CX7

SolidRun Unveils Ryzen V3000 CX7 Com Module, Powering Next-Generation Networking and Edge Solutions

Retrieved on: 
Tuesday, February 27, 2024
ECC, MAC, Architecture, COM Express, Temperature, TEL, DDR5, SBC, CX7, SOM, RAS, Commercial, AMD, Com, 24/7 service, CPU, Mobile phone

BARCELONA, Spain and TEL AVIV, Israel, Feb. 27, 2024 /PRNewswire/ -- SolidRun, a leading developer and manufacturer of high-performance System on Module (SOM) solutions, Single Board Computers (SBC) and network edge solutions, today announced the launch of its new Ryzen™ V3000 CX7 Com module, configurable with the 8-core/16-thread Ryzen Embedded V3C48 Processor. Boasting AMD's state-of-the-art 6nm "Zen3" architecture, this ultra-powerful embedded solution offers industry-leading performance and power efficiency. As SolidRun's first x86-based Com Express 7 module, the Ryzen V3000 CX7 Com module ushers in a new era of efficient, high-performance computing for a diverse range of networking and edge applications.

Key Points: 
  • As SolidRun's first x86-based Com Express 7 module, the Ryzen V3000 CX7 Com module ushers in a new era of efficient, high-performance computing for a diverse range of networking and edge applications.
  • Based on the AMD Ryzen™ Embedded V3000 processor, SolidRun's Ryzen V3000 CX7 Com module brings unparalleled processing power, thermal efficiency, and high-speed I/O connectivity to the COM Express Type 7 form factor.
  • These integrated features make the Ryzen V3000 CX7 Com module well-suited for demanding networking, edge computing, and storage applications, where high-performance, reliability, and scalability are paramount.
  • Key Features of the Ryzen V3000 CX7 Com Module Include:
    The Ryzen V3000 CX7 Com, based on the Ryzen Embedded V3000 CPU, is available today through SolidRun .

Inspur Electronic Information Showcases Industry-Leading Server Solutions and Applications for Intelligent Manufacturing Transformation at Hannover Messe 2023

Retrieved on: 
Friday, April 14, 2023
Data Management, Automotive Manufacturing, Technology, Manufacturing, Software, Networks, Hardware, Carbon, Graphics processing unit, Hanover, WMS, BMC, Maintenance, CAE, MES, CX7, DC, Electronic Information Storage, PCI Express, ERP, Treo 700w, BIOS, Central processing unit, Energy Savings and Industrial Competitiveness Act of 2013, G7, PUE, OCP, NEC, HPC, CRM, Hannover Messe, Fourth Industrial Revolution, Quality control, Architecture, TCO, SCM, Video game

Inspur Electronic Information, a leading IT infrastructure solutions provider, will attend Hannover Messe 2023 from April 17-21.

Key Points: 
  • Inspur Electronic Information, a leading IT infrastructure solutions provider, will attend Hannover Messe 2023 from April 17-21.
  • Inspur Electronic Information will join around 4,000 companies from the mechanical engineering, electrical, and digital industries.
  • This deepens the digital and intelligent integration of supply chain, warehouse, manufacturing, quality control, logistics, delivery, service and other links.
  • Inspur Electronic Information has industry-leading computing platform solutions and expansive deployment experiences.