FLOPS

FEDML Empowers On-Premise AI Innovation at DENSO

Retrieved on: 
Tuesday, April 30, 2024
Technology, Online Privacy, Engineering, Venture Capital, Manufacturing, Aftermarket, Automotive, Professional Services, Artificial Intelligence, Software, Networks, Internet, Data Management, Security, Nexus, FLOPS, Fédéré, AI, Federated, Partnership, ADAS, Scale, Algorithm, Aggregation, Synthetic media, Silicon, Privacy, Multimedia, GPU, Generative, Confidentiality, API, DENSO, Organization, Federated learning, DeepSpeed

FEDML , the company providing "Your Generative AI Platform at Scale," today announced its partnership with DENSO, one of the largest automotive suppliers in the world, to empower fully on-premise training, development, and deployment of AI models and applications via FEDML Nexus AI platform .

Key Points: 
  • FEDML , the company providing "Your Generative AI Platform at Scale," today announced its partnership with DENSO, one of the largest automotive suppliers in the world, to empower fully on-premise training, development, and deployment of AI models and applications via FEDML Nexus AI platform .
  • Your Generative AI Platform at Scale – this is the mission that defines FEDML and its commitment to helping enterprises navigate the AI revolution with full ownership and control.
  • FEDML Nexus is an all-in-one powerful AI platform that provides the foundation to build and commercialize any AI application easily, scalably, privately, and economically.
  • Deploying FEDML Nexus AI on-premise enables any enterprise to operate its own AI platform on its infrastructure, ensuring maximum privacy, ownership, and control.

Aetina Accelerates Embedded AI with High-performance, Small Form-factor Aetina IA380E-QUFL Graphics Card

Retrieved on: 
Thursday, April 25, 2024
Head, PCI Express, City, UHD, Intel, GDDR6, FLOPS, FP32, Multimedia, GPU, Embedded, Intel Arc

TAIPEI, April 25, 2024 /PRNewswire/ -- Aetina , a leading Edge AI solution provider, announced the launch of the Aetina IA380E-QUFL at Embedded World 2024 in Nuremberg, Germany.

Key Points: 
  • TAIPEI, April 25, 2024 /PRNewswire/ -- Aetina , a leading Edge AI solution provider, announced the launch of the Aetina IA380E-QUFL at Embedded World 2024 in Nuremberg, Germany.
  • This groundbreaking product is a small form factor PCIe graphics card powered by the high-performance Intel Arc A380E GPU.
  • Embedded system manufacturers and integrators can leverage the power of 4.096 TFLOPs peak FP32 performance delivered by the Intel Arc A380E GPU[1].
  • "The demand for slim and energy-efficient AI systems is rapidly escalating," said Jackal Chen, Senior Product Manager at Aetina.

Aetina Accelerates Embedded AI with High-performance, Small Form-factor Aetina IA380E-QUFL Graphics Card

Retrieved on: 
Thursday, April 25, 2024
Head, PCI Express, City, UHD, Intel, GDDR6, FLOPS, FP32, GPU, Embedded, Intel Arc

TAIPEI, April 25, 2024 /PRNewswire/ -- Aetina , a leading Edge AI solution provider, announced the launch of the Aetina IA380E-QUFL at Embedded World 2024 in Nuremberg, Germany.

Key Points: 
  • TAIPEI, April 25, 2024 /PRNewswire/ -- Aetina , a leading Edge AI solution provider, announced the launch of the Aetina IA380E-QUFL at Embedded World 2024 in Nuremberg, Germany.
  • This groundbreaking product is a small form factor PCIe graphics card powered by the high-performance Intel Arc A380E GPU.
  • The Aetina IA380E-QUFL delivers workstation-level performance packed into a low-profile, single-slot form factor.
  • "The demand for slim and energy-efficient AI systems is rapidly escalating," said Jackal Chen, Senior Product Manager at Aetina.

Global and China Intelligent Vehicle Cockpit-driving Integration Industry Report 2024 Featuring 44 Products and Solutions Suppliers and 9 Major Chip Vendors

Retrieved on: 
Friday, March 15, 2024
OTA, SOC, GPU, Algorithm, AVM, INT8, Original equipment manufacturer, RPA, Intelligence, DRIVE, Visteon, Nvidia Drive, Qualcomm, FLOPS, ARM, Geely, ECU, Écu, EEA, DMIPS, NPU, NOA, CES, Lidar, APA, J3, Baidu, Lynk, Video game

DUBLIN, March 14, 2024 /PRNewswire/ -- The "Intelligent Vehicle Cockpit-driving Integration (Cockpit-driving-parking) Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • DUBLIN, March 14, 2024 /PRNewswire/ -- The "Intelligent Vehicle Cockpit-driving Integration (Cockpit-driving-parking) Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.
  • Against this background, three main integration forms come out: driving-parking integration, cockpit-parking integration and cockpit-driving integration.
  • Given this, the publisher released the Intelligent Vehicle Cockpit-driving Integration (Cockpit-driving-parking) Industry Report, 2024, aiming to comprehensively comb through cockpit-driving-parking integration and summarize the development directions of the industry.
  • Driving-parking integration: Since wide adoption in 2023, driving-parking integration solutions have been mounted on nearly 70 vehicle models of more than 30 manufacturers.

MemryX Inc. and Lenovo Demonstrate the MemryX MX3 AI Accelerator Integrated into the Lenovo ThinkCentre neo Ultra Desktop PC at CES 2024

Retrieved on: 
Thursday, January 11, 2024
ANN, ThinkCentre, CES, CPU, MX3, FLOPS, NPU, GPU

ANN ARBOR, Mich., Jan. 11, 2024 /PRNewswire/ -- MemryX Inc. announced a significant milestone today with the demonstration of its MX3 AI accelerator chip operating on the Lenovo ThinkCentre neo Ultra desktop PC at CES 2024.

Key Points: 
  • ANN ARBOR, Mich., Jan. 11, 2024 /PRNewswire/ -- MemryX Inc. announced a significant milestone today with the demonstration of its MX3 AI accelerator chip operating on the Lenovo ThinkCentre neo Ultra desktop PC at CES 2024.
  • This collaborative AI PC integration enables the next generation of high-performance computing, utilizing the combined strengths of the CPU, GPU, and discrete neural processing unit (NPU) to elevate application performance and new usages to the PC.
  • The Lenovo ThinkCentre neo Ultra is expected to be available in Q2'24.
  • For more information on the ThinkCentre neo please visit Lenovo online at: https://news.lenovo.com/pressroom/press-releases/ai-pc-thinkbook-laptops... For more information on the MX3 AI accelerator, please visit MemryX online at www.MemryX.com .

University of Stuttgart and Hewlett Packard Enterprise to Build Exascale Supercomputer

Retrieved on: 
Tuesday, December 19, 2023
Software, Professional Services, Hardware, Data Management, Technology, University, Artificial Intelligence, Semiconductor, Education, Data Analytics, Engineering, Other Technology, Manufacturing, Architecture, FLOPS, HLRS, Gottfried Wilhelm Leibniz, Executive, AMD, Central processing unit, German, Electronics, Cray, Computer simulation, Hewlett Packard Enterprise, AI, GPU, HPDA, HPC, Parliament, SME, CPU, Ministry, HPE, Supercomputer, Artificial intelligence, Climate change, Nouvelle AI, Memory, GCS, CO2, BMBF, Graphics processing unit, Intelligence, Corporation, APU, Video game

The University of Stuttgart and Hewlett Packard Enterprise (NYSE: HPE) have announced an agreement to build two new supercomputers at the High-Performance Computing Center of the University of Stuttgart ( HLRS ).

Key Points: 
  • The University of Stuttgart and Hewlett Packard Enterprise (NYSE: HPE) have announced an agreement to build two new supercomputers at the High-Performance Computing Center of the University of Stuttgart ( HLRS ).
  • Hunter will be based on the HPE Cray EX4000 supercomputer, which is designed to deliver exascale performance to support large-scale workloads across modeling, simulation, AI, and HPDA.
  • We look forward to building on our collaboration to pave the way to exascale for HLRS using the HPE Cray EX supercomputer.
  • We are particularly excited that we have found a globally leading partner for these topics in Hewlett Packard Enterprise, who together with AMD will open up new horizons of performance for our clients.”

Tachyum 8 AI Zettaflops Blueprint to Solve OpenAI Capacity Limitation

Retrieved on: 
Tuesday, December 12, 2023
Semiconductor, Data Management, Technology, Software, Artificial Intelligence, Hardware, GPU, Attention, IEEE, Economics, Organization, LMMS, OPEX, HPL, OpenAI, Ori, LINPACK, CAPEX, HPC, Azure, Microsoft Azure, Universal, AI, Microsoft, FLOPS, Prodigy, LLM, Video game, Cassette tape

The solution is ideally suited for OpenAI, others like Microsoft Azure, CoreWeave, Ori, etc.

Key Points: 
  • The solution is ideally suited for OpenAI, others like Microsoft Azure, CoreWeave, Ori, etc.
  • and research facilities needing AI datacenters that today do not have the system architecture capable of serving all interested customers.
  • For the supercomputer solution referenced in the white paper, Prodigy has a custom 46RU rack with a liquid-cooled reference design.
  • Tachyum’s software team has already integrated a software package for HPL LINPACK and other software for HPC with AI running on Prodigy FPGA soon.

Cerebras and G42 Complete 4 exaFLOP AI Supercomputer and Start the March Towards 8 exaFLOPs

Retrieved on: 
Monday, November 13, 2023
Hardware, Data Management, Technology, Artificial Intelligence, Software, FLOPS, CG-2, G42, Organization, Investment, Condor, Element, Language, EVP, Partnership, AMD, NGC 6872, AI, System, LLM, Copper, Medical device

With the completion of Condor Galaxy 1, Cerebras and G42 have broken ground on the Condor Galaxy 2 (CG-2).

Key Points: 
  • With the completion of Condor Galaxy 1, Cerebras and G42 have broken ground on the Condor Galaxy 2 (CG-2).
  • This represents an important milestone in Cerebras and G42’s plan to build a 36 exaFLOP constellation of AI supercomputers.
  • “G42’s strategic partnership with Cerebras Systems is paving the way toward our joint vision of creating the world’s largest and fastest AI supercomputers,” said Kiril Evtimov, Group CTO, G42.
  • With 36 exaFLOPs in total, this unprecedented constellation of supercomputers will revolutionize the advancement of AI globally.

CIQ Launches 'FLOPS and Threads,' the Podcast Focused on Computing, Cloud, Software, Linux and Open Source

Retrieved on: 
Friday, December 8, 2023
Red Hat Enterprise Linux, FLOPS, Automation, Running, Organization, HPC, RENO, Weaving, Video game, CIQ

RENO, Nev., Dec. 8, 2023 /PRNewswire-PRWeb/ -- CIQ, the company building the next generation of software infrastructure for enterprises running performance-intensive workloads atop Rocky Linux, has launched a podcast called FLOPS and Threads to unravel the intricacies of enterprise software infrastructure—from Enterprise Linux to HPC, cloud, automation and containers. Episodes feature experts from CIQ, open source communities, and other organizations in the industry.

Key Points: 
  • Listen to 'FLOPS and Threads' as industry and open source experts engage in thoughtful conversations about best practices, lessons learned, and innovative ways to address challenges and opportunities of running performance-intensive workloads.
  • RENO, Nev., Dec. 8, 2023 /PRNewswire-PRWeb/ -- CIQ , the company building the next generation of software infrastructure for enterprises running performance-intensive workloads atop Rocky Linux, has launched a podcast called FLOPS and Threads to unravel the intricacies of enterprise software infrastructure—from Enterprise Linux to HPC, cloud, automation and containers.
  • Episodes feature experts from CIQ, open source communities, and other organizations in the industry.

Hammerspace Showcases High-Performance Data Orchestration for HPC and AI Workloads at SC23

Retrieved on: 
Thursday, November 9, 2023
Colorado Convention Center, Denver Athletic Club, HPC, Organization, Impact, Generative, Adobe, Data management, NAS, Corner office, The Corner, Quantum, RSVP, Sanity, Cartoon, Seagate, DataCore, SAN, GRAU, Computer data storage, Nightclub, Hammerspace, FLOPS

SAN MATEO, Calif., Nov. 9, 2023 /PRNewswire-PRWeb/ -- Hammerspace, the company orchestrating the Next Data Cycle, today announced that it will showcase its high-performance data orchestration system at Supercomputing 2023 (SC23), taking place at the Colorado Convention Center in Denver from November 12-17. Hammerspace provides the most modern parallel file system in the market which delivers HPC performance coupled with a standards-based architecture and fueled by powerful global data orchestration. Hammerspace empowers HPC environments with a single global file system for their entire global data environment from edge, to core, to cloud.

Key Points: 
  • Hammerspace provides the most modern parallel file system in the market which delivers HPC performance coupled with a standards-based architecture and fueled by powerful global data orchestration.
  • Hammerspace empowers HPC environments with a single global file system for their entire global data environment from edge, to core, to cloud.
  • "Data no longer has a singular relationship with the applications and computer environments that generate it – it needs to be used, analyzed and repurposed with different AI models, alternate workloads, and often across different HPC centers."
  • Hammerspace will have copies of its new book, Unstructured Data Orchestration For Dummies, Hammerspace Special Edition, available at its booth.