NEXTFLEX

NextFlex Announces Over $17 Million in Funding for Flexible Hybrid Electronics Innovations in Harsh Environment Reliability, Printing of Conformal Circuits, and Low Cost 5G Antennas

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Wednesday, March 30, 2022
Technology, Aerospace, Manufacturing, Mobile, Wireless, Other Manufacturing, Hardware, Adoption, FHE, LinkedIn, Air Force Research Laboratory, PCB, Aircraft, United States Department of Defense, Northrop Grumman, University, University of Massachusetts Lowell, Doctor of Philosophy, Sporting Arms and Ammunition Manufacturers' Institute, Industry, Silicon, Northrop, Twitter, SATCOM, Grumman, Facebook, Solution, Electronics, Auburn University, Partnership, Printed circuit board, Communications satellite, NEXTFLEX, FLEXIBLE HYBRID ELECTRONICS (FHE)

This latest round of funding brings the total amount invested in FHE developments to over $116M, including cost share contributions from prior Project Call participants.

Key Points: 
  • This latest round of funding brings the total amount invested in FHE developments to over $116M, including cost share contributions from prior Project Call participants.
  • This latest round of projects focus broadly on critical FHE manufacturing developments that have been prioritized in the NextFlex FHE Manufacturing Roadmaps, said Malcolm Thompson, PhD, Executive Director, NextFlex.
  • NextFlex is a DoD sponsored Manufacturing Innovation Institute funded by Air Force Research Laboratory Cooperative Agreement numbers FA8650-15-2-5402 and FA8650-20-2-5506.
  • Hybrid electronics are providing PCB and heterogeneous packaging manufacturers with novel additive electronics manufacturing solutions.

NextFlex Awards Five Flexible Hybrid Electronics Pioneers with 2022 Fellow Awards

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Thursday, March 3, 2022
Consumer Electronics, Technology, Manufacturing, Semiconductor, Other Manufacturing, Other Defense, Defense, Packaging, Engineering, Hardware, Electronic Design Automation, Combat, Engineering education, PCB, Leadership, TUM Department of Electrical and Computer Engineering, Picatinny Arsenal, Workforce development, United States Army Futures Command, Twitter, Ecosystem, Computer engineering, Knowledge, LinkedIn, McNaughton, United States Department of Defense, Solution, Program, Microfluidics, National Guard, United States Army Combat Capabilities Development Command, James McKeen Cattell Fellow Award, Technical Working Groups, Â, Multimedia, Electronics, FHE, Western Michigan University, Veteran, Conference, Fellows, Lieutenant, Massood Tabib-Azar, Electricity, Sporting Arms and Ammunition Manufacturers' Institute, Facebook, Technical advisor, Government, Silicon, Department, Applied science, United States Army CCDC Armaments Center, Management, Risk management, Engineering, NextFlex, Flexible Hybrid Electronics (FHE), NEXTFLEX, FLEXIBLE HYBRID ELECTRONICS (FHE)

NextFlex, Americas Flexible Hybrid Electronics (FHE) Manufacturing Institute, presented the annual NextFlex Fellow Awards to five deserving individuals, recognizing their outstanding contributions to FHE.

Key Points: 
  • NextFlex, Americas Flexible Hybrid Electronics (FHE) Manufacturing Institute, presented the annual NextFlex Fellow Awards to five deserving individuals, recognizing their outstanding contributions to FHE.
  • Each year, NextFlex presents Fellow Awards to individuals who have gone above and beyond to positively impact the FHE manufacturing community.
  • Nick has been instrumental in working inside TTM Technologies to expand the circle of interest in flexible and printed hybrid electronics and NextFlex activities.
  • Jim is a thought leader and is pivotal to the successful development of 3D printed hybrid electronics and conformal electronics.

NextFlex® Launches $11.5 Million Funding Round for Flexible Hybrid Electronics Innovations to Address Manufacturing Challenges and Expand Technology Adoption

Retrieved on: 
Tuesday, February 22, 2022
Hardware, Chemicals, Plastics, Electronic Design Automation, Semiconductor, Automotive Manufacturing, Aerospace, Manufacturing, Consumer Electronics, Technology, Transport, Other Technology, Other Manufacturing, Logistics, Supply Chain Management, Packaging, Engineering, Government, Sporting Arms and Ammunition Manufacturers' Institute, Twitter, Department of Defence, Department, Robotics, Silicon, Defense, Industry, Facebook, Electronics, FHE, Adoption, LinkedIn, Wireless asset monitoring system, Technology, PCB, United States Department of Defense, Solution, Doctor of Philosophy, Risk management, Microfluidics, NextFlex, Flexible Hybrid Electronics (FHE), NEXTFLEX, FLEXIBLE HYBRID ELECTRONICS (FHE)

Areas of emphasis include FHE enabled manufacturing for automotive applications, additive approaches to FHE device fabrication, applying hybrid electronic manufacturing to applications in advanced packaging, and exploring how FHE manufacturing can support improved environmental sustainability in electronics manufacturing.

Key Points: 
  • Areas of emphasis include FHE enabled manufacturing for automotive applications, additive approaches to FHE device fabrication, applying hybrid electronic manufacturing to applications in advanced packaging, and exploring how FHE manufacturing can support improved environmental sustainability in electronics manufacturing.
  • We are delighted to announce this new round of funding for advanced manufacturing developments in the US, said Malcolm Thompson, PhD, Executive Director of NextFlex.
  • With each successive project call, the NextFlex member community moves the technology closer to commercialization and wide adoption.
  • NextFlex is a DoD sponsored Manufacturing Innovation Institute funded by Air Force Research Laboratory Cooperative Agreement numbers FA8650-15-2-5402 and FA8650-20-2-5506.