Onto Innovation Debuts Sub-surface Defect Inspection for Advanced Packaging
Onto Innovation Inc. (NYSE: ONTO) today announced the release of a new sub-surface inspection capability for the Dragonfly® G3 sub-micron 2D/3D inspection and metrology platform .
- Onto Innovation Inc. (NYSE: ONTO) today announced the release of a new sub-surface inspection capability for the Dragonfly® G3 sub-micron 2D/3D inspection and metrology platform .
- The new capability enables whole wafer inspection for critical yield impacting defects that can lead to lost die as well as entire wafers breaking in subsequent process steps.
- “Customers are demanding 100% inspection capability with production-worthy throughput,” says Mayson Brooks, vice president and general manager of Onto’s inspection business.
- According to TechInsights, the market for inspection products supporting wafer level packaging (WLP) is forecast to grow from $400 million in 2024 to more than $600 million by 2028.