Flip chip

Dahua Showcases Immersive Display and Control Solutions at ISE 2024

Retrieved on: 
Thursday, February 1, 2024
Visual communication, Digital signage, LED display, Exhibition, Flip chip, Dahua Technology, Education, COB, LED, Fatigue, Artificial intelligence of things, Television

BARCELONA, Spain, Feb. 1, 2024 /PRNewswire/ -- Dahua Technology, a world-leading video-centric AIoT solution and service provider, is showcasing its latest lineup of display and control solutions at Integrated System Europe (ISE) 2024 in Barcelona, Spain.

Key Points: 
  • BARCELONA, Spain, Feb. 1, 2024 /PRNewswire/ -- Dahua Technology, a world-leading video-centric AIoT solution and service provider, is showcasing its latest lineup of display and control solutions at Integrated System Europe (ISE) 2024 in Barcelona, Spain.
  • "We are delighted to showcase the ultimate immersive visual experience driven by advanced technology to European and global visitors," said Chenzhi Zhu, CEO of Dahua Iberia.
  • "Dahua is keen to explore and develop in emerging fields, offering innovative solutions with superior functionality for modern businesses."
  • To learn more about Dahua's display and control solutions, please visit our stand at 3Q150 (until February 2), or visit our official website here .

High-speed Data Converter Market worth $4.3 billion by 2028 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Wednesday, January 10, 2024
Silicon, RF, WLAN, SOP, MRI, Texas Instruments, GPS, Infineon Technologies, USB On-The-Go, ROHM, Audio power amplifier, Semiconductor, Microchip Technology, Analog Devices, Growth, Digital, BGA, Renesas Electronics, Bluetooth, Less, Acquisition, Sub, Industrial internet of things, Flip chip, Wireless, Data analysis, Analog, Communication, Telehealth, Modem, Consumer electronics, Row, Video game

Analog-to-digital converter holds the largest market share and is expected to retain its position during the forecast period by growing at the highest growth rate.

Key Points: 
  • Analog-to-digital converter holds the largest market share and is expected to retain its position during the forecast period by growing at the highest growth rate.
  • These technologies rely on high-speed data transmission and conversion for real-time patient monitoring, remote consultations, and data analysis.
  • North America is likely to account for the second-largest market share of the overall high-speed data converter industry during 2023 to 2028.
  • The report profiles key high-speed data converter companies players and analyzes their market shares.

High-speed Data Converter Market worth $4.3 billion by 2028 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Wednesday, January 10, 2024
Silicon, RF, WLAN, SOP, MRI, Texas Instruments, GPS, Infineon Technologies, USB On-The-Go, ROHM, Audio power amplifier, Semiconductor, Microchip Technology, Analog Devices, Growth, Digital, BGA, Renesas Electronics, Bluetooth, Less, Acquisition, Sub, Industrial internet of things, Flip chip, Wireless, Data analysis, Analog, Communication, Telehealth, Modem, Consumer electronics, Row, Video game

Analog-to-digital converter holds the largest market share and is expected to retain its position during the forecast period by growing at the highest growth rate.

Key Points: 
  • Analog-to-digital converter holds the largest market share and is expected to retain its position during the forecast period by growing at the highest growth rate.
  • These technologies rely on high-speed data transmission and conversion for real-time patient monitoring, remote consultations, and data analysis.
  • North America is likely to account for the second-largest market share of the overall high-speed data converter industry during 2023 to 2028.
  • The report profiles key high-speed data converter companies players and analyzes their market shares.

ALD Equipment Market worth $6.2 billion by 2028 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Tuesday, October 31, 2023
Equipment, Hafnium(IV) oxide, MOSFET, Biomaterial, Audio power amplifier, Silicon carbide, AI, Defense, Quality control, Internet of things, ALD, Institute for Liquid Atomization and Spray Systems, Electronics, Cardiology, CVD, Reverse engineering, Power electronics, Corrosion, Zirconium dioxide, Flip chip, ASM International, EUGENE, Aerospace, Lighting, RF, Gallium arsenide, Automation, Silicon dioxide, Communication, LED, Growth, Gallium nitride, Gas Control Equipment Ltd, Oxide, Less, Chemical control, LAM, Tokyo Electron, Fluid mechanics, SOP, Indium phosphide, Neurology, BGA, Consumer electronics, Telecommunications, Video game, Medical device, Semiconductor, Region, Automotive industry

Oxide film type is expected to account for the largest market size of the ALD equipment market during the forecast period.

Key Points: 
  • Oxide film type is expected to account for the largest market size of the ALD equipment market during the forecast period.
  • Therefore, oxide films are expected to have the largest market size in the ALD equipment market.
  • Medical application is projected to register the highest CAGR in ALD equipment market during the forecast period.
  • Furthermore, strong presence of ALD equipment market players in the region creates growth opportunities for the ALD equipment in Asia Pacific.

ALD Equipment Market worth $6.2 billion by 2028 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Tuesday, October 31, 2023
Equipment, Hafnium(IV) oxide, MOSFET, Biomaterial, Audio power amplifier, Silicon carbide, AI, Defense, Quality control, Internet of things, ALD, Institute for Liquid Atomization and Spray Systems, Electronics, Cardiology, CVD, Reverse engineering, Power electronics, Corrosion, Zirconium dioxide, Flip chip, ASM International, EUGENE, Aerospace, Lighting, RF, Gallium arsenide, Automation, Silicon dioxide, Communication, LED, Growth, Gallium nitride, Gas Control Equipment Ltd, Oxide, Less, Chemical control, LAM, Tokyo Electron, Fluid mechanics, SOP, Indium phosphide, Neurology, BGA, Consumer electronics, Telecommunications, Video game, Medical device, Semiconductor, Region, Automotive industry

Oxide film type is expected to account for the largest market size of the ALD equipment market during the forecast period.

Key Points: 
  • Oxide film type is expected to account for the largest market size of the ALD equipment market during the forecast period.
  • Therefore, oxide films are expected to have the largest market size in the ALD equipment market.
  • Medical application is projected to register the highest CAGR in ALD equipment market during the forecast period.
  • Furthermore, strong presence of ALD equipment market players in the region creates growth opportunities for the ALD equipment in Asia Pacific.

Co-Packaged Optics Market worth $49 million by 2028 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Thursday, October 26, 2023
Quanta, Haryana, DLP, Audio power amplifier, LCOS, OLED, LTPS, Quanta Computer, CPO, Applicable convention, Internet of things, Communication, 3D, WDM, Fibre Channel, Data, FD-SOI, Cloud computing, Flip chip, Convention (norm), RF, Fronthaul, Data center, PET, PEN, Oxide, LED, Growth, Network, Telecom, Component, Data rate, David Crystal, Policy, Silicon, Government, HPC, SOP, BGA, Consumer electronics, Video game, Waveguide, Region, Geography, Transceiver, Telecommunications, Broadcom Inc., Molex, Plasma

The CPO type segment is expected to account for the largest share of the co-packaged optics market in 2023.

Key Points: 
  • The CPO type segment is expected to account for the largest share of the co-packaged optics market in 2023.
  • As the technology matures, its adoption is expected to increase further in data center and high-performance computing (HPC) markets.
  • Data center and high-performance computing is expected to account for the largest share of the co-packaged optics market in 2023.
  • Asia Pacific market is expected to witness the highest CAGR in the co-packaged optics market during the forecast period.

Co-Packaged Optics Market worth $49 million by 2028 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Thursday, October 26, 2023
Quanta, Haryana, DLP, Audio power amplifier, LCOS, OLED, LTPS, Quanta Computer, CPO, Applicable convention, Internet of things, Communication, 3D, WDM, Fibre Channel, Data, FD-SOI, Cloud computing, Flip chip, Convention (norm), RF, Fronthaul, Data center, PET, PEN, Oxide, LED, Growth, Network, Telecom, Component, Data rate, David Crystal, Policy, Silicon, Government, HPC, SOP, BGA, Consumer electronics, Video game, Waveguide, Region, Geography, Transceiver, Telecommunications, Broadcom Inc., Molex, Plasma

The CPO type segment is expected to account for the largest share of the co-packaged optics market in 2023.

Key Points: 
  • The CPO type segment is expected to account for the largest share of the co-packaged optics market in 2023.
  • As the technology matures, its adoption is expected to increase further in data center and high-performance computing (HPC) markets.
  • Data center and high-performance computing is expected to account for the largest share of the co-packaged optics market in 2023.
  • Asia Pacific market is expected to witness the highest CAGR in the co-packaged optics market during the forecast period.

3D IC and 2.5D IC Packaging Market worth $82.0 billion by 2028 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Tuesday, May 2, 2023
Pillar, Graphics processing unit, Communication, College of Engineering (KNUST), Semiconductor Industry Association, Aerospace, Memory, CSP, HBM, TPU, Defense, Electronics, Amkor Technology, 3D, BGA, Reverse engineering, LED, LGA, Audio power amplifier, ML, SOC, SOP, Silicon, CPU, FD-SOI, Glass, Equipment, Navigation, IC, Intel, CU, United Microelectronics Corporation, Quality control, SIP, PGA, AI, Consumer electronics, Flip chip, RF, GPU, Texas Instruments, Printed circuit board, Video game, Semiconductor, Region, Automotive industry, Samsung, Geography, Broadcom Inc.

2.5D IC packaging technology is expected to account for the largest share of the 3D IC and 2.5D IC packaging market during the forecast period.

Key Points: 
  • 2.5D IC packaging technology is expected to account for the largest share of the 3D IC and 2.5D IC packaging market during the forecast period.
  • The silicon interposer allows high wiring density within the device, which increases the performance compared to the traditional packaging technique, thereby driving the market growth for 2.5D IC packaging in 3D IC and 2.5D IC packaging Industry .
  • 3D and 2.5 IC packaging technologies are used in radar systems, avionics, and other electronic components.
  • Asia Pacific is expected to be the fastest-growing market in the world for 3D IC and 2.5D IC packaging, led by China, Japan, South Korea, and Taiwan, among others.

3D IC and 2.5D IC Packaging Market worth $82.0 billion by 2028 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Tuesday, May 2, 2023
Pillar, Graphics processing unit, Communication, College of Engineering (KNUST), Semiconductor Industry Association, Aerospace, Memory, CSP, HBM, TPU, Defense, Electronics, Amkor Technology, 3D, BGA, Reverse engineering, LED, LGA, Audio power amplifier, ML, SOC, SOP, Silicon, CPU, FD-SOI, Glass, Equipment, Navigation, IC, Intel, CU, United Microelectronics Corporation, Quality control, SIP, PGA, AI, Consumer electronics, Flip chip, RF, GPU, Texas Instruments, Printed circuit board, Video game, Semiconductor, Region, Automotive industry, Samsung, Geography, Broadcom Inc.

2.5D IC packaging technology is expected to account for the largest share of the 3D IC and 2.5D IC packaging market during the forecast period.

Key Points: 
  • 2.5D IC packaging technology is expected to account for the largest share of the 3D IC and 2.5D IC packaging market during the forecast period.
  • The silicon interposer allows high wiring density within the device, which increases the performance compared to the traditional packaging technique, thereby driving the market growth for 2.5D IC packaging in 3D IC and 2.5D IC packaging Industry .
  • 3D and 2.5 IC packaging technologies are used in radar systems, avionics, and other electronic components.
  • Asia Pacific is expected to be the fastest-growing market in the world for 3D IC and 2.5D IC packaging, led by China, Japan, South Korea, and Taiwan, among others.

Parade Technologies Reports Fourth Quarter and Fiscal 2022 Financial Results

Retrieved on: 
Wednesday, February 8, 2023
Technology, Hardware, Semiconductor, Consumer Electronics, Data-rate units, PSR, Flip chip, System, Taipei Exchange, TFT, Compute Express Link, CXL, PCI, OEM, Tcon, Gen 5 Fibre Channel, EDP, Glass, COG, Amorphous silicon, MSO, LCD, TED, PCI Express, Cryptocurrency, Video game, Payment card, Parade

Parade Technologies, Ltd. (Taipei Exchange: 4966.TWO), a leading high-speed interface IC supplier, today announced financial results for the fourth fiscal quarter and fiscal year 2022 ended December 31, 2022, and provided guidance for the first quarter of fiscal year 2023.

Key Points: 
  • Parade Technologies, Ltd. (Taipei Exchange: 4966.TWO), a leading high-speed interface IC supplier, today announced financial results for the fourth fiscal quarter and fiscal year 2022 ended December 31, 2022, and provided guidance for the first quarter of fiscal year 2023.
  • In US dollars, the fourth quarter of 2022 consolidated revenue decreased 32.83% sequentially and was down 47.77% year-over-year.
  • The gross profit in the fourth quarter of 2022 was US$44.68 million, representing a decrease of 34.66% from the previous quarter and a decrease of 52.46% compared to the same quarter of last year.
  • The financial figures detailed above for the fourth quarter of 2022 and for the year ended December 31, 2022 have not been audited or reviewed by independent accountants.