Silego Technology Inc.

SigmaSense Appoints Semiconductor Industry Veteran David French as CEO

Retrieved on: 
Wednesday, October 4, 2023
Wearables, Mobile Technology, Technology, Semiconductor, Automotive, Vehicle Technology, Software, Batteries, IOT (Internet of Things), Artificial Intelligence, NXP Semiconductors, The Conference Board, DSP, Multimedia, IP, Analog Devices, Silego Technology Inc., Sigma, DSPS, Silicon, Acquisition, Texas Instruments, Broadcom Inc., Growth, AI, System, NXP, Dialog Semiconductor, Management, Cirrus Logic

SigmaSense®, an emerging leader in DSP-based sensing systems, announced today that it has recruited veteran semiconductor industry executive David French as Chief Executive Officer to drive the next phase of growth for SigmaSense’s digital sensing products for real-world AI.

Key Points: 
  • SigmaSense®, an emerging leader in DSP-based sensing systems, announced today that it has recruited veteran semiconductor industry executive David French as Chief Executive Officer to drive the next phase of growth for SigmaSense’s digital sensing products for real-world AI.
  • Mr. French, a SigmaSense board member since 2020, brings strong leadership and management experience from his various CEO and executive positions.
  • The company also announced the appointment of semiconductor veteran John Teegen to its Board of Directors.
  • “His industry knowledge and understanding of how sensed data drives product performance makes him an ideal, valuable addition to our board.”

Chip Industry Veteran Dan Harper Appointed Boréas VP of Sales

Retrieved on: 
Wednesday, October 19, 2022
University of Leicester, IOT, Name, Leicester, Warwick Business School, EE Times, Original equipment manufacturer, Texas Instruments, Research, Google, PC, Silego Technology Inc., University, Industry, IP, Awareness, Harvard University, GLOBE, Internet of things, Mobile phone, Renesas Electronics, Logitech, Amazon

BROMONT, Québec, Oct. 19, 2022 (GLOBE NEWSWIRE) -- Boréas Technologies, the semiconductor company commercializing piezo integrated circuits, today announced the appointment of 30-year semiconductor industry veteran Dan Harper as vice president of sales.

Key Points: 
  • BROMONT, Qubec, Oct. 19, 2022 (GLOBE NEWSWIRE) -- Boras Technologies , the semiconductor company commercializing piezo integrated circuits, today announced the appointment of 30-year semiconductor industry veteran Dan Harper as vice president of sales.
  • Throughout his extensive career, Dan has successfully built sales relationships with C-level executives at many of the worlds most influential tech companies, said Simon Chaput, founder and chief executive, Boras Technologies.
  • He is the perfect industry professional to help boost Boras beyond startup-phase to our next level of growth.
  • There are a number of reasons why Boras is a brilliant industry partner, he said.

GaAs Photodiode Market to Gain Revenues from Extensive Uptake in Optical Communications; Market Valuation to Exceed US$ 102.47 Mn by 2031: TMR Study

Retrieved on: 
Wednesday, January 26, 2022
COVID-19, TMR, Byte, POI, HDT, Silego Technology Inc., Adoption, Broadcom Inc., Electricity, Technology, AOC, Method, DWDM, CAGR, LLC, Electronics, Communes of Burundi, Electronic component, Gallium arsenide

ALBANY, N.Y., Jan. 26, 2022 /PRNewswire/ -- GaAs photodiode arrays have risen in use for high-speed fiber receiver and numerous monitoring applications such as DWDM monitors. The demand for optical fiber instruments with higher data transmission capacity has been driving design advancements in GaAs photodiodes. The global valuation of the market is projected to advance at CAGR of 3.7% during the forecast period 2021–2031.

Key Points: 
  • The demand for optical fiber instruments with higher data transmission capacity has been driving design advancements in GaAs photodiodes.
  • Semiconductor device manufacturers are witnessing a new avenue on the back of need for cost-effective photodiodes for optical telecommunication, note analysts in an in-depth TMR study on the GaAs photodiode market .
  • Demand for GaAs PIN Photodiodes in Optical Telecommunications: Advanced GaAs photodiodes are widely used in high-speed optical telecommunications, gigabit Ethernet, and fiber channels.
  • The use of GaAs photodiodes in parallel optical interconnects (POI) applications is bolstering the revenue generation, finds an in-depth study on the GaAs photodiode market.

Renesas Enters FPGA Market With the First Ultra-Low-Power, Low-Cost Family Addressing Low-Density, High-Volume Applications

Retrieved on: 
Wednesday, November 17, 2021
Semiconductor, Engineering, Technology, Manufacturing, Other Manufacturing, Hardware, Research, Electron capture, Field-programmable gate array, FPGA, Acquisition, Electronics, Silego Technology Inc., GreenPAK, Logic, Verilog, IOT, Leadership, Solution, Veteran, Winning Combinations: Deep Purple and Rainbow, Dialog Semiconductor, TSE, Software, Twitter, Renesas Electronics, Family, Risk, MCU, Instagram, Architecture, SOC, YouTube, Lightwave Electronics Corporation, Engineering, LinkedIn, ReMarkable, Multimedia, Infrastructure, Growth, Luts, Gate array, Electronic component, Video game console

The ForgeFPGA Family will address the underserved market need for relatively small amounts of programmable logic that can be quickly and efficiently designed into cost-sensitive applications.

Key Points: 
  • The ForgeFPGA Family will address the underserved market need for relatively small amounts of programmable logic that can be quickly and efficiently designed into cost-sensitive applications.
  • View the full release here: https://www.businesswire.com/news/home/20211117005535/en/
    Renesas Unveils Ultra-Low-Power, Low-Cost Forge FPGA Family (Photo: Renesas)
    The ForgeFPGA devices will provide dramatic cost savings versus other alternatives, including non-FPGA designs.
  • Their projected price in volume of well under US$ 0.50, opens up applications that previously couldnt use FPGAs due to cost constraints, including high-volume consumer and IoT applications.
  • The ForgeFPGA Family will serve applications that require less than 5,000 gates of logic, with initial device sizes of 1K and 2K Look Up Tables (LUTs).

ChipMOS SHAREHOLDERS APPROVE CASH DIVIDEND DISTRIBUTION OF NT$2.20 PER COMMON SHARE OR APPROXIMATELY US$1.58 PER ADS; COMPANY SETS DIVIDEND RECORD & DISTRIBUTION DATE

Retrieved on: 
Wednesday, July 21, 2021
Financial markets, Corporate finance, Equity securities, Finance, Dividends, American depositary receipt, Share

HSINCHU, July 21, 2021 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"), announced its shareholders approved a cash dividend distribution of NT$2.20 per common share or approximately US$1.58 per ADS at the Company's AGM on July 12, 2021.  The dividend, which the Company's Board had proposed on March 16, 2021, will be distributed to shareholders from earnings.  The Company has submitted a dividend/distribution form to NASDAQ, as notification of the below actions for the Company's American Depositary Shares ("ADRs").

Key Points: 
  • The dividend, which the Company'sBoard had proposed on March 16, 2021, will be distributed to shareholders from earnings.
  • The Company has submitted a dividend/distribution form to NASDAQ, as notification of the below actions for the Company's American Depositary Shares ("ADRs").
  • Questions regarding the dividend distribution may be directed to Tiffany Maat Citibank, N.A.
  • ChipMOS TECHNOLOGIES INC.("ChipMOS"or the "Company")(Taiwan Stock Exchange: 8150 and NASDAQ: IMOS) ( https://www.chipmos.com ) is an industry leading provider of outsourced semiconductor assembly and test services.

Dialog Semiconductor and Flex Logix Establish Strategic Partnership for Mixed Signal Embedded Field-Programmable Gate Arrays (eFPGA)

Retrieved on: 
Wednesday, December 11, 2019
Semiconductor device fabrication, Dialog Semiconductor, Semiconductors, Integrated circuit, Trademark, Inventions, Silego Technology Inc.

Dialog and the Dialog logo are registered trademarks of Dialog Semiconductor plc or its subsidiaries.

Key Points: 
  • Dialog and the Dialog logo are registered trademarks of Dialog Semiconductor plc or its subsidiaries.
  • Flex Logix and EFLX are registered trademarks and NMAXis a trademark of Flex Logic Inc.
  • Dialog Semiconductor is a leading provider of integrated circuits (ICs) that power mobile devices and the Internet of Things.
  • In 2018, it had approximately $1.44 billion in revenue and was one of the fastest growing European public semiconductor companies.