Valmiera Glass Via (basketball)

3D Stacking Market worth $3.1 billion by 2028 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Monday, October 2, 2023
Chemical control, SK, Electronics, TSV, Gas Control Equipment Ltd, College of Engineering (KNUST), TSV Kottern, Dram, AMD, IC, TSMC, TGV, ICS, Automation, Intel, Tokyo Electron, Tablet, Valmiera Glass Via (basketball), Logic, LED, Laser, United Microelectronics Corporation, Memory, ASE, Growth, Glass, Region, Semiconductor, Video game, Samsung, Hybrid

In the realm of 3D integrated circuits (3D ICs), TSVs play a pivotal role, enabling advanced packaging techniques and stacking IC chips using TSV interconnects, contributing to the evolution of semiconductor devices.

Key Points: 
  • In the realm of 3D integrated circuits (3D ICs), TSVs play a pivotal role, enabling advanced packaging techniques and stacking IC chips using TSV interconnects, contributing to the evolution of semiconductor devices.
  • 3D stacking addresses this demand by enabling the integration of diverse functionalities and components in a compact three-dimensional structure.
  • The 3D stacking technology optimizes the memory device structure, enhancing storage capacity, speed, and efficiency in data handling.
  • By stacking memory cells vertically, 3D stacking allows for greater storage density and faster read-write speeds, meeting the escalating data storage requirements of various applications.

3D Stacking Market worth $3.1 billion by 2028 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Monday, October 2, 2023
Chemical control, SK, Electronics, TSV, Gas Control Equipment Ltd, College of Engineering (KNUST), TSV Kottern, Dram, AMD, IC, TSMC, TGV, ICS, Automation, Intel, Tokyo Electron, Tablet, Valmiera Glass Via (basketball), Logic, LED, Laser, United Microelectronics Corporation, Memory, ASE, Growth, Glass, Region, Semiconductor, Video game, Samsung, Hybrid

In the realm of 3D integrated circuits (3D ICs), TSVs play a pivotal role, enabling advanced packaging techniques and stacking IC chips using TSV interconnects, contributing to the evolution of semiconductor devices.

Key Points: 
  • In the realm of 3D integrated circuits (3D ICs), TSVs play a pivotal role, enabling advanced packaging techniques and stacking IC chips using TSV interconnects, contributing to the evolution of semiconductor devices.
  • 3D stacking addresses this demand by enabling the integration of diverse functionalities and components in a compact three-dimensional structure.
  • The 3D stacking technology optimizes the memory device structure, enhancing storage capacity, speed, and efficiency in data handling.
  • By stacking memory cells vertically, 3D stacking allows for greater storage density and faster read-write speeds, meeting the escalating data storage requirements of various applications.

DNP Develops TGV Glass Core Substrate for Semiconductor Packages

Retrieved on: 
Monday, March 20, 2023
Semiconductor, Hardware, Manufacturing, Other Manufacturing, Technology, Dai, Freedom, TGV, Multimedia, Valmiera Glass Via (basketball), DNP, Rigidity, GCS, Glass, Copper, Printed circuit board

Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages.

Key Points: 
  • Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages.
  • View the full release here: https://www.businesswire.com/news/home/20230314005568/en/
    X-ray image of TGV in the glass core substrate (Graphic: Business Wire)
    The newly developed GCS includes a TGV necessary for electrically connecting the fine metal wiring configured on the front and back of the glass.
  • The newly developed glass substrate has an aspect ratio of 9+, and maintains sufficient adhesive qualities to configure fine wiring.
  • In addition to the existing Filling Type glass substrate that fills the glass Via with copper, DNP is also promoting the scalability of the newly developed Conformal Type glass substrate to a panel size of 510 x 515mm.

3D IC Market to Garner $51.81 Bn, Globally, by 2030 at 20.0% CAGR: Allied Market Research

Retrieved on: 
Monday, August 16, 2021
Original equipment manufacturer, Component, Consumer electronics, Electronics, Monolith, TSV, CAGR, LED, Glass, ICS, 3D, Logic, COVID-19, Medical device, Internet, Growth, TGV, Technology, Memory, MEMS, Miniaturization, Adoption, IOT, Industry, Valmiera Glass Via (basketball), 3D printing, Video game, Animal

As per the report, the global 3D IC industry was accounting for $9.18 billion in 2020, and is expected to reach $51.81 billion by 2030, growing at a CAGR of 20.0% from 2021 to 2030.

Key Points: 
  • As per the report, the global 3D IC industry was accounting for $9.18 billion in 2020, and is expected to reach $51.81 billion by 2030, growing at a CAGR of 20.0% from 2021 to 2030.
  • Rise in demand for internet of things (IoT) technology, growing trend of miniaturization of electronics devices, and technological advancements in 3D packaging technology drive the growth of the global 3D IC market.
  • However, high initial capital investment and high cost of materials hinder the market growth.
  • By region, the global 3D IC market across Asia-Pacific, followed by North America, is anticipated to showcase the highest CAGR of 21.3% during the forecast period.

3D IC Market to Garner $51.81 Bn, Globally, by 2030 at 20.0% CAGR: Allied Market Research

Retrieved on: 
Monday, August 16, 2021
Original equipment manufacturer, Component, Consumer electronics, Electronics, Monolith, TSV, CAGR, LED, Glass, ICS, 3D, Logic, COVID-19, Medical device, Internet, Growth, TGV, Technology, Memory, MEMS, Miniaturization, Adoption, IOT, Industry, Valmiera Glass Via (basketball), 3D printing, Video game, Animal

PORTLAND, Ore., Aug. 16, 2021 /PRNewswire/ -- Allied Market Research recently published a report, titled, "3D IC Market by Type (Stacked 3D and Monolithic 3D), Component (Through-Silicon Via (TSV), Through Glass Via (TGV), and Silicon Interposer), Application (Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, and Others), and End User (Consumer Electronics, Telecommunication, Automotive, Military & Aerospace, Medical Devices, Industrial, and Others): Global Opportunity Analysis and Industry Forecast, 2021–2030". As per the report, the global 3D IC industry was accounting for $9.18 billion in 2020, and is expected to reach $51.81 billion by 2030, growing at a CAGR of 20.0% from 2021 to 2030.

Key Points: 
  • Rise in demand for internet of things (IoT) technology and technological advancements in 3D packaging technology drive the growth of the global 3D IC market.
  • As per the report, the global 3D IC industry was accounting for $9.18 billion in 2020, and is expected to reach $51.81 billion by 2030, growing at a CAGR of 20.0% from 2021 to 2030.
  • Rise in demand for internet of things (IoT) technology, growing trend of miniaturization of electronics devices, and technological advancements in 3D packaging technology drive the growth of the global 3D IC market.
  • By region, the global 3D IC market across Asia-Pacific, followed by North America, is anticipated to showcase the highest CAGR of 21.3% during the forecast period.