X75

Telit Cinterion Introduces the Latest 5G eMBB LGA Modules at MWC Barcelona 2024, Powered by the Snapdragon X72 5G Modem-RF System

Retrieved on: 
Thursday, February 22, 2024

IRVINE, Calif., Feb. 22, 2024 /PRNewswire/ -- Telit Cinterion, an end-to-end IoT solutions enabler, announces the Telit Cinterion FE990B34/40 LGA family of modules, powered by the Snapdragon® X72 5G Modem-RF System from Qualcomm Technologies, Inc.

Key Points: 
  • IRVINE, Calif., Feb. 22, 2024 /PRNewswire/ -- Telit Cinterion, an end-to-end IoT solutions enabler, announces the Telit Cinterion FE990B34/40 LGA family of modules, powered by the Snapdragon® X72 5G Modem-RF System from Qualcomm Technologies, Inc.
  • The new modules also feature 5G sub-6 technology with gigabit LTE and WCDMA support, along with a highly advanced multi-constellation GNSS receiver.
  • "The FE990B34/40 LGA family of modules, backed by Qualcomm Technologies' advanced 5G X72 and X75 chipset, is emblematic of the tremendous strides being made in 5G connectivity," said Manish Watwani, Chief Marketing and Product Officer at Telit Cinterion.
  • "With unparalleled processing power and versatile interfaces, these new modules embody our dedication to pushing the boundaries of innovation in IoT solutions while empowering developers to create groundbreaking 5G-enabled devices."

ACEBEAM's Shining Success at SHOT Show 2024

Retrieved on: 
Tuesday, February 20, 2024

LAS VEGAS, Feb. 20, 2024 /PRNewswire/ -- ACEBEAM is greeting all flashlight enthusiasts and modern outdoor adventurers and thrilled to share the exciting highlights from its participation in the prestigious SHOT Show 2024 (American Shooting, Hunting, and Outdoor Products Show).

Key Points: 
  • LAS VEGAS, Feb. 20, 2024 /PRNewswire/ -- ACEBEAM is greeting all flashlight enthusiasts and modern outdoor adventurers and thrilled to share the exciting highlights from its participation in the prestigious SHOT Show 2024 (American Shooting, Hunting, and Outdoor Products Show).
  • As pioneers in high-power outdoor lighting tools, ACEBEAM has once again raised the bar for innovation, performance, and design.
  • At SHOT Show 2024, ACEBEAM dazzled attendees with a stellar lineup of cutting-edge products, demonstrating its unwavering commitment to pushing the boundaries of outdoor lighting technology.
  • As ACEBEAM looks back on its experience at SHOT Show 2024, it's clear that the outdoor and shooting industries are constantly evolving.

ACEBEAM's Shining Success at SHOT Show 2024

Retrieved on: 
Tuesday, February 20, 2024

LAS VEGAS, Feb. 20, 2024 /PRNewswire/ -- ACEBEAM is greeting all flashlight enthusiasts and modern outdoor adventurers and thrilled to share the exciting highlights from its participation in the prestigious SHOT Show 2024 (American Shooting, Hunting, and Outdoor Products Show).

Key Points: 
  • LAS VEGAS, Feb. 20, 2024 /PRNewswire/ -- ACEBEAM is greeting all flashlight enthusiasts and modern outdoor adventurers and thrilled to share the exciting highlights from its participation in the prestigious SHOT Show 2024 (American Shooting, Hunting, and Outdoor Products Show).
  • As pioneers in high-power outdoor lighting tools, ACEBEAM has once again raised the bar for innovation, performance, and design.
  • At SHOT Show 2024, ACEBEAM dazzled attendees with a stellar lineup of cutting-edge products, demonstrating its unwavering commitment to pushing the boundaries of outdoor lighting technology.
  • As ACEBEAM looks back on its experience at SHOT Show 2024, it's clear that the outdoor and shooting industries are constantly evolving.

Fibocom Boosts the Mobile Broadband Market by Introducing Pioneering 5G FWA Solution Embedded with FG190 and FG180 5G Modules at MWC Shanghai 2023

Retrieved on: 
Thursday, June 29, 2023

SHANGHAI, June 29, 2023 /PRNewswire/ -- Fibocom, a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, introduces the pioneering 5G FWA solution based on the latest generation 5G modules FG190 and FG180 at MWC Shanghai 2023. The solution offers a wide range of flexible configurations and multiple enhancements to CPE and mobile hot-spot customers, significantly reducing the complexity to deploy advanced 5G solutions and accelerate the time to market.

Key Points: 
  • SHANGHAI, June 29, 2023 /PRNewswire/ -- Fibocom, a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, introduces the pioneering 5G FWA solution based on the latest generation 5G modules FG190 and FG180 at MWC Shanghai 2023.
  • The cutting-edge 5G FWA solution specialized in CPE and mobile hot-spot use cases, embedded with Fibocom's latest generation 5G Sub-6GHz and mmWave modules FG190 and FG180.
  • In software design, Fibocom's cutting-edge 5G FWA solution embedded with FG190 and FG180 is loaded with OpenWRT, which allows maximum customization for CPE and mobile hot-spot customers.
  • Welcome to visit Fibocom and get to know more about the newly launched 5G FWA solution at stand #B80 in Hall N1 at MWC Shanghai 2023.

Fibocom to Launch the Leading-Edge 5G Sub-6GHz and mmWave Module Fx190/Fx180 Series Based on Snapdragon X75 and X72 5G Modem-RF System at MWC Barcelona 2023

Retrieved on: 
Wednesday, March 1, 2023

BARCELONA, Spain, March 1, 2023 /PRNewswire/ -- Fibocom Wireless Inc.,(300638.SZ) a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, to announce the launch of the leading-edge 5G Sub-6GHz and mmWave module Fx190(W)/Fx180(W) series at MWC Barcelona 2023. Adopting multiple innovations from the world's first 5G Advanced-ready modem-RF system, Snapdragon X75 and X72, the modules are set to bring outstanding cellular performance to mass data transmission applications such as mobile broadband, FWA, enterprise 5G, and IIoT.

Key Points: 
  • During MWC Barcelona 2023, Fibocom to unveil the 5G Sub-6GHz and mmWave module Fx190/Fx180 series based on Snapdragon® X75 and X72 5G Modem-RF System, by integrating AI innovations in architecture design, significantly improves 5G cellular capabilities and spectrum utilization.
  • Equipped with Qualcomm® 5G AI Processor Gen 2, Snapdragon X75 is the world's first modem-RF system with a dedicated AI tensor accelerator.
  • It is worth noting that FM190/FM180 series are M.2 standard and pin compatible with Fibocom FM170/FM160/FM150 5G module series.
  • "We are proud of cooperating with Qualcomm Technologies, the most valuable partner of Fibocom to launch the leading-edge 5G Sub-6GHz and mmWave module series Fx190(W)/Fx180(W) based on Snapdragon X75 and X72 at MWC Barcelona 2023," said Dan Schieler, SVP of IoT Overseas Sales Department, Fibocom.

Quectel Announces New Generation 5G Release 17 Module Series to Address Growing 5G FWA and eMBB Markets

Retrieved on: 
Monday, February 27, 2023

MWC BARCELONA – Quectel Wireless Solutions, a global IoT solutions provider, today announces the launch of its latest generation 5G New Radio (NR) module series, the RG650E and RG650V, both of which follow the 3GPP Release 17 standard.

Key Points: 
  • MWC BARCELONA – Quectel Wireless Solutions, a global IoT solutions provider, today announces the launch of its latest generation 5G New Radio (NR) module series, the RG650E and RG650V, both of which follow the 3GPP Release 17 standard.
  • These industrial grade 5G modules deliver enhanced performance in data rates, capacity, power saving, and latency as well as ultra-reliability, better addressing the growing 5G fixed wireless access (FWA), enhanced mobile broadband (eMBB), and industrial automation markets.
  • View the full release here: https://www.businesswire.com/news/home/20230226005190/en/
    Quectel announces new generation 5G Release 17 module series to address growing 5G FWA and eMBB markets (Photo: Business Wire)
    Based on the latest Snapdragon® X75 and X72 5G Modem-RF Systems from Qualcomm Technologies, Inc., the RG650E and RG650V series can work on both 5G non-standalone (NSA) and standalone (SA) modes.
  • The Quectel 5G module offering is complemented by its range of antennas which help optimize connection efficiency and aid ease of installation of devices.