TSMC Celebrates 30th North America Technology Symposium with Innovations Powering AI with Silicon Leadership
TSMC (TWSE: 2330, NYSE: TSM) today unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company’s 2024 North America Technology Symposium.
- TSMC (TWSE: 2330, NYSE: TSM) today unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company’s 2024 North America Technology Symposium.
- This year marks the 30th anniversary of TSMC’s North America Technology Symposium, and more than 2,000 attended the event, growing from less than 100 attendees 30 years ago.
- The North America Technology Symposium in Santa Clara, California kicks off TSMC Technology Symposiums around the world in the coming months.
- The symposium also features an “Innovation Zone,” designed to highlight the technology achievements of our emerging start-up customers.