UMC Introduces Industry’s First 3D IC Solution for RFSOI, Accelerating Innovations in the 5G Era
United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, today announced the industry’s first 3D IC solution for RFSOI technology.
- United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, today announced the industry’s first 3D IC solution for RFSOI technology.
- RFSOI is the foundry process used for RF chips such as low noise amplifiers, switches, and antenna tuners.
- Utilizing wafer-to-wafer bonding technology, UMC’s 3D IC solution for RFSOI resolves the common issue of RF interference between stacked dies.
- “We are proud to lead the industry in offering this state-of-the-art solution utilizing our innovative 3D IC technology for RF-FEM.