Marvell Showcases Technology for Next-Generation AI and Cloud Networks at OCP Global Summit
SANTA CLARA, Calif., Oct. 17, 2023 /PRNewswire/ -- Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, will share its vision for advancing the next generation of AI and cloud networks at the 2023 Open Compute Project (OCP) Global Summit taking place October 17-19 at the San Jose Convention Center in San Jose, California.
- Nguyen's presentation, "AI Drives the Need for (More) Speed," will discuss the ways optical technology can meet the AI bandwidth challenge and how collaboration across the ecosystem is advancing innovation to scale AI platforms.
- Live demonstrations include:
Marvell® Teralynx® 10 , an ultra-low latency, programmable 51.2 Tbps switch chip optimized for multi-tenant AI and cloud architectures. - Marvell long-reach SerDes circuit for 64G PCIe Gen6 built on a 3nm process node and optimized for composable cloud infrastructure.
- Marvell PAM4 DSP technology enabling 200 Gbps per lane over electrical channels for next-generation cloud data center and high-performance computing connectivity.