Dynamic random-access memory

Semiconductor Memory Market worth over USD 250 Bn by 2026: Global Market Insights, Inc.

Retrieved on: 
Wednesday, February 26, 2020
MOSFETs, Semiconductor devices, Digital technology, Computing, Computer architecture, Random-access memory, Semiconductor memory, Computer memory, Dram, Dynamic random-access memory

SELBYVILLE, Del., Feb. 25, 2020 /PRNewswire/ --Accordingto the latest report "Semiconductor Memory Market by Type (RAM, ROM), Application (Aerospace & Defense, Automotive, Consumer Electronics, Industrial, Medical, Telecommunications), Regional Outlook, Competitive Market Share & Forecast 2026", by Global Market Insights, Inc., the market valuation of semiconductor memory will cross $250 billion by 2026.

Key Points: 
  • SELBYVILLE, Del., Feb. 25, 2020 /PRNewswire/ --Accordingto the latest report "Semiconductor Memory Market by Type (RAM, ROM), Application (Aerospace & Defense, Automotive, Consumer Electronics, Industrial, Medical, Telecommunications), Regional Outlook, Competitive Market Share & Forecast 2026", by Global Market Insights, Inc., the market valuation of semiconductor memory will cross $250 billion by 2026.
  • The RAM memory type dominates the semiconductor memory market with the DRAM sub-segment accounting for over 75% revenue share in 2019.
  • Asia Pacific held a share of approximately 49% in the global semiconductor memory market in 2019.
  • - Semiconductor memory providers are focusing on the development of innovative products and improving their existing product portfolio to gain a competitive edge in the market.

Tachyum Joins JEDEC Committees Working on Standards for Solid State Memories

Retrieved on: 
Tuesday, February 25, 2020
Networks, Semiconductor, Hardware, Data management, Technology, Computer memory, JEDEC, Inventions, Dynamic random-access memory, Computing, Digital technology, Random-access memory, JEDEC memory standards

Semiconductor startup Tachyum Inc. today announced that it has become members of two JEDEC committees developing standards for solid state memories and DRAM modules that will shape the semiconductor industrys position in the rapidly evolving global marketplace.

Key Points: 
  • Semiconductor startup Tachyum Inc. today announced that it has become members of two JEDEC committees developing standards for solid state memories and DRAM modules that will shape the semiconductor industrys position in the rapidly evolving global marketplace.
  • Tachyum is one of nearly 300 member companies of the JEDEC, the global leader in developing open standards for the microelectronics industry.
  • The company has joined committees JC-42 Solid State Memories, which include all memory-integrated circuits and programmable logic devices, and JC-45 DRAM Modules, addressing architectural, electrical, test and SPD issues related to memory design and manufacturing for commercial applications.
  • JEDEC committees develop open standards that enable innovation by helping commoditize components, which lowers prices yet retains quality and reliability, helping to build a foundation for a successful marketplace.

Samsung Begins Mass Production of Industry’s First 16GB LPDDR5 DRAM for Next-Generation Premium Smartphones

Retrieved on: 
Tuesday, February 25, 2020
Other Manufacturing, Technology, Mobile, Wireless, Telecommunications, Manufacturing, Software, Hardware, Data management, Consumer electronics, Personal computing, Technology, Consumer electronics, Computing, Computer memory, Smartphones, Dynamic random-access memory, Samsung Electronics, Smartphone, Gaming computer, Dram

Samsung Electronics Co., Ltd., a world leader in advanced memory technology, today announced that it has begun mass producing the industrys first 16-gigabyte (GB) LPDDR5 mobile DRAM package for next-generation premium smartphones.

Key Points: 
  • Samsung Electronics Co., Ltd., a world leader in advanced memory technology, today announced that it has begun mass producing the industrys first 16-gigabyte (GB) LPDDR5 mobile DRAM package for next-generation premium smartphones.
  • Following mass production of the industry-first 12GB LPDDR5 in July, 2019, the new 16GB advancement will lead the premium mobile memory market with added capacity that enables enhanced 5G and AI features including graphic-rich gaming and smart photography.
  • Samsungs 16GB LPDDR5 mobile DRAM package consists of eight 12-gigabit (Gb) chips and four 8Gb chips, equipping premium smartphones with twice the DRAM capacity found in many higher-end laptops and gaming PCs today.
  • Along with the blazing-fast performance, the industrys largest capacity supports dynamic and responsive game play as well as ultra-high-resolution graphics on premium smartphones for highly immersive mobile gaming experiences.

Samsung Begins Mass Production of Industry’s First 16GB LPDDR5 DRAM for Next-Generation Premium Smartphones

Retrieved on: 
Tuesday, February 25, 2020
Telecommunications, Audio, Video, Hardware, Data management, Consumer electronics, Technology, Semiconductor, Mobile, Wireless, Personal computing, Technology, Consumer electronics, Computing, Computer memory, Smartphones, Samsung Electronics, Videotelephony, Dynamic random-access memory, Smartphone, Gaming computer

Samsung Electronics Co., Ltd., a world leader in advanced memory technology, today announced that it has begun mass producing the industrys first 16-gigabyte (GB) LPDDR5 mobile DRAM package for next-generation premium smartphones.

Key Points: 
  • Samsung Electronics Co., Ltd., a world leader in advanced memory technology, today announced that it has begun mass producing the industrys first 16-gigabyte (GB) LPDDR5 mobile DRAM package for next-generation premium smartphones.
  • Following mass production of the industry-first 12GB LPDDR5 in July, 2019, the new 16GB advancement will lead the premium mobile memory market with added capacity that enables enhanced 5G and AI features including graphics-rich gaming and smart photography.
  • Samsungs 16GB LPDDR5 mobile DRAM package consists of eight 12-gigabit (Gb) chips and four 8Gb chips, equipping premium smartphones with twice the DRAM capacity found in many higher-end laptops and gaming PCs today.
  • Along with the blazing-fast performance, the industrys largest capacity supports dynamic and responsive gameplay as well as ultra-high-resolution graphics on premium smartphones for highly immersive mobile gaming experiences.

Alliance Memory Confirms Plans to Exhibit ICs at Embedded World 2020

Retrieved on: 
Thursday, February 20, 2020
Computing, Digital technology, Inventions, Dynamic random-access memory, Random-access memory, Synchronous dynamic random-access memory, Computer memory, Flash memory, DDR4 SDRAM, Static random-access memory, T-RAM

KIRKLAND, Wash., Feb. 20, 2020 (GLOBE NEWSWIRE) -- Alliance Memory today confirmed that it will exhibit its SRAMs, DRAMs and flash memory ICs for legacy and new designs at Embedded World 2020, taking place Feb. 25-27 in Nuremberg, Germany.

Key Points: 
  • KIRKLAND, Wash., Feb. 20, 2020 (GLOBE NEWSWIRE) -- Alliance Memory today confirmed that it will exhibit its SRAMs, DRAMs and flash memory ICs for legacy and new designs at Embedded World 2020, taking place Feb. 25-27 in Nuremberg, Germany.
  • Were grateful that Alliance Memory has seen no major impact at all in our production and supply chain, which is based predominantly in Taiwan.
  • In Hall 3, Stand 318 at Embedded World, Alliance Memory will highlight its SRAM, pseudo SRAM, NOR Flash, and DRAM memory ICs for embedded platforms, including:
    Alliance Memory has expanded its product offering with a new line of high-speed CMOS DDR4 SDRAMs.
  • Alliance Memory is a worldwide provider of critical and hard-to-find DRAM and SRAM memory ICs for the communications, computing, consumer electronics, medical, automotive, and industrial markets.

Innodisk Unveils Security-optimized AIoT Solutions

Retrieved on: 
Wednesday, February 19, 2020
Computer memory, Computing, Digital technology, Dynamic random-access memory, DDR4 SDRAM, Firmware, Random-access memory, Computers

To tackle this challenge, Innodisk has developed a security-optimized product range that fortifies security at the hardware, firmware, and software levels.

Key Points: 
  • To tackle this challenge, Innodisk has developed a security-optimized product range that fortifies security at the hardware, firmware, and software levels.
  • Innodisk is unveiling a security and performance-oriented suite of products from across its flash storage, embedded peripheral, and DRAM product lines.
  • Innodisk is also debuting its innovative AI accelerator card, which brings exceptional AI performance to security applications on the edge.
  • Combined with Innodisk's high-performance DDR4-3200 DRAM and comprehensive software solutions, this product line demonstrates Innodisk's commitment to cutting-edge solutions optimized for the security industry.

Micron Delivers World’s First Mass-Produced, Low-Power DDR5 DRAM for High-Performance Smartphones

Retrieved on: 
Thursday, February 6, 2020
SDRAM, Computer memory, Micron Technology, Dynamic random-access memory, Micron, LPDDR, Science and technology in the United States, Companies, Economy of the United States

As Xiaomis memory technology partner, Micron provides LPDDR5 DRAM with superior power efficiency and faster data access speeds to meet growing consumer demand for artificial intelligence (AI) and 5G functionality in smartphones.

Key Points: 
  • As Xiaomis memory technology partner, Micron provides LPDDR5 DRAM with superior power efficiency and faster data access speeds to meet growing consumer demand for artificial intelligence (AI) and 5G functionality in smartphones.
  • Microns LPDDR5 DRAM addresses those requirements with a 50% increase in data access speeds and more than 20% power efficiency compared to previous generations.
  • 2020 Micron, the Micron logo, and all other Micron trademarks are the property of Micron Technology, Inc. All other trademarks are the property of their respective owners.
  • Micron Media Relations Contact Erica Pompen Micron Technology, Inc. +1 (408) 834-1873 [email protected] Micron Investor Relations Contact Farhan Ahmad Micron Technology, Inc. +1 (408) 834-1927 [email protected]

ScaleMP Demonstrates Best-in-Class Large-System Results

Retrieved on: 
Tuesday, January 14, 2020
Semiconductor, Hardware, Data management, Technology, Software, Computer memory, Digital technology, Computing, Parallel computing, Classes of computers, Computers, Virtualization, Dynamic random-access memory, Symmetric multiprocessing, Random-access memory, vSMP Foundation, ScaleMP

vSMP MemoryONE enables the transparent use of NVM storage as system memory, to reduce TCO and expand beyond traditional DRAM scaling limitations.

Key Points: 
  • vSMP MemoryONE enables the transparent use of NVM storage as system memory, to reduce TCO and expand beyond traditional DRAM scaling limitations.
  • ScaleMP is the leader in virtualization for high-end computing, providing increased performance and total cost of ownership (TCO) reduction.
  • Using software to replace custom hardware systems and components, ScaleMP offers a revolutionary scale-up computing paradigm by delivering industry-standard, high-end symmetric multiprocessing compute and memory environments.
  • vSMP Foundation is a trademark or registered trademark of ScaleMP.

Alliance Memory Relocates Headquarters to Kirkland, Washington

Retrieved on: 
Friday, January 10, 2020
Computer memory, Computing, Digital technology, Information and communications technology, Random-access memory, Dynamic random-access memory, Internet of things, Kirkland, Read-only memory

KIRKLAND, Wash., Jan. 10, 2020 (GLOBE NEWSWIRE) -- Alliance Memory today announced the company has moved its headquarters and USA warehouse facility from California to Kirkland, Washington, near Seattle.

Key Points: 
  • KIRKLAND, Wash., Jan. 10, 2020 (GLOBE NEWSWIRE) -- Alliance Memory today announced the company has moved its headquarters and USA warehouse facility from California to Kirkland, Washington, near Seattle.
  • The companys new address and phone/fax numbers are:
    With this move, we have expanded our warehouse capacity and introduced a more streamlined and efficient logistics center, said David Bagby, Alliance Memory president and CEO.
  • Alliance Memory is a worldwide provider of critical and hard-to-find DRAM and SRAM memory ICs for the communications, computing, consumer electronics, embedded, IoT, medical, automotive, and industrial markets.
  • Privately held, Alliance Memory maintains headquarters in Kirkland, Washington, and regional offices in Europe, Asia, Canada, and South America.

Aerospike 4.8 Delivers Unmatched Durability and Performance with Data Stored in Intel Optane DC Persistent Memory

Retrieved on: 
Tuesday, December 10, 2019
Data management, Technology, Software, Networks, Internet, Hardware, Data management, Computing, Digital technology, Computer memory, Structured storage, Aerospike, Random-access memory, Persistent memory, Intel, Persistent, Data, Dynamic random-access memory

This latest release further enhances Aerospikes Hybrid-Memory Architecture to enable both database indexes and data to be stored in Intel Optane DC persistent memory.

Key Points: 
  • This latest release further enhances Aerospikes Hybrid-Memory Architecture to enable both database indexes and data to be stored in Intel Optane DC persistent memory.
  • Aerospike 4.8, with indices and data stored in PMEM, ensures every single write is confirmed to disk with no data loss at performance levels exceeding prior releases.
  • Aerospike 4.8 can be configured with both indices and data stored in persistent memory.
  • Intel Optane DC persistent memory delivers a combination of data persistence and DRAM-like performance, a powerful combination in the hands of innovative developers like Aerospike, said Alper Ilkbahar, vice president and general manager of the Memory & Storage Products Group at Intel.