SK HYNIX INC


Associated tags: Luxembourg Stock Exchange, Korea Exchange, Dynamic random-access memory, DRAM, SK, HBM, HBM3, Computer data storage, AI, DDR5, Video game, Average cost, LPDDR5, SSD

Locations: NAND, SOUTH KOREA, SEOUL, SK, KOREA

SK hynix Reports Second Quarter 2023 Financial Results

Retrieved on: 
Wednesday, July 26, 2023

Revenue at 7.306 trillion won, operating loss at 2.882 trillion won, net loss at 2.988 trillion won

Key Points: 
  • Revenue at 7.306 trillion won, operating loss at 2.882 trillion won, net loss at 2.988 trillion won
    Revenue rises; operating loss narrows on increased sales of premium products such as HBM3, DDR5
    SEOUL, South Korea, July 25, 2023 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com ) today reported financial results for the second quarter of 2023.
  • "As a result, sales of premium products such as HBM3 and DDR5 increased, leading to a 44% sequential increase in revenue for the second quarter, while operating loss narrowed by 15%."
  • According to SK hynix, sales of both DRAM and NAND products increased in the second quarter, with higher average selling price (ASP) of DRAM largely contributing to revenue growth.
  • "SK hynix will strive to prop up earnings through its technological competitiveness in high-end products."

SK hynix Becomes First Semiconductor Company in Korea to Win Both ISO Compliance, Anti-Bribery Management System Certifications

Retrieved on: 
Friday, July 21, 2023

SEOUL, South Korea, July 21, 2023 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com ) announced today that it has been awarded the ISO 37301 compliance management system* and ISO 37001 anti-bribery management system** certifications issued by the British Standards Institute (BSI).

Key Points: 
  • SEOUL, South Korea, July 21, 2023 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com ) announced today that it has been awarded the ISO 37301 compliance management system* and ISO 37001 anti-bribery management system** certifications issued by the British Standards Institute (BSI).
  • "We have successfully completed the preparation process and evaluation based on our compliance system currently in operation, and SK hynix, in recognition of such achievements in establishing those management systems that comply with international standards, became the first semiconductor company in Korea to receive both certifications from the BSI," the company said.
  • The certification award ceremony held today at SK hynix Bundang office was attended by Lim Seong-hwan, CEO of BSI Group Korea, and SK hynix Vice Presidents Kim Youn-wook (Head of Sustainability Management) and Park Su-man (Head of Ethics Management).
  • "Based on our world-class corporate governance, SK hynix will continue to strive to grow into a semiconductor company trusted by stakeholders," Kim added.

SK hynix Enters Industry's First Compatibility Validation Process for 1bnm DDR5 Server DRAM

Retrieved on: 
Tuesday, May 30, 2023

The move comes after SK hynix became the first in the industry to reach 1anm readiness and completed Intel's system validation of the 1anm DDR5, the fourth-generation of the 10nm technology.

Key Points: 
  • The move comes after SK hynix became the first in the industry to reach 1anm readiness and completed Intel's system validation of the 1anm DDR5, the fourth-generation of the 10nm technology.
  • * DDR5 products for test run in early days of development ran at 4.8Gbps, while the maximum speed of DDR5 stipulated in the JEDEC standards is 8.8Gbps
    Besides, with the adoption of high-K metal gate** process, the 1bnm DDR5 products reduce power consumption by over 20% than 1anm DDR5 products.
  • SK hynix introduced the world's first HKMG process for mobile DRAM in November and adopted the technology for its 9.6Gbps LPDDR5T mobile DRAM in January 2023
    "SK hynix expects the validation process of the 1bnm DDR5 product with Intel to go smoothly following a successful validation of our 1anm server DDR5 product compatibility with the 4th Gen Intel® Xeon® Scalable processors," Jonghwan Kim, Head of DRAM Development at SK hynix, said.
  • Meanwhile, SK hynix also said that additional validation processes to apply its 1anm DDR5, of which the first compatibility test has been already completed, onto the next generation of Intel® Xeon® Scalable platform are also underway.

SK hynix Reports First Quarter 2023 Financial Results

Retrieved on: 
Wednesday, April 26, 2023

The company recorded revenues of 5.088 trillion won, operating loss of 3.402 trillion won (with operating margin of negative 67%), and net loss of 2.586 trillion won (with net profit margin of negative 51%) in the first quarter of 2023.

Key Points: 
  • The company recorded revenues of 5.088 trillion won, operating loss of 3.402 trillion won (with operating margin of negative 67%), and net loss of 2.586 trillion won (with net profit margin of negative 51%) in the first quarter of 2023.
  • "As the memory chip downturn continued through the first quarter, the company posted a sequential drop in revenues and widened operating loss on sluggish demand and falling products prices," SK hynix said.
  • "But we expect revenues to rebound in the second quarter after bottoming out in the first, driven by a gradual increase in sales volume."
  • "With SK hynix having secured a top-notch competitiveness for the lineup of products, of which growth in demand is materializing from this year, such as DDR5/LPDDR5 and HBM3, the company will solidify its leadership in the premium market by increasing the sales volume of such products," said Kim Woohyun, Chief Financial Officer at SK hynix.

SK hynix Develops Industry's First 12-Layer HBM3, Provides Samples To Customers

Retrieved on: 
Thursday, April 20, 2023

* HBM (High Bandwidth Memory): A high-value, high-performance memory that vertically interconnects multiple DRAM chips and dramatically increases data processing speed in comparison to traditional DRAM products.

Key Points: 
  • * HBM (High Bandwidth Memory): A high-value, high-performance memory that vertically interconnects multiple DRAM chips and dramatically increases data processing speed in comparison to traditional DRAM products.
  • SK hynix has provided samples of its 24GB HBM3 product to multiple customers that have expressed great expectation for the latest product, while the performance evaluation of the product is in progress.
  • "SK hynix was able to continuously develop a series of ultra-high speed and high capacity HBM products through its leading technologies used in the back-end process," said Sang Hoo Hong, Head of Package & Test at SK hynix.
  • "The company plans to complete mass production preparation for the new product within the first half of the year to further solidify its leadership in cutting-edge DRAM market in the era of AI."

SK hynix Reports 2022 and Fourth Quarter Financial Results

Retrieved on: 
Tuesday, January 31, 2023

However, SK hynix recorded an operating loss in the fourth quarter of last year due to weak demand and a sharp fall in memory-chip prices.

Key Points: 
  • However, SK hynix recorded an operating loss in the fourth quarter of last year due to weak demand and a sharp fall in memory-chip prices.
  • "Despite a deeper industry downturn in the first half, SK hynix forecasts market conditions to gradually improve into the latter part of the year," the company said.
  • In addition, SK hynix forecasts a gradual recovery in demand as global tech companies start to adopt more memory chips as the prices are low.
  • SK hynix will stay with the decision announced in October to more than halve the volume of investments compared with 19 trillion won in 2022.

SK hynix to Showcase Energy-Efficient, High-Performance Memory Products at CES 2023

Retrieved on: 
Monday, December 26, 2022

Attention on energy-efficient memory chips has been on the rise as global tech companies pursue products that process data faster, while consuming less energy.

Key Points: 
  • Attention on energy-efficient memory chips has been on the rise as global tech companies pursue products that process data faster, while consuming less energy.
  • SK hynix is confident that its products to be displayed at the CES 2023 will meet customers' such needs with outstanding performance per watt* and performance.
  • *HBM (High Bandwidth Memory): High-value, high-performance memory that vertically interconnects multiple DRAM chips and dramatically increases data processing speed in comparison to traditional DRAM products.
  • SK hynix will also present the immersion cooling* technology of SK enmove, which specializes in energy efficiency.