TFLN (Thin Film LiNbO3) technology platform.
  • The 800G Optical Transceiver with TFLN modulator enables customers to meet current high-speed demands of data-intensive applications.
  • "We are excited to support Linktel in yet another live demonstration of their advancements in 800G optics," says Hani Daou, Business Development Manager at MultiLane.
  • "MultiLane's 800G test equipment ecosystem enables our partners like Linktel to prove the maturity of the latest generation of transceiver technology".

Eoptolink Showcasing Industry Most Power-Efficient 800G Optical Transceivers at OFC 2023

Retrieved on: 
Wednesday, March 8, 2023
TFLN, DSP, OFC, SZSE, TIA, PIC, OSFP, Telecommunications

CHENGDU, China and FREMONT, Calif. , March 8, 2023 /PRNewswire/ -- Eoptolink Technology Inc., Ltd. (SZSE: 300502), a leading provider of optical transceiver solutions and services, has announced that it will showcase its newest and most power-efficient 800G optical transceivers at OFC 2023.

Key Points: 
  • CHENGDU, China and FREMONT, Calif. , March 8, 2023 /PRNewswire/ -- Eoptolink Technology Inc., Ltd. (SZSE: 300502), a leading provider of optical transceiver solutions and services, has announced that it will showcase its newest and most power-efficient 800G optical transceivers at OFC 2023.
  • The company has continuously pushed the power limits of high-speed transceivers, and it is currently sampling the second generation of 800G DR8+ and 2xFR4 silicon photonics-based transceivers.
  • Eoptolink has also launched 5nm DSP-based EML and silicon photonics 800G transceivers with power consumption of
  • A live demonstration all these low power 800G transceivers will be shown at Eoptolink's booth #3327 at OFC 2023 in San Diego.

Eoptolink Launched 1.6T and 800G Optical Transceivers by Using 200G/lambda Optics

Retrieved on: 
Monday, March 6, 2023
Lithium, Silicon, FR4, OFC, EMLE, SZSE, TFLN, Silicon photonics, Laser, Intensity, OSFP, FR2, Printed circuit board

The next step in the evolution of Intensity Modulated-Direct Detect (IM-DD) Optics is the increase of data rate from 100Gbps to 200Gbps per wavelength.

Key Points: 
  • The next step in the evolution of Intensity Modulated-Direct Detect (IM-DD) Optics is the increase of data rate from 100Gbps to 200Gbps per wavelength.
  • Eoptolink will be demonstrating 200Gbps per lambda modules based on EMLs, and Silicon Photonics modulators as well as Thin-Film Lithium Niobate (TFLN) modulators.
  • The 800G DR4, FR4 and 2xFR2 modules use 8x 100Gbps signals on the electrical interface and four 200G wavelengths on the optical interface.
  • A live demonstration of these products will be shown at Eoptolink's booth #3327 at OFC 2023 in San Diego.