New High-Density Ceramic Column Grid Array STT-MRAM Optimally Designed for Space and the Harshest Environments
The Micross co-fired Ceramic Column Grid Array package is the latest addition to our Hi-Reliability MRAM solutions for Space applications that will benefit from improved thermal stress related, electro-mechanical failures.
- The Micross co-fired Ceramic Column Grid Array package is the latest addition to our Hi-Reliability MRAM solutions for Space applications that will benefit from improved thermal stress related, electro-mechanical failures.
- This new package offering is made possible via our Column Last Attach Solder Process (CLASP), licensed from IBM promoting a highly robust thermal shock & stress survivability option for our Hermetic fine pitch packages.
- Perpendicular Spin-Torque MRAM devices offer inherent protection from harsh environments, and the best power profile of all non-volatile memories – making them optimally suited for hi-reliability aerospace and space applications.
- Micross' licensed CLASP column attach process utilizes a Sn10Pb90 solder wire that is attached to the parent Land Grid package via a eutectic Palladium doped Sn63Pb37 solder attach process.