COM Express

Sealevel Releases Smallest, Full-Feature Compact Type 6 Carrier Board and Evaluation Kit

Retrieved on: 
Tuesday, October 4, 2022
2.0, GB, COM Express, USB, Intel Core, Part, TPM, RAM, Engineering, CPU, USB 2.0, Temperature, GPIO, Swap, Gigabit Ethernet, Compact, Sealevel Systems, Vibration, GLOBE, RS-232, Mini DisplayPort, Video game console, Sea level

LIBERTY, SC, USA, Oct. 04, 2022 (GLOBE NEWSWIRE) -- Sealevel Systems announces the release of the 12009 COM Express Compact Type 6 Evaluation Board.

Key Points: 
  • LIBERTY, SC, USA, Oct. 04, 2022 (GLOBE NEWSWIRE) -- Sealevel Systems announces the release of the 12009 COM Express Compact Type 6 Evaluation Board.
  • The 12009 COM Express Compact Type 6 Evaluation Board enables accelerated development of embedded computing prototypes, dramatically expedites electrical hardware engineering, and reduces costs for new product introductions (NPIs).
  • At 95 millimeters square, the 12009 is identical in size to a Compact Type 6 COM Express module.
  • The complete evaluation kit (Part #12009-001-KT) includes a Type 6 module with Intel Core i3-8145UE CPU and 8 GB DDR4 RAM.

L3Harris Chooses ZMicro Rugged Computers for Its Sky Warden Planes for USSOCOM Armed Overwatch Program

Retrieved on: 
Tuesday, October 4, 2022
Solution, DDR4, United States Special Operations Command, Running, NVIDIA GPU, COTS, NVM Express, Aircraft, COM Express, Command, Armed Overwatch, PCI Express, Thought, NVIDIA, SAN, ISR, Xeon, Communications satellite, Video game console

SAN DIEGO, Oct. 4, 2022 /PRNewswire/ -- ZMicro announced it will provide rugged computing solutions for the AT-802U Sky Warden planes that L3Harris provides U.S. Special Operations Command's Armed Overwatch program.

Key Points: 
  • SAN DIEGO, Oct. 4, 2022 /PRNewswire/ -- ZMicro announced it will provide rugged computing solutions for the AT-802U Sky Warden planes that L3Harris provides U.S. Special Operations Command's Armed Overwatch program.
  • Each plane will include two ZMicro ZM3 ultra-lightweight servers for situational awareness and mission management applications.
  • Sky Warden is designed to perform in austere, disaggregated combat environments with limited infrastructure.
  • In business since 1986, the company's rugged computing products have been deployed in military, industrial and medical platforms worldwide.

PICMG® Releases Its Newest COM.0 R3.1 Spec for COM Express to Include PCIe Gen 4 and USB 4.0 Support

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Friday, September 30, 2022
Intel, SPI, PCI Express, COM, Intel Core, DDI, MIPI Alliance, IPMB, Twitter, CEI, AWS, LinkedIn, Health, Telecommunication, Xeon, Facebook, TDP, ROS, PICMG, Technology, SAS, USB4, Express, COM Express, Type 6, MIPI, Transport, ADLINK, Align Technology, Intel Xe, Artificial intelligence, Robotics, HPC, AMES Type 7, DDR5, IOT, Mobile phone, Video game console, Computer data storage, NVIDIA

SAN JOSE, Calif., Sept. 30, 2022 /PRNewswire-PRWeb/ -- Summary:

Key Points: 
  • Other enhancements include adding options for general purpose SPI, MIPI-CSI connectors, and SoundWire, as well as adding IPMB for Type 7.
  • R3.1 compliant, ADLINK's Express-ADP Type 6 Basic size and Express-ID7 Type 7 Basic size modules are respectively powered by 12th Gen Intel Core and Intel Xeon D-1700 processors.
  • Using DDI, eDP 1.4b and USB4/TBT4, the four independent displays support Display Alternative mode, the module provides premium graphics features for superior content support, display and I/O virtualization.
  • For immediate application-specific development, ADLINK will also have out-of-the-box-ready development kits with the abovementioned COM.0 R3.1 modules.

New 6U VPX Carrier Cards Host Dual XMC Modules to Support a Wide Variety of Signal Processing and Computing Options

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Tuesday, August 16, 2022
Electronics, Business development, VITA, VPX, CPU, Communication, COM Express, GPU, Transport, FPGA, PCI Express, XMC, Software, Temperature, Video game console, Acromag

WIXOM, Mich, Aug. 16, 2022 /PRNewswire/ -- Acromag expands their OpenVPX™ carrier card selection with the addition of two new models that provide a simple and cost-effective solution for interfacing XMC modules to a VPX computer system. The VPX4840 and VPX4850 feature two XMC slots with support for front or rear panel I/O. They are available with VITA 42, VITA 61, or VITA 88 connectors to route power and interface bus signals to the plug-in mezzanine modules. Both models support a choice of direct PCIe connection to the VPX backplane via the data or expansion plane. The XMC sites have a 16-lane PCIe bus Gen 3 interface enabling rapid data throughput. By inserting XMC mezzanine modules on the carrier, including XMC processor (prXMC) modules, developers can now leverage hundreds of available function modules currently unavailable in a VPX platform. Pricing starts at $3995 for an air-cooled version with a 0 to 55°C range. Models with extended temperature ranges or conduction cooling support are also available.

Key Points: 
  • The VPX4840 and VPX4850 feature two XMC slots with support for front or rear panel I/O.
  • They are available with VITA 42, VITA 61, or VITA 88 connectors to route power and interface bus signals to the plug-in mezzanine modules.
  • Both models support a choice of direct PCIe connection to the VPX backplane via the data or expansion plane.
  • By inserting XMC mezzanine modules on the carrier, including XMC processor (prXMC) modules, developers can now leverage hundreds of available function modules currently unavailable in a VPX platform.

Acromag's New XMC Module Combines a Reconfigurable Artix®-7 FPGA with High-Density Digital and Analog I/O

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Thursday, July 21, 2022
COM Express, Flash, ADC, Swap, COTS, PCI Express, Electronics, Software, VxWorks, Multimedia, Marketing, XMC, TTL, Transport, LVDS, Xilinx, Restriction of Hazardous Substances Directive, Linux, GPIO, Marketing communications, Automation, Electronic component, Video game console, FPGA, Microsoft Windows, Acromag

WIXOM, Mich., July 21, 2022 /PRNewswire/ --  Acromag's new XMC-7A50-AP323 provides a user-customizable Xilinx® Artix®-7 FPGA with 48 TTL I/O channels plus a 16-bit ADC for 20 differential or 40 single-ended analog inputs on an XMC module. Other custom I/O interfaces with an FPGA on one XMC module are available by request. These high-performance modules are for embedded applications running on Linux®, Windows®, or VxWorks® operating systems. XMC-7A50-AP323 modules begin at $2,750 each along with a recommended one-time purchase of $360 Engineering Design kit software.

Key Points: 
  • These modules can mix a variety of I/O interfaces with an FPGA on one XMC module to deliver flexible signal processing and high-performance computing.
  • Other custom I/O interfaces with an FPGA on one XMC module are available by request.
  • The FPGA digital I/O offers 32Mb quad serial flash memory with 52,160 logic cells.
  • "Acromag offers a variety of I/O signal processing functions plus the power of a configurable FPGA on a single XMC module to meet demanding SWaP challenges."

SolidRun Releases Compact LX2-Lite SOM and CLEARFOG Dev Platform for SDN, Security and DPU Solutions

Retrieved on: 
Thursday, April 7, 2022
Cortex, NXP Semiconductors, Ubuntu, Data compression, Marketing, SBCS, Memory, ARM Cortex-A72, Single-board computer, MMC, SD, SBC, COM Express, SerDes, PCI Express, Linux, Som, Original equipment manufacturer, DDR4, Socs, Gold, UART, USB, COM, Architecture, Semiconductor, TEL, SOM, SATA, Single-board, Solution, VP, MultiMediaCard, Efficiency, ARM, NXP, Video game console, Yocto-, Debian, SolidRun

TEL AVIV, Israel, April 7, 2022 /PRNewswire/ -- SolidRun, a leading developer and manufacturer of high-performance System on Module (SOM) solutions, Single Board Computers (SBC) and network edge solutions, today announces its all-new family of LX2-Lite SOMs and CLEARFOG LX2-Lite Development Platform, based on the powerful Layerscape® LX2162A SoC from NXP® Semiconductors. With a footprint measuring just 58mm x 48mm, or about 25% the size of standard COM Express 7 solution, the LX2-Lite Mini SOM is the smallest 16-core SOM platform in the world.

Key Points: 
  • The SOM also boasts a 50Gbps security acceleration engine and 88Gbps data compression engine for maximum network security and data routing application performance.
  • "SolidRun has been for many years the go-to source for flexible developer solutions based on today's most powerful processing platforms," said Mordi Blaunstein, VP sales and marketing at SolidRun.
  • The CLEARFOG LX2-Lite Developer Platform from SolidRun streamlines prototyping and reduces development time for solutions based on the LX2Lite processor-based SOMs.
  • With a mission to simplify application development while overcoming deployment challenges, SolidRun proudly provides customers faster time-to-market and lower costs.

ADLINK Presents Edge Server-class COM-HPC Server Type and COM Express Type 7 Modules Powered Latest Intel® Xeon® D Processors

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Tuesday, March 8, 2022
Time, TSN, DDR4, SAS, PCI Express, LCC, Twitter, MB, Telecommunication, LAN, VNNI, Gen4 Energy, HCC, Ethernet, BMC, Health, Facebook, Intel, COM Express, LinkedIn, COMS, AI, MMC, AWS, Temperature, Natural language processing, Xeon, TDP, Time-Sensitive Networking, IKVM.NET, CPU, Artificial intelligence, Computer, ROS, Technology, COM, Ice Lake, IOT, Robotics, Acceleration, Transport, ADLINK, VGA, IPMB, HPC, DL Boost, SOL, Computer data storage, Satellite navigation device, Software, Serial, NVIDIA

"Their integrated high-speed Ethernet significantly reduces the complexity and time required in design and development processes," says Alex Wang, Senior Product Manager Module Product Center, ADLINK.

Key Points: 
  • "Their integrated high-speed Ethernet significantly reduces the complexity and time required in design and development processes," says Alex Wang, Senior Product Manager Module Product Center, ADLINK.
  • "With industrial-grade reliability and extended temperature range make these modules especially suitable for mission-critical edge applications," he adds.
  • For more information about ADLINK COMs, follow the links for ADLINK COM-HPC-sIDH (COM-HPC Server Type) and Express-ID7 (COM Express Type 7) modules.
  • ADLINK Technology Inc. (TAIEX:6166) leads edge computing, the catalyst for a world powered by artificial intelligence.

ADLINK launches COM-HPC Client Type and COM Express Type 6 Modules with 12th Gen Intel® Core™ processors

Retrieved on: 
Tuesday, January 4, 2022
Intel, Transport, AI, Artificial intelligence, AWS, Telecommunication, Intel Core, DDI, Technology, Computer, SAS, COMS, Robotics, Twitter, Mammography, PCI Express, ROS, LinkedIn, Health, DDR5, Intel Xe, Architecture, IOT, Facebook, ADLINK, COM Express, Video game console, NVIDIA

ADLINK COMs with the Intel 12th Gen Intel Core processor family (Codename: Alder Lake-H) allow for a unique design that can be adapted for single-thread or multithread performance.

Key Points: 
  • ADLINK COMs with the Intel 12th Gen Intel Core processor family (Codename: Alder Lake-H) allow for a unique design that can be adapted for single-thread or multithread performance.
  • "Working closely with Intel, we are bringing timely, next-generation computing modules to the market with Intel Alder Lake-H" said Alex Wang, Senior Product Manager - Module Product Center, ADLINK.
  • "We now offer a full line-up of COM-HPC and COM Express modules for any deployment scenario and budget."
  • For more information about ADLINK COMs, follow the links for ADLINK COM-HPC-cADP (COM-HPC Client Type) and Express-ADP (COM Express Type 6) modules.

WINSYSTEMS Debuts PCle/104 OneBank SBC With Discrete Onboard TPM-2.0 Security Device and LPDDR4 RAM for Superior Performance

Retrieved on: 
Thursday, December 16, 2021
M.2, ISO, Intel, PTP, SBCS, IOT, LPDDR4, PC/104, Temperature, RAM, COM Express, IEEE, Transport, Trusted Platform Module, SBC, ISO 9001:2015, RS232, Longevity, COM, Multimedia, TPM, Hilliard, Vibration, View, Video game console

The PX1-C441 also offers improved memory access via its soldered LPDDR4 RAMup to 8 GBand delivers better thermal performance at extended temperatures.

Key Points: 
  • The PX1-C441 also offers improved memory access via its soldered LPDDR4 RAMup to 8 GBand delivers better thermal performance at extended temperatures.
  • "Our PX1-C441 SBC offers a solution to these requirements and a bridge to the expansive ecosystem of hardware solutions available from PC/104 suppliers."
  • With its discrete onboard TPM-2.0 hardware, product designers are not limited to firmware-based TPM implementation or forced to add thermal cooling devices to their RAM.
  • "Clearly, critical infrastructure applications demand the utmost in product reliability, security, connectivity and longevity despite challenging operating environments," said Hilliard.

New 10-Gigabit Ethernet XMC Module Features Dual 10GBASE-KX4 Ports and Conduction-Cooling Support

Retrieved on: 
Thursday, December 2, 2021
VITA, VME, TCP, XMC, Intel, TOE, VPX, FPGA, Temperature, Transport, Sales, Energy-Efficient Ethernet, Acromag, Xeon, PCI Express, Solution, XAUI, Software, View, Ethernet, Communication, SONIC (Ethernet controller), COM Express, Electronics, Multimedia, SFP, COTS, Printed circuit board, Computer data storage

WIXOM, Mich., Dec. 2, 2021 /PRNewswire/ -- Acromag's new XMC633 module offers two independent 10-gigabit Ethernet interface ports with 10GBASE-KX4 protocol.

Key Points: 
  • WIXOM, Mich., Dec. 2, 2021 /PRNewswire/ -- Acromag's new XMC633 module offers two independent 10-gigabit Ethernet interface ports with 10GBASE-KX4 protocol.
  • The rear I/O model XMC633 routes two KX4 interfaces to the P16 connector and is compatible with conduction-cooling frames.
  • Optional VITA 61 connectors enable PCIe Gen3 data rates across eight high-speed serial lanes on the XMC P15 connector.
  • "Using the latest Intel Ethernet Controller technologies, we now support 10GBASE-KX4 and XAUI backplane interfaces."