Chemical control

Industrial Metrology Market worth $20.6 billion by 2029 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Monday, February 19, 2024
VMM, Simulation, Region, CMM, Quality control, Hardware, 3D, Growth, USB On-The-Go, Laser, KLA Corporation, Baker Hughes, Safety, COVID-19, ODS, Automation, Chemical control, Reverse engineering, Printing, Semiconductor, Consumer electronics

The industrial metrology market, particularly the surge in demand for 3D metrology equipment, is a significant driver of growth, notably within manufacturing industries where it is increasingly utilized for quality control and inspection purposes.

Key Points: 
  • The industrial metrology market, particularly the surge in demand for 3D metrology equipment, is a significant driver of growth, notably within manufacturing industries where it is increasingly utilized for quality control and inspection purposes.
  • Service-based offerings are projected to experience growth in the industrial metrology market driven by various factors.
  • The increasing need for regular system upgrades is propelling the expansion of after-sales services, ensuring the continual optimization of metrology systems.
  • The increasing demand for electric vehicles and the imperative for highly dependable and quality processes are additional factors propelling the growth of the industrial metrology market within the automotive industry.

Industrial Metrology Market worth $20.6 billion by 2029 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Monday, February 19, 2024
VMM, Simulation, Region, CMM, Quality control, Hardware, 3D, Growth, USB On-The-Go, Laser, KLA Corporation, Baker Hughes, Safety, COVID-19, ODS, Automation, Chemical control, Reverse engineering, Printing, Semiconductor, Consumer electronics

The industrial metrology market, particularly the surge in demand for 3D metrology equipment, is a significant driver of growth, notably within manufacturing industries where it is increasingly utilized for quality control and inspection purposes.

Key Points: 
  • The industrial metrology market, particularly the surge in demand for 3D metrology equipment, is a significant driver of growth, notably within manufacturing industries where it is increasingly utilized for quality control and inspection purposes.
  • Service-based offerings are projected to experience growth in the industrial metrology market driven by various factors.
  • The increasing need for regular system upgrades is propelling the expansion of after-sales services, ensuring the continual optimization of metrology systems.
  • The increasing demand for electric vehicles and the imperative for highly dependable and quality processes are additional factors propelling the growth of the industrial metrology market within the automotive industry.

Interposer and Fan-out Wafer Level Packaging Market worth $63.5 billion by 2029 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Thursday, February 8, 2024
Pillar, BGA, Communication, SOC, LED, CPU, Samsung, Growth, SOI, Electronics, Memory, SIP, Tier, Aerospace, FOWLP, IC, College of Engineering (KNUST), LGA, Artificial intelligence, Reverse engineering, Silicon, RF, CSP, Equipment, Defense, Monolith, Chemical control, Quality control, Logic, Packaging and labeling, 3D, Miniaturization, FD-SOI, GPU, MEMS, Automation, Row, PGA, Interposer, Video game

By Packaging Component & Design, Device, Industry and Region

Key Points: 
  • By Packaging Component & Design, Device, Industry and Region
    Based on packaging component & design Interposer and Fan-out Wafer Level Packaging market for Interposers to hold the highest market share during the forecast period.
  • Interposer and FOWLP market for the 2.5D packaging segment by packaging type to exhibit the highest market share during the forecast period.
  • Interposer and FOWLP market for memory devices to hold high market share during the forecast period.
  • Interposer and FOWLP market for North America region to hold the second largest share during the forecast period.

Interposer and Fan-out Wafer Level Packaging Market worth $63.5 billion by 2029 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Thursday, February 8, 2024
Pillar, BGA, Communication, SOC, LED, CPU, Samsung, Growth, SOI, Electronics, Memory, SIP, Tier, Aerospace, FOWLP, IC, College of Engineering (KNUST), LGA, Artificial intelligence, Reverse engineering, Silicon, RF, CSP, Equipment, Defense, Monolith, Chemical control, Quality control, Logic, Packaging and labeling, 3D, Miniaturization, FD-SOI, GPU, MEMS, Automation, Row, PGA, Interposer, Video game

By Packaging Component & Design, Device, Industry and Region

Key Points: 
  • By Packaging Component & Design, Device, Industry and Region
    Based on packaging component & design Interposer and Fan-out Wafer Level Packaging market for Interposers to hold the highest market share during the forecast period.
  • Interposer and FOWLP market for the 2.5D packaging segment by packaging type to exhibit the highest market share during the forecast period.
  • Interposer and FOWLP market for memory devices to hold high market share during the forecast period.
  • Interposer and FOWLP market for North America region to hold the second largest share during the forecast period.

Spin on Carbon Market worth $747 million by 2028 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Tuesday, December 12, 2023
CHIPS, IDM, Carbon, CHIPS and Science Act, Equipment, DUV, Extreme ultraviolet, Mask, Monolith, Socs, Government, Logic, Light, Reverse engineering, Memory, Automation, Defense, EUV, Laser surgery, Gas Control Equipment Ltd, ICS, Chemical control, Quality control, Aerospace, Integration, SOC, Merck Group, European Chips Act, MEMS, Manufacturing, Semiconductor, Video game, Automotive industry, Wavelength, Region, Geography

The hot temperature spin on carbon segment is expected to account for the largest share of the spin on carbon industry in 2023.

Key Points: 
  • The hot temperature spin on carbon segment is expected to account for the largest share of the spin on carbon industry in 2023.
  • The hot-temperature spin-on carbon segment is a significant market for spin-on carbon in semiconductors.
  • Foundries are expected to account for the largest share of the spin-on carbon in the semiconductor market in 2023.
  • The North American market is expected to witness the highest CAGR in the spin-on carbon in the semiconductor market during the forecast period.

Spin on Carbon Market worth $747 million by 2028 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Tuesday, December 12, 2023
CHIPS, IDM, Carbon, CHIPS and Science Act, Equipment, DUV, Extreme ultraviolet, Mask, Monolith, Socs, Government, Logic, Light, Reverse engineering, Memory, Automation, Defense, EUV, Laser surgery, Gas Control Equipment Ltd, ICS, Chemical control, Quality control, Aerospace, Integration, SOC, Merck Group, European Chips Act, MEMS, Manufacturing, Semiconductor, Video game, Automotive industry, Wavelength, Region, Geography

The hot temperature spin on carbon segment is expected to account for the largest share of the spin on carbon industry in 2023.

Key Points: 
  • The hot temperature spin on carbon segment is expected to account for the largest share of the spin on carbon industry in 2023.
  • The hot-temperature spin-on carbon segment is a significant market for spin-on carbon in semiconductors.
  • Foundries are expected to account for the largest share of the spin-on carbon in the semiconductor market in 2023.
  • The North American market is expected to witness the highest CAGR in the spin-on carbon in the semiconductor market during the forecast period.

ALD Equipment Market worth $6.2 billion by 2028 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Tuesday, October 31, 2023
Equipment, Hafnium(IV) oxide, MOSFET, Biomaterial, Audio power amplifier, Silicon carbide, AI, Defense, Quality control, Internet of things, ALD, Institute for Liquid Atomization and Spray Systems, Electronics, Cardiology, CVD, Reverse engineering, Power electronics, Corrosion, Zirconium dioxide, Flip chip, ASM International, EUGENE, Aerospace, Lighting, RF, Gallium arsenide, Automation, Silicon dioxide, Communication, LED, Growth, Gallium nitride, Gas Control Equipment Ltd, Oxide, Less, Chemical control, LAM, Tokyo Electron, Fluid mechanics, SOP, Indium phosphide, Neurology, BGA, Consumer electronics, Telecommunications, Video game, Medical device, Semiconductor, Region, Automotive industry

Oxide film type is expected to account for the largest market size of the ALD equipment market during the forecast period.

Key Points: 
  • Oxide film type is expected to account for the largest market size of the ALD equipment market during the forecast period.
  • Therefore, oxide films are expected to have the largest market size in the ALD equipment market.
  • Medical application is projected to register the highest CAGR in ALD equipment market during the forecast period.
  • Furthermore, strong presence of ALD equipment market players in the region creates growth opportunities for the ALD equipment in Asia Pacific.

ALD Equipment Market worth $6.2 billion by 2028 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Tuesday, October 31, 2023
Equipment, Hafnium(IV) oxide, MOSFET, Biomaterial, Audio power amplifier, Silicon carbide, AI, Defense, Quality control, Internet of things, ALD, Institute for Liquid Atomization and Spray Systems, Electronics, Cardiology, CVD, Reverse engineering, Power electronics, Corrosion, Zirconium dioxide, Flip chip, ASM International, EUGENE, Aerospace, Lighting, RF, Gallium arsenide, Automation, Silicon dioxide, Communication, LED, Growth, Gallium nitride, Gas Control Equipment Ltd, Oxide, Less, Chemical control, LAM, Tokyo Electron, Fluid mechanics, SOP, Indium phosphide, Neurology, BGA, Consumer electronics, Telecommunications, Video game, Medical device, Semiconductor, Region, Automotive industry

Oxide film type is expected to account for the largest market size of the ALD equipment market during the forecast period.

Key Points: 
  • Oxide film type is expected to account for the largest market size of the ALD equipment market during the forecast period.
  • Therefore, oxide films are expected to have the largest market size in the ALD equipment market.
  • Medical application is projected to register the highest CAGR in ALD equipment market during the forecast period.
  • Furthermore, strong presence of ALD equipment market players in the region creates growth opportunities for the ALD equipment in Asia Pacific.

3D Stacking Market worth $3.1 billion by 2028 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Monday, October 2, 2023
Chemical control, SK, Electronics, TSV, Gas Control Equipment Ltd, College of Engineering (KNUST), TSV Kottern, Dram, AMD, IC, TSMC, TGV, ICS, Automation, Intel, Tokyo Electron, Tablet, Valmiera Glass Via (basketball), Logic, LED, Laser, United Microelectronics Corporation, Memory, ASE, Growth, Glass, Region, Semiconductor, Video game, Samsung, Hybrid

In the realm of 3D integrated circuits (3D ICs), TSVs play a pivotal role, enabling advanced packaging techniques and stacking IC chips using TSV interconnects, contributing to the evolution of semiconductor devices.

Key Points: 
  • In the realm of 3D integrated circuits (3D ICs), TSVs play a pivotal role, enabling advanced packaging techniques and stacking IC chips using TSV interconnects, contributing to the evolution of semiconductor devices.
  • 3D stacking addresses this demand by enabling the integration of diverse functionalities and components in a compact three-dimensional structure.
  • The 3D stacking technology optimizes the memory device structure, enhancing storage capacity, speed, and efficiency in data handling.
  • By stacking memory cells vertically, 3D stacking allows for greater storage density and faster read-write speeds, meeting the escalating data storage requirements of various applications.

3D Stacking Market worth $3.1 billion by 2028 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Monday, October 2, 2023
Chemical control, SK, Electronics, TSV, Gas Control Equipment Ltd, College of Engineering (KNUST), TSV Kottern, Dram, AMD, IC, TSMC, TGV, ICS, Automation, Intel, Tokyo Electron, Tablet, Valmiera Glass Via (basketball), Logic, LED, Laser, United Microelectronics Corporation, Memory, ASE, Growth, Glass, Region, Semiconductor, Video game, Samsung, Hybrid

In the realm of 3D integrated circuits (3D ICs), TSVs play a pivotal role, enabling advanced packaging techniques and stacking IC chips using TSV interconnects, contributing to the evolution of semiconductor devices.

Key Points: 
  • In the realm of 3D integrated circuits (3D ICs), TSVs play a pivotal role, enabling advanced packaging techniques and stacking IC chips using TSV interconnects, contributing to the evolution of semiconductor devices.
  • 3D stacking addresses this demand by enabling the integration of diverse functionalities and components in a compact three-dimensional structure.
  • The 3D stacking technology optimizes the memory device structure, enhancing storage capacity, speed, and efficiency in data handling.
  • By stacking memory cells vertically, 3D stacking allows for greater storage density and faster read-write speeds, meeting the escalating data storage requirements of various applications.