COM Express

ADLINK releases Intel® Amston-Lake-powered modules with up to 8 cores at 12W TDP suiting ruggedized edge solutions

Retrieved on: 
Tuesday, April 9, 2024
Temperature, COM Express, TSN, Intel, Communication, Time-Sensitive Networking, MIPI, Internet of things, LAN, LPDDR5, Transport, AI, PCI Express, Intel Atom, TCC, Robotics, USB, SMARC, Gracemont, Oklahoma, USB 3.2, HMI, TDP, Type 6, CPU, Computer data storage

SAN JOSE, Calif., April 8, 2024 /PRNewswire-PRWeb/ -- Summary:

Key Points: 
  • "Built for highly responsive on-device AI execution and at the same time can withstand ruggedized use scenarios, these new ADLINK COMs allow developers to realize various IoT edge innovations moving forward."
  • Utilizing Intel's Gracemont architecture, with broadened cache and memory bandwidth, responsive coding footprint, combined with soldered-down memory and extreme temperature option, the modules deliver superior performance with great efficiency for wide-ranging ruggedized IoT solutions at the edge.
  • For more information about ADLINK COMs, visit the product pages for: cExpress-ASL (COM Express Type 6) and LEC-ASL (SMARC) modules.
  • Stay tuned, as ADLINK is working to offer another COM Express Type 10 module based on Intel Atom X7000RE & X7000C series processors (Amston Lake).

SolidRun Unveils Ryzen V3000 CX7 Com Module, Powering Next-Generation Networking and Edge Solutions

Retrieved on: 
Tuesday, February 27, 2024
ECC, MAC, Architecture, COM Express, Temperature, TEL, DDR5, SBC, CX7, SOM, RAS, Commercial, AMD, Com, 24/7 service, CPU, Mobile phone

BARCELONA, Spain and TEL AVIV, Israel, Feb. 27, 2024 /PRNewswire/ -- SolidRun, a leading developer and manufacturer of high-performance System on Module (SOM) solutions, Single Board Computers (SBC) and network edge solutions, today announced the launch of its new Ryzen™ V3000 CX7 Com module, configurable with the 8-core/16-thread Ryzen Embedded V3C48 Processor. Boasting AMD's state-of-the-art 6nm "Zen3" architecture, this ultra-powerful embedded solution offers industry-leading performance and power efficiency. As SolidRun's first x86-based Com Express 7 module, the Ryzen V3000 CX7 Com module ushers in a new era of efficient, high-performance computing for a diverse range of networking and edge applications.

Key Points: 
  • As SolidRun's first x86-based Com Express 7 module, the Ryzen V3000 CX7 Com module ushers in a new era of efficient, high-performance computing for a diverse range of networking and edge applications.
  • Based on the AMD Ryzen™ Embedded V3000 processor, SolidRun's Ryzen V3000 CX7 Com module brings unparalleled processing power, thermal efficiency, and high-speed I/O connectivity to the COM Express Type 7 form factor.
  • These integrated features make the Ryzen V3000 CX7 Com module well-suited for demanding networking, edge computing, and storage applications, where high-performance, reliability, and scalability are paramount.
  • Key Features of the Ryzen V3000 CX7 Com Module Include:
    The Ryzen V3000 CX7 Com, based on the Ryzen Embedded V3000 CPU, is available today through SolidRun .

DFI Unveils Embedded System Module Equipped with Intel's Latest AI Processor to Enter the AI IPC Market

Retrieved on: 
Wednesday, January 31, 2024
Nervous system, DDR5, AI, GPU, COM Express, CPU, Temperature, SOM, SSD, Type 6, Ipcs, Fan (machine), Architecture, Intel, Ultra, NVM Express, NPU, DFI, LP, Video game

TAIPEI, Jan. 31, 2024 /PRNewswire/ -- DFI , the world's leading brand in embedded motherboards and industrial computers, is targeting the AI application market by launching the embedded system module (SOM) MTH968 equipped with the latest Intel® Core™ Ultra processor.

Key Points: 
  • TAIPEI, Jan. 31, 2024 /PRNewswire/ -- DFI , the world's leading brand in embedded motherboards and industrial computers, is targeting the AI application market by launching the embedded system module (SOM) MTH968 equipped with the latest Intel® Core™ Ultra processor.
  • It is the first product integrated with an NPU (Neural Processor Unit) processor, representing the official integration of AI with industrial PCs (IPCs).
  • With the expansion into AI IPC, DFI expects to inject new momentum into the AI edge computing market.
  • As 5G, edge computing, and remote control tech advance, IPCs directly handle complex tasks through AI edge computing.

Latest Generation of Industrial Processors Available Power the Newest Relio R1 Rugged Computers

Retrieved on: 
Thursday, December 14, 2023
Windows IoT, Shock, Documentation, Wi-Fi, COM Express, Computer, Communication, Temperature, CPU, Vibration, Transport, Windows 11, Sealevel Systems

LIBERTY, SC USA, Dec. 14, 2023 (GLOBE NEWSWIRE) -- Sealevel Systems announces the release of four Relio R1 Rugged Industrial Computers, the newest additions to the industry-leading Relio embedded computer line.

Key Points: 
  • LIBERTY, SC USA, Dec. 14, 2023 (GLOBE NEWSWIRE) -- Sealevel Systems announces the release of four Relio R1 Rugged Industrial Computers, the newest additions to the industry-leading Relio embedded computer line.
  • With the latest generation of industrial processors available, and a modernized video interface, these Relio R1 Rugged computers offer versatile communication with I/O for RS-232, RS-485, CAN, Wi-Fi, and Ethernet.
  • “This new family of computers capitalizes on the success of our existing Relio computers and synchronous servers while providing the future-looking processing power and diverse I/O that customers expect from Sealevel.
  • The new Relio R1 Rugged Industrial Computers have extremely rugged, anodized aluminum enclosures combined with intentional thermal management for unmitigated performance under environmental extremes.

ADLINK releases Intel® Core™ Ultra-powered COM Express Module with integrated CPU+GPU+NPU providing up to 50% in power saving

Retrieved on: 
Thursday, December 14, 2023
GPU, Compact, COM Express, ADLINK, Acceleration, MTL, Intel Core, CPU, USB4, COM, AV1, AI, NPU, Video game, Computer data storage, Medical device, Gen4 Energy, Intel

SAN JOSE, Calif., Dec. 14, 2023 /PRNewswire-PRWeb/ --

Key Points: 
  • Utilizing Low Power E cores in Intel modular architecture, Intel® Core Ultra™ exhibits to be 30-50% more power efficient than 13th Gen Intel Core processors.
  • Equipped with hardware-accelerated AV1 encoding and decoding functionality, the ADLINK cExpress-MTL module can also realize instantaneous media streaming with minimal latency.
  • ADLINK is also working to provide I-Pi development kits based on the cExpress-MTL module for out-of-the-box-ready prototyping and referencing.
  • For more information about the ADLINK cExpress-MTL module, please follow the following link here at adlinktech.com: cExpress-MTL (COM-Express Compact size Type 6 module)

Continuing a valuable partnership: GDCA Inc. and SMART Embedded Computing extend agreement to provide support for legacy embedded products

Retrieved on: 
Thursday, November 2, 2023
Technology, Rail, Semiconductor, Engineering, Air, Energy, Transport, Satellite, Nuclear, Aerospace, Telecommunications, Contracts, Logistics, Supply Chain Management, Manufacturing, Defense, Hardware, Electronic Design Automation, OEM, ATCA, VME, COM Express, Multimedia, GDCA, Mobile phone

View the full release here: https://www.businesswire.com/news/home/20231102313379/en/

Key Points: 
  • View the full release here: https://www.businesswire.com/news/home/20231102313379/en/
    The COMX-P4080, designed in 2012 and discontinued in 2022, was originally designed by Motorola/Emerson Network Power.
  • (Photo: Business Wire)
    GDCA previously completed the transfer of more than fifty (50) end-of-life VME, COM Express, and ATCA products from SMART Embedded Computing.
  • "Our two companies have a long history of providing support for end-of-life products, and this extended agreement reaffirms the trust SMART Embedded Computing has placed in us to offer continued support for a larger number of legacy products," said Ethan Plotkin, CEO of GDCA.
  • "We’re committed to continuing to meet the needs of our long-time customers of our legacy products,” said Tom Nallen, vice president of operations and supply chain for SMART Embedded Computing.

WINSYSTEMS Announces Industrial COM Express® Type 6 Compact CPU Module Built on 11th Gen Intel® Core™ i3/i5/i7 Processors with RAM-Down Design

Retrieved on: 
Thursday, August 24, 2023
TPM, Internet of things, EDP, Vibration, USB, Compact, Shock, LPDDR4, PCI Express, LVDS, BIOS, LCD, HDMI, COM Express, SATA, COM, DisplayPort, RAM, Transport, Robotics, DVI, Mobile phone, Online shopping

GRAND PRAIRIE, Texas, Aug. 24, 2023 /PRNewswire/ -- American embedded computing leader WINSYSTEMS today debuted the latest entry in its well-received computer-on-module product line: the COMeT6-1100 COM Express® Type 6 Compact CPU module. Leveraging the 11th Gen Intel® Core™ i3/i5/i7 processors for industrial, IoT and embedded systems, this module offers up to four cores of high-performance processing in a low-power platform. And, with RAM soldered down, it ably handles applications running in environments subject to shock, vibration and extended temperatures.

Key Points: 
  • Leveraging the 11th Gen Intel® Core™ i3/i5/i7 processors for industrial, IoT and embedded systems, this module offers up to four cores of high-performance processing in a low-power platform.
  • The USA-made COMeT6-1100 module is fully compatible with any carrier board conforming to the PICMG® COM Express Type 6 standards.
  • Orders for the new COMeT6-1100 module with 11th Gen Intel® Core™ i7 embedded processor (UP3-class) are being accepted now.
  • By relying on WINSYSTEMS' expertise in embedded industrial computing systems, customers can be confident their applications are built using the optimal computer solution.

ADLINK launches MXM-AXe -- a first discrete graphics MXM module powered by Intel Arc GPU

Retrieved on: 
Tuesday, March 7, 2023
AV1, S, OpenVINO, COM Express, Ecosystem, ADLINK, Intel, MXM, CPU, Intel Core, SDK, Transport, 3.1, Acceleration, Link, AI, GPU, Intel Arc, PCI Express, Health, Video game

SAN JOSE, Calif., March 7, 2023 /PRNewswire-PRWeb/ -- Summary:

Key Points: 
  • The Intel GPU on ADLINK MXM-AXe offers up to 8 Xe ray-tracing cores, 128 execution units, 4GB GDDR6, and 8x PCIe Gen4 at max.
  • "We are thrilled to introduce MXM-AXe graphics module with Intel Arc Graphics, a powerful line of discrete graphics, to the embedded world," says Alex Wang, Senior Product Manager – Module Product Center, ADLINK.
  • Supporting Intel® Deep Link technology, MXM AXe can be paired with 12th and 13th Gen Intel Core processors for even elevated performance and power efficiency by automated workload allocation between integrated GPU, discrete GPU, and CPU.
  • ADLINK will also provide MXM development kit with COM-Express Type 6 modules for developers in improving their edge innovations' efficiency,
    For more information about ADLINK MXM AXe, please visit its product page for more details.

New Ocean Health Solutions Promotes Marnie Hall to Chief Marketing and Strategy Officer

Retrieved on: 
Wednesday, January 25, 2023
General Health, Health, Professional Services, Other Professional Services, Human Resources, City, Hall, A&E (TV network), Senior producer, University, Publication, COM Express, The Philadelphia Inquirer, City Paper, Columbia University, News, PBS, CBS, The Philadelphia Inquirer, LLC, Marketing, Growth, Emotional intelligence, PR, Multimedia, Communication, Social media, Television, New Ocean Media

New Ocean , the preeminent provider of digital health management platform solutions, today announced the promotion of Marnie Hall to Chief Marketing and Strategy Officer.

Key Points: 
  • New Ocean , the preeminent provider of digital health management platform solutions, today announced the promotion of Marnie Hall to Chief Marketing and Strategy Officer.
  • She will also continue to oversee the planning, development, and execution of the company’s marketing, PR, and advertising initiatives to accelerate growth and raise brand awareness.
  • View the full release here: https://www.businesswire.com/news/home/20230125005247/en/
    "We are delighted to promote Marnie to this new role," said Hal Rosenbluth, Chairman, and CEO of New Ocean Health Solutions.
  • Her insight, counsel and significant communication abilities have helped to propel New Ocean to the forefront of innovative digital health management solutions.

ADLINK releases COM Express and COM-HPC modules based on Intel® 13th Gen Core™ processors -- delivering up to 24 cores for power ranges with industrial-grade stability

Retrieved on: 
Tuesday, January 3, 2023
AMR, Intel, Telecommunication, IOT, Align Technology, USB4, Health, TDP, AI, LAN, TSN, Transport, ROS, Robotics, TCC, ADLINK, Time-Sensitive Networking, AWS, Aviation, SAS, COM Express, Artificial intelligence, DDR5, Social robot, Temperature, Video game console, Software, Computer data storage, Mobile phone, NVIDIA

SAN JOSE, Calif., Jan. 3, 2023  /PRNewswire-PRWeb/ -- Summary: ●    ADLINK's two new modules, based on Intel® 13th Gen Core™ processors, feature advanced hybrid architecture with Performance and Efficient cores for optimized power usage o    Express-RLP: COM.0 R3.1 Type 6 module offering up to 14 cores, 20 threads, 64GB DDR5 SO-DIMM, PCIe Gen4, and extreme rugged option at 15/28/45W TDP o    COM-HPC-cRLS: COM-HPC Size C module with up to 24 cores, 128GB DDR5 SO-DIMM, PCIe Gen5, 2x 2.5GbE LAN, and extreme rugged option ●    Supporting Intel® TCC, and Time Sensitive Networking (TSN), the modules are fitted for hard-real-time computing workloads required by applications such as industrial automation, autonomous driving, AI robots, and aviation

Key Points: 
  • Utilizing Intel's advanced hybrid architecture, with P-cores and E-cores, these modules combine power efficiency with performance, and fulfill various demanding AI, graphics, and mission-critical IoT applications.
  • ADLINK Express-RLP provides up to 14 cores, 20 threads, 64GB DDR5 SO-DIMM, PCIe Gen4, and 4 displays or 2 USB4.
  • ADLINK COM-HPC-cRLS showcases up to 24 cores and 32 threads to deliver superior multi-thread and multitasking performance.
  • For more information about ADLINK COMs, follow these links here at adlniktech.com Express-RLP (COM Express Type 6) and COM-HPC-cRLS (COM-HPC Client Type) modules.