Xpeedic Launches High-Speed Digital Signal Integrity, Power Integrity Suite at Design Automation Conference
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Monday, July 10, 2023
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EDA 2023 Suite Includes 2.5/3DIC SI/PI Simulation for Advanced Packaging,3D EM Simulation, SI/PI and Multiphysics Analysis, High-Speed System Simulation
Key Points:
- EDA 2023 Suite Includes 2.5/3DIC SI/PI Simulation for Advanced Packaging,3D EM Simulation, SI/PI and Multiphysics Analysis, High-Speed System Simulation
SAN FRANCISCO, July 10, 2023 (GLOBE NEWSWIRE) -- Xpeedic today launched its high-speed digital signal integrity and power integrity (SI/PI) suite with significant features and upgrades to advanced packaging and high-speed design domains as the 60th Design Automation Conference (DAC) opens at Moscone Center West here. - The Xpeedic EDA 2023 Suite includes 2.5D and 3D signal integrity and power integrity simulation for advanced packaging, along with three platforms to support 3D Electromagnetic (EM) simulation, multi-domain co-simulation and high-speed system simulation.
- It allows rapid analysis of signal, power, and temperature to ensure compliance with defined specifications, facilitating design iterations.
- The Xpeedic EDA 2023 Suite for high-speed digital SI/PI and multi-physics simulation platforms is shipping now.