HBM3

Lenovo Advances Hybrid AI Innovation to Meet the Demands of the Most Compute Intensive Workloads

Retrieved on: 
Wednesday, April 24, 2024
Semiconductor, Data Management, Technology, Software, Networks, Artificial Intelligence, Cloud, Corporation, CPU, AMD, Organization, Ecosystem, Instinct, AMD CPU, Map, AI, AMD Instinct, City, LLM, TCO, Forecasting, Cloud computing, Intelligence, Risk management, Automation, KYC, Unified, Microsoft, Intel, ADR, MVP, Professional services, GPU, Memory, Central processing unit, Graphics processing unit, Microsoft Azure, TB, HBM3, Health, Architecture, Video game

Lenovo is delivering GPU-rich and thermal efficient solutions intended for compute intensive workloads across multiple environments and industries.

Key Points: 
  • Lenovo is delivering GPU-rich and thermal efficient solutions intended for compute intensive workloads across multiple environments and industries.
  • Across all these solutions is Lenovo TruScale, which provides the ultimate flexibility, scale and support for customers to on-ramp demanding AI workloads completely as-a-service.
  • Regardless of where customers are in their AI journey, Lenovo Professional Services are simplifying the AI experience as customers look to meet the new demands and opportunities of AI that businesses are facing today.
  • Through a combination of end-to-end services, hardware, and AI applications, Lenovo empowers customers to succeed at every stage of their AI journey.

High Bandwidth Memory (HBM) Market Size to Grow USD 85750 Million by 2030 at a CAGR of 68.1% | Valuates Reports

Retrieved on: 
Wednesday, April 24, 2024
USD, Consumer, SK Hynix, Internet of things, HBM, Investment, Virtual reality, High Bandwidth Memory, Machine learning, Micrometre, Growth, ADAS, Artificial intelligence, Cloud computing, Category, Deep learning, Server, Memory, HBM2, Graphics processing unit, Comment, HBM3, Architecture, Samsung, Video game

The global High Bandwidth Memory (HBM) market was valued at USD 1768 million in 2023 and is anticipated to reach USD 85750 million by 2030, witnessing a CAGR of 68.1% during the forecast period 2024-2030.

Key Points: 
  • The global High Bandwidth Memory (HBM) market was valued at USD 1768 million in 2023 and is anticipated to reach USD 85750 million by 2030, witnessing a CAGR of 68.1% during the forecast period 2024-2030.
  • HBM is becoming more and more popular due to its superior memory bandwidth, reduced power consumption, and higher memory density when compared to traditional memory architectures.
  • The rising need for high-performance computing solutions across several sectors is fueling the growth of the High Bandwidth Memory (HBM) Market.
  • SK Hynix, Samsung, and Micron are the three main producers of High Bandwidth Memory (HBM) in the world.

High Bandwidth Memory (HBM) Market Size to Grow USD 85750 Million by 2030 at a CAGR of 68.1% | Valuates Reports

Retrieved on: 
Wednesday, April 24, 2024
USD, Consumer, SK Hynix, Internet of things, HBM, Investment, Virtual reality, High Bandwidth Memory, Machine learning, Micrometre, Growth, ADAS, Artificial intelligence, Cloud computing, Category, Deep learning, Server, Memory, HBM2, Graphics processing unit, Comment, HBM3, Architecture, Samsung, Video game

The global High Bandwidth Memory (HBM) market was valued at USD 1768 million in 2023 and is anticipated to reach USD 85750 million by 2030, witnessing a CAGR of 68.1% during the forecast period 2024-2030.

Key Points: 
  • The global High Bandwidth Memory (HBM) market was valued at USD 1768 million in 2023 and is anticipated to reach USD 85750 million by 2030, witnessing a CAGR of 68.1% during the forecast period 2024-2030.
  • HBM is becoming more and more popular due to its superior memory bandwidth, reduced power consumption, and higher memory density when compared to traditional memory architectures.
  • The rising need for high-performance computing solutions across several sectors is fueling the growth of the High Bandwidth Memory (HBM) Market.
  • SK Hynix, Samsung, and Micron are the three main producers of High Bandwidth Memory (HBM) in the world.

HBM3 Initially Exclusively Supplied by SK Hynix, Samsung Rallies Fast After AMD Validation, Says TrendForce

Retrieved on: 
Wednesday, March 13, 2024
Environment, Apps, Applications, Technology, Semiconductor, Professional Services, Sustainability, Audio, Video, Green Technology, Data Analytics, Artificial Intelligence, Micrometre, Certification, HBM, Blog, News, Table, Plant, Samsung, HBM3, AMD, Video game

TrendForce highlights that the current landscape of the HBM market, which as of early 2024, is primarily focused on HBM3.

Key Points: 
  • TrendForce highlights that the current landscape of the HBM market, which as of early 2024, is primarily focused on HBM3.
  • The current HBM3 supply for NVIDIA’s H100 solution is primarily met by SK hynix, leading to a supply shortfall in meeting burgeoning AI market demands.
  • Samsung’s entry into NVIDIA’s supply chain with its 1Znm HBM3 products in late 2023, though initially minor, signifies its breakthrough in this segment.
  • It’s worth noting that Micron has not yet entered the HBM supply market, leaving SK hynix and Samsung as key players.

SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana

Retrieved on: 
Wednesday, April 3, 2024
CHIPS, HBM, Ambassador, Package, Assistant, Partnership, DRAM, Research, News, AI, Local government, Organic, Commerce, Purdue Research Park, Silicon, Architecture, HBM3, Midwestern United States, Semiconductor, Ecosystem, ChatGPT, South Korea, HBM2, Government, Dynamic random-access memory

"I'm so proud to officially welcome SK hynix to Indiana, and we're confident this new partnership will enhance the Lafayette-West Lafayette region, Purdue University and the state of Indiana for the long term.

Key Points: 
  • "I'm so proud to officially welcome SK hynix to Indiana, and we're confident this new partnership will enhance the Lafayette-West Lafayette region, Purdue University and the state of Indiana for the long term.
  • Senator Todd Young, a key advocate for the project, said, "SK hynix will soon be a household name in Indiana.
  • "SK hynix is the global pioneer and dominant market leader in memory chips for AI," Purdue University President Mung Chiang said.
  • It is also a monumental moment for completing the supply chain of digital economy in our country through chips advanced packaging.

SK hynix Begins Volume Production of Industry's First HBM3E

Retrieved on: 
Tuesday, March 19, 2024
HBM, Pressure, Memory, Partnership, DRAM, AI, Heat, HBM3, Ecosystem, TB, HBM2, Video game

The company expects a successful volume production of HBM3E, along with its experiences also as the industry's first provider of HBM3, to help cement its leadership in the AI memory space.

Key Points: 
  • The company expects a successful volume production of HBM3E, along with its experiences also as the industry's first provider of HBM3, to help cement its leadership in the AI memory space.
  • Global big tech companies have been increasingly requiring stronger performance of AI semiconductor and SK hynix expects its HBM3E to be their optimal choice that meets such growing expectations.
  • SK hynix's HBM3E also comes with a 10% improvement in heat-dissipation performance, compared with the previous generation, following application of the advanced MR-MUF** process.
  • Sungsoo Ryu, Head of HBM Business at SK hynix, said that mass production of HBM3E has completed the company's lineup of industry-leading AI memory products.

Samsung Develops Industry-First 36GB HBM3E 12H DRAM

Retrieved on: 
Tuesday, February 27, 2024
Semiconductor, Hardware, Consumer Electronics, Technology, Artificial Intelligence, Data-rate units, TCO, Multimedia, NCF, AI, HBM, Samsung Electronics, Samsung, HBM3, Memory, Electronics, TC, Mobile phone

Samsung Electronics Co., Ltd., a world leader in advanced memory technology, today announced that it has developed HBM3E 12H, the industry’s first 12-stack HBM3E DRAM and the highest-capacity HBM product to date.

Key Points: 
  • Samsung Electronics Co., Ltd., a world leader in advanced memory technology, today announced that it has developed HBM3E 12H, the industry’s first 12-stack HBM3E DRAM and the highest-capacity HBM product to date.
  • View the full release here: https://www.businesswire.com/news/home/20240226986259/en/
    Samsung Develops Industry-First 36GB HBM3E 12H DRAM (Photo: Business Wire)
    Samsung’s HBM3E 12H provides an all-time high bandwidth of up to 1,280 gigabytes per second (GB/s) and an industry-leading capacity of 36 gigabytes (GB).
  • “The industry’s AI service providers are increasingly requiring HBM with higher capacity, and our new HBM3E 12H product has been designed to answer that need,” said Yongcheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics.
  • As AI applications grow exponentially, the HBM3E 12H is expected to be an optimal solution for future systems that require more memory.

Inviting the AI-powered 5G Era, GIGABYTE will Present Next-Gen Servers for AI/HPC, Telecom, and Green Computing Solutions at MWC 2024

Retrieved on: 
Thursday, February 15, 2024
Hardware, Automotive Manufacturing, Security, Data Management, Sustainability, Manufacturing, Technology, 5G, Environment, Artificial Intelligence, Science, Networks, Other Science, Internet, Mobile, Wireless, Engineering, Gigabyte Technology, Algorithm, Intel, AFA, TCO, Multimedia, Apus, AI, Booth, MWC, ADAS, RAN, Advanced driver-assistance system, GIGABYTE, Immersion, HBM3, AMD, Luigi, Cloud computing, NVIDIA, Video game

The showcase will also feature integrated green computing solutions excelling in heat dissipation and energy reduction.

Key Points: 
  • The showcase will also feature integrated green computing solutions excelling in heat dissipation and energy reduction.
  • View the full release here: https://www.businesswire.com/news/home/20240215917651/en/
    Inviting the AI-powered 5G Era, GIGABYTE will Present Next-Gen Servers for AI HPC, Telecom, and Green Computing Solutions at MWC 2024
    Continuing the booth theme “ Future of COMPUTING ”, GIGABYTE's presentation will cover servers for AI/HPC, RAN and Core networks, modular edge platforms, all-in-one green computing solutions, and AI-powered self-driving technology.
  • At MWC, GIGABYTE is set to showcase its comprehensive all-in-one green computing solution, featuring a large-scale immersion cooling tank and two immersion-ready servers tailored for AI and cloud computing.
  • At GIGABYTE’s booth, enterprises can explore innovative and flexible computing solutions aligning with their strategies to gain a competitive edge in the AI-accelerated 5G future.

Keysight Introduces Chiplet PHY Designer for Simulating D2D to D2D PHY IP Supporting the UCIe™ Standard

Retrieved on: 
Wednesday, January 24, 2024
Technology, Hardware, Electronic Design Automation, Semiconductor, HBM3, Senior, D2D, Chiplet, BER, EDA, LPDDR5, SerDes, Multimedia, IBIS, Ecosystem, VTF, 3D, DDR5, Commerce, UCIe, JEDEC, Printed circuit board

View the full release here: https://www.businesswire.com/news/home/20240124811619/en/

Key Points: 
  • View the full release here: https://www.businesswire.com/news/home/20240124811619/en/
    Chiplet PHY Designer simulates the UCIe specification for D2D physical layer interconnect.
  • (Graphic: Business Wire)
    UCIe is emerging as the leading chiplet interconnect specification in the semiconductor industry.
  • Chiplet PHY Designer simplifies the electrical simulation process for large die-die electrical connectivity, such as UCIe.
  • Chiplet PHY Designer accelerates validation of chiplet subsystems, from one D2D PHY through interconnect channels to another D2D PHY, much earlier in the design cycle.

SK hynix Reports Financial Results for 2023, 4Q23

Retrieved on: 
Wednesday, January 24, 2024
HBM3, Landing slot, DRAM, ASP, CFO, Memory, AI, Memory module, Investment, App Store (iOS/iPadOS), DDR5, Dram, SK Hynix, Computer data storage

SEOUL, South Korea, Jan. 24, 2024 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today that it recorded an operating profit of 346 billion won in the fourth quarter of last year amid a recovery of the memory chip market, marking the first quarter of profit following four straight quarters of losses.

Key Points: 
  • (Based on K-IFRS)
    SK hynix said that the overall memory market conditions improved in the last quarter of 2023 with demand for AI server and mobile applications increasing and average selling price (ASP) rising.
  • "We recorded the first quarterly profit in a year following efforts to focus on profitability," it said.
  • For the year of 2024, SK hynix will focus on improving profitability and efficiency through sales of value-added products, while minimizing an increase in capital expenditure for a stable operation of the business.
  • "We achieved a remarkable turnaround, marking the first operating profit in the fourth quarter following a protracted downturn, thanks to our technological leadership in the AI memory space," said Kim Woohyun, Vice President and Chief Financial Officer (CFO) at SK hynix.