USB 3.1

Fibocom Announces the Private 5G Module FM160-PN to Accelerate the Private 5G Adoption in the North America Market

Retrieved on: 
Thursday, March 23, 2023
Communication, Private, Health, PCI Express, DL, M.2, USB, UL, Organization, Internet, R16, Strategic partnership, CBRS, USB 3.1, 3GPP, Transport, Mobile phone, Internet of things

SHENZHEN, China, March 23, 2023 /PRNewswire/ -- Fibocom Wireless Inc., a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, to launch the private 5G Sub-6GHz module FM160-PN, compliant with 3GPP Release 16 and support NR CA as well as CBRS band, the FM160-PN is tailor-made for private network applications such as manufacturing, logistics, 5G mining, utilities, etc.

Key Points: 
  • Fibocom FM160-PN is a high-performance 5G Sub-6GHz module with multi-MIMO technology, and dedicated band support for Private 5G deployments.
  • The FM160-PN provides a reliable and cost-effective 5G experience for IoT devices being deployed on private networks.
  • The adoption of private networks is increasing as more businesses recognize the benefits of this technology.
  • "Private 5G networks are currently being used in a range of industries, including manufacturing, transportation, healthcare, and logistics, among others.

DFI Reveals New PCSF51 1.8" SBC with High Performance AMD Ryzen™ R2000 Processor for Industrial Applications

Retrieved on: 
Monday, March 13, 2023
Machine learning, SBC, Industrial, AI, CPU, Bit, Robotics, R2000, USB 3.1, DDR4, DFI, MultiMediaCard, Embedded, AMD, USB, HDMI, Video game

The 1.8" SBC powered by the revolutionary AMD Ryzen™ Embedded R2000 Processor, the PCSF51 features advanced graphics processing and computing capabilities in a miniature form factor.

Key Points: 
  • The 1.8" SBC powered by the revolutionary AMD Ryzen™ Embedded R2000 Processor, the PCSF51 features advanced graphics processing and computing capabilities in a miniature form factor.
  • Equipped with flexible expandability and I/O versatility, this energy-efficient SBC is tailored for use in industrial applications, robotics, edge computing, AI vision systems, and more.
  • "By leveraging the latest AMD Ryzen™ Embedded R2000 Processor, we have achieved many advantages for the tiny yet powerful PCSF51," said DFI President Alexander Su.
  • DFI's next generation Industrial Pi is the improved successor of Pi SBC that meets the needs of Industrial IoT with greater performance and durability and opens up new application possibilities.

Fibocom to Launch the Leading-Edge 5G Sub-6GHz and mmWave Module Fx190/Fx180 Series Based on Snapdragon X75 and X72 5G Modem-RF System at MWC Barcelona 2023

Retrieved on: 
Wednesday, March 1, 2023
UART, UIM, OpenWrt, Industrial internet of things, M.2, MiFi, Qualcomm, MWC, High-pass filter, CPE, MLO, LGA, CPU, USB 3.1, IEEE 802.11be, Internet, USB, FWA, NR, A55, SVP Worldwide, PCI Express, SVP, 3GPP, Industrial, X75, Communication, Wi-Fi, I2S, Mobile phone, Renewable energy, Ethernet, Internet of things

BARCELONA, Spain, March 1, 2023 /PRNewswire/ -- Fibocom Wireless Inc.,(300638.SZ) a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, to announce the launch of the leading-edge 5G Sub-6GHz and mmWave module Fx190(W)/Fx180(W) series at MWC Barcelona 2023. Adopting multiple innovations from the world's first 5G Advanced-ready modem-RF system, Snapdragon X75 and X72, the modules are set to bring outstanding cellular performance to mass data transmission applications such as mobile broadband, FWA, enterprise 5G, and IIoT.

Key Points: 
  • During MWC Barcelona 2023, Fibocom to unveil the 5G Sub-6GHz and mmWave module Fx190/Fx180 series based on Snapdragon® X75 and X72 5G Modem-RF System, by integrating AI innovations in architecture design, significantly improves 5G cellular capabilities and spectrum utilization.
  • Equipped with Qualcomm® 5G AI Processor Gen 2, Snapdragon X75 is the world's first modem-RF system with a dedicated AI tensor accelerator.
  • It is worth noting that FM190/FM180 series are M.2 standard and pin compatible with Fibocom FM170/FM160/FM150 5G module series.
  • "We are proud of cooperating with Qualcomm Technologies, the most valuable partner of Fibocom to launch the leading-edge 5G Sub-6GHz and mmWave module series Fx190(W)/Fx180(W) based on Snapdragon X75 and X72 at MWC Barcelona 2023," said Dan Schieler, SVP of IoT Overseas Sales Department, Fibocom.

MediaTek Unveils New AIoT Platform Stack and Introduces the Genio 1200 AIoT Chip

Retrieved on: 
Tuesday, May 10, 2022
Metaverse, IOS SDK, GPU, Wi-Fi, IOT, Original equipment manufacturer, PCI Express, CV, Align Technology, Tablet, Software, CPU, SDK, APU, IEEE 802.11ax-2021, Project plan, Bluetooth, Yocto-, Industry, The Computer Connection, Connectivity, VAD, Efficiency, USB 3.1, Writing, TOPS, Gigabit Ethernet, MediaTek, Life, Goal, Technology, Socs, TWSE, USB, AI, SOC, General manager, Design, Video game console, Mobile phone, Quidgest

SCOTTSDALE, Ariz., May10, 2022 /PRNewswire/ -- MediaTek today unveiled its new Genio platform for AIoT devices and introduced the first chip in the Genio family, the Genio 1200 designed for premium AIoT products.

Key Points: 
  • With the MediaTek Genio platform stack, designers and OEMs can bring differentiated and secure intelligent devices to market faster
    SCOTTSDALE, Ariz., May10, 2022 /PRNewswire/ -- MediaTek today unveiled its new Genio platform for AIoT devices and introduced the first chip in the Genio family, the Genio 1200 designed for premium AIoT products.
  • MediaTek Genio is a complete platform stack for the AIoT with powerful and ultra-efficient chipsets, open platform software development kits (SDKs) and a developer portal with comprehensive resources and tools.
  • With MediaTek Genio, customers have access to all the hardware, software and resources needed to go from concept to design and manufacturing.
  • The Genio open platform AIoT SDK allows designers to customize multiple products with the same software pack, which supports Yocto Linux.

MediaTek Unveils New AIoT Platform Stack and Introduces the Genio 1200 AIoT Chip

Retrieved on: 
Tuesday, May 10, 2022
Metaverse, IOS SDK, GPU, Wi-Fi, IOT, Original equipment manufacturer, PCI Express, CV, Align Technology, Tablet, Software, CPU, SDK, APU, IEEE 802.11ax-2021, Project plan, Bluetooth, Yocto-, Industry, The Computer Connection, Connectivity, VAD, Efficiency, USB 3.1, Writing, TOPS, Gigabit Ethernet, MediaTek, Life, Goal, Technology, Socs, TWSE, USB, AI, SOC, General manager, Design, Video game console, Mobile phone, Quidgest

SCOTTSDALE, Ariz., May 10, 2022 /PRNewswire/ -- MediaTek today unveiled its new Genio platform for AIoT devices and introduced the first chip in the Genio family, the Genio 1200 designed for premium AIoT products.

Key Points: 
  • With the MediaTek Genio platform stack, designers and OEMs can bring differentiated and secure intelligent devices to market faster
    SCOTTSDALE, Ariz., May 10, 2022 /PRNewswire/ -- MediaTek today unveiled its new Genio platform for AIoT devices and introduced the first chip in the Genio family, the Genio 1200 designed for premium AIoT products.
  • MediaTek Genio is a complete platform stack for the AIoT with powerful and ultra-efficient chipsets, open platform software development kits (SDKs) and a developer portal with comprehensive resources and tools.
  • With MediaTek Genio, customers have access to all the hardware, software and resources needed to go from concept to design and manufacturing.
  • The Genio open platform AIoT SDK allows designers to customize multiple products with the same software pack, which supports Yocto Linux.

e-con Systems™ launches 13MP high-resolution monochrome USB 3.1 Gen 1 camera with superior sensitivity

Retrieved on: 
Thursday, January 13, 2022
Microsoft Windows, MIPI, Monochrome, SAN, Industrial, NIR, USB 3.1, System, Solution, OEM, Linux, ISP, CMOS, Efficiency, Agriculture, Two by Two, RGB, Color, Noise, Software, USB, BSI, IBM PC compatible, Television, Camera, Online shopping, Extrinsic semiconductor

The latest addition in its portfolio is See3CAM_135M, a monochrome USB camera .

Key Points: 
  • The latest addition in its portfolio is See3CAM_135M, a monochrome USB camera .
  • Also, this camera comes with the 2x2 and 4x4 pixel binning feature that helps to enhance its sensitivity.
  • This 4K monochrome camera streams video data in Full HD @ 60 fps & 4K @ 30 fps with output formats of Y8 and Y16.
  • Availability Customers interested in evaluating See3CAM_CU135M -13MP high resolution monochrome USB 3.1 Gen 1 camera with superior sensitivity can purchase the product from e-con Systems' online store.

Parallels Desktop 17 for Mac Unveils Powerful New Features for Both Apple M1 and Intel Chip, Ready for Windows 11 and macOS Monterey

Retrieved on: 
Tuesday, August 10, 2021
Technology, IOS, UI, Apple Inc., VMS, Unified Extensible Firmware Interface, BitLocker, Support, Parallels Desktop for Mac, CorelDRAW, M1, Goal, USB 3.1, Apple, Name, Microsoft Windows, Business, Mac Fleet, Windows 10, WinZip, PRO, Mode, Microsoft Visual Studio, Monterey, California, Senior, Worklife (TV programme), USB, OS, VM, Disc, Intel, MindManager, ARM, GLOBE, Oss, Toolbox, MacOS, Android, TPM, Foregone Conclusion, Video game, Consumer electronics, Typesetting, Video game console, Computer data storage, Mobile phone, Online shopping

Parallels Desktop 17 for Mac, now a universal binary application, is optimized for the highly anticipated Windows 11 and macOS Monterey operating systems.

Key Points: 
  • Parallels Desktop 17 for Mac, now a universal binary application, is optimized for the highly anticipated Windows 11 and macOS Monterey operating systems.
  • Parallels Desktop 17 for Mac empowers users to run Windows applications on a Mac, more smoothly and faster than ever.
  • Watch a video about the highlights in Parallels Desktop 17: www.parallels.com/NEWParallelsDesktop17
    New and Enhanced Feature Highlights of Parallels Desktop 17 for Mac:
    NEW!
  • Powerful New Features for Apple M1 chip Mac: With Parallels Desktop 17, Windows 10 recognizes Mac battery status and enables battery saving when your Mac runs low of charge.