Winbond

OpenTitan® Partnership Announces First Public Secure Execution Environment for Integrated

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Monday, November 13, 2023
Devrient, Socs, Organization, Giesecke, Ecosystem, Documentation, SOC, Rot, APACHE II, Partnership, LowRISC, Growth, Architecture, Renewable energy, Winbond, Silicon

, the open silicon ecosystem organization, and zeroRISC , the first provider of commercial cloud security services for open silicon, today announced the early release of the first SoC secure execution environment, including root of trust (RoT) functionality, as part of the OpenTitan project.

Key Points: 
  • , the open silicon ecosystem organization, and zeroRISC , the first provider of commercial cloud security services for open silicon, today announced the early release of the first SoC secure execution environment, including root of trust (RoT) functionality, as part of the OpenTitan project.
  • Since 2018, the OpenTitan coalition has been focused on creating an open silicon ecosystem by consistently following a well-defined roadmap from discrete to integrated secure silicon designs.
  • While developing the architecture and specifications for the integrated secure execution environment, the project also accomplished the first discrete silicon tapeout in June 2023, a critical precursor to commercial silicon availability in 2024.
  • As more businesses embrace the project, the open and collaborative spirit of OpenTitan will continue to foster innovation and drive advancements in secure hardware design.

UMC Launches W2W 3D IC Project with Partners, Targeting Growth in Edge AI

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Tuesday, October 31, 2023
Electronic Design Automation, Semiconductor, Technology, Other Technology, Artificial Intelligence, Internet, Hardware, Internet of things, Digital, 3D, Intelligence, DRAM, NYSE, United Microelectronics Corporation, TSV, Comprehensive, ASE, R&D, R, Growth, EDA, ASIC, OSAT, TWSE, CMOS, Silicon, AI, UMC, Memory, Logic, Video game, Cadence, Michael Faraday, Winbond

United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, today announced it has initiated the W2W (wafer-to-wafer) 3D IC project in collaboration with partners Winbond, Faraday, ASE, and Cadence to help customers accelerate production of their 3D products.

Key Points: 
  • United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, today announced it has initiated the W2W (wafer-to-wafer) 3D IC project in collaboration with partners Winbond, Faraday, ASE, and Cadence to help customers accelerate production of their 3D products.
  • The W2W 3D IC project with partner collaboration targets edge AI applications – such as home and industrial IoT, security, and smart infrastructure – requiring mid-to-high range computing power, extensive and customizable memory modules, and relatively low power consumption.
  • “This project helps us collectively to improve customer time-to-market and sustain profitable growth through the integration technologies developed to accomplish application excellence in the AI era.”
    “With the continued proliferation of edge AI applications, 3D IC design is becoming increasingly crucial for our customers.
  • As the only EDA partner in this new project, we’re working closely with Faraday and UMC to enable 3D IC designs with the Cadence Integrity 3D-IC Platform.

Winbond Introduces Innovative CUBE Architecture for Powerful Edge AI Devices

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Wednesday, September 27, 2023
High, Cow, Winbond, TSV, 3D, Electronics, SOC, World of Warcraft, Architecture, ADAS, Video game, Computer data storage, IO, AI

The technology is suited to advanced applications such as wearable and edge server devices, surveillance equipment, ADAS, and co-robots

Key Points: 
  • The technology is suited to advanced applications such as wearable and edge server devices, surveillance equipment, ADAS, and co-robots
    "The CUBE architecture enables a paradigm shift in AI deployment," says Winbond.
  • "We believe that the integration of cloud AI and powerful edge AI will define the next phase of AI development.
  • With CUBE, we are unlocking new possibilities and paving the way for improved memory performance and cost optimization on powerful Edge AI device."
  • This not only enhances cost advantages, but also contributes to the overall efficiency, including small form factor of Edge AI devices.

Winbond Earns ISO/SAE 21434 Certification for W77Q Secure Flash, Becoming the World's First Memory IC Vendor to Achieve this Milestone

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Tuesday, August 8, 2023
GSR, EU, ISO, Criterion, IC, Electronics, Common Criteria, Confidentiality, Certification, SAE International, Acquisition, UNECE, Engineering, FIPS, International Organization (journal), Safety, WPLP, CMVP, Computer security, Medical device, Winbond

This certification is important for all OEMs to the automotive industry, and Winbond has now become the first Flash vendor worldwide to achieve this standard certification and meet global regulatory requirements.

Key Points: 
  • This certification is important for all OEMs to the automotive industry, and Winbond has now become the first Flash vendor worldwide to achieve this standard certification and meet global regulatory requirements.
  • The ISO/SAE 21434 Cybersecurity Product Certification for Winbond's W77Q Secure Flash family encompasses several key elements:
    Rigorous risk assessment and management processes to identify vulnerabilities and threats, enabling effective mitigation strategies.
  • Winbond takes pride in being the first Specialty memory IC manufacturer to receive this Automotive CyberSecurity certification.
  • With our Product Longevity Program (WPLP) offering long-term support for automotive applications, Winbond is the preferred memory provider worldwide.

Everspin to Provide Industry Insights on Automotive and Chiplet Panels at Flash Memory Summit

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Thursday, August 3, 2023
Software, Internet, Hardware, Electronic Design Automation, Data Management, IOT (Internet of Things), Technology, Semiconductor, Security, Engineering, Automotive Manufacturing, Manufacturing, DNA, Application, Difference, DRAM, Resistive random-access memory, Intelligence, Micron Technology, Silicon, Applicant tracking system, SRIOV, Motion, Flash memory, Intel, Silicon Motion, Architecture, Magnetoresistive RAM, FMS, Solid-state drive, Safety, Computer data storage, Nightclub, Everspin Technologies, Winbond, MRAM, Marketing

The Flash Memory Summit brings together industry leaders and startups across all forms of high-performance energy, including NAND Flash, DRAM, MRAM, ReRAM, and DNA data storage to discuss design, development, integration, marketing strategy and use cases.

Key Points: 
  • The Flash Memory Summit brings together industry leaders and startups across all forms of high-performance energy, including NAND Flash, DRAM, MRAM, ReRAM, and DNA data storage to discuss design, development, integration, marketing strategy and use cases.
  • In his presentation, O’Hare will discuss trends for automotive SSDs, including implementing new architecture and technologies to support the evolution toward autonomous vehicles.
  • Panelists will explore the differences between standalone memory chips and memory chiplets and how different interfaces may affect their architectures.
  • The event allows attendees to meet one-on-one with many experts within the flash memory industry.

Mobiveil and Winbond Partner to Deliver HYPERRAM IP Controller to SoC Designers

Retrieved on: 
Wednesday, August 2, 2023
Intellectual property, Partnership, PSRAM, DRAM, Internet of things, TWS, SOC, IP, Santa Clara Convention Center, AXI, IOT, SIP, Silicon, FMS, Random-access memory, Video game, Computer data storage, Winbond

Mobiveil adapted its HYPERRAM™ controller to leverage the unique characteristics of Winbond’s HYPERRAM device that offers speeds of up to 250MHz and densities from 32Mb to 512Mb supporting x8/x16 modes.

Key Points: 
  • Mobiveil adapted its HYPERRAM™ controller to leverage the unique characteristics of Winbond’s HYPERRAM device that offers speeds of up to 250MHz and densities from 32Mb to 512Mb supporting x8/x16 modes.
  • “Winbond is a leading global supplier of semiconductor memory solutions and an ideal partner,” remarks Ravi Thummarukudy, CEO of Mobiveil.
  • “Our HYPERRAM IP controller will be a welcome device for designers in need of ultra-low power consumption because it extends standby for battery-operated applications.
  • The Mobiveil HYPERRAM controller provides support for an AXI memory mapped system interface, linear, hybrid and wrap burst and low power features such as deep power down and hybrid sleep mode.

World Non Volatile Memory Vendor Share Analysis Report 2023: Will the Oversupply Shift to a Rejuvenation of Demand by Late 2023 or 2024? - ResearchAndMarkets.com

Retrieved on: 
Thursday, June 29, 2023
Technology, Data Management, Read-only memory, PCM, ASP, NOR, ASPS, Real-time clock, EPROM, NAND, Electronics, DRAM, RTC, Samsung, ICS, Winbond, MRAM, RRAM, NRAM, NvSRAM, OTP, NVSRAM, STMicroelectronics, SLC, Flash memory, Cypress, NVM, Non-volatile memory, 3D XPoint, NVRAM, Memory, Computer data storage, Video game, EEPROM, Flash, Infineon Technologies

The "Non Volatile Memory Market Shares by Vendor Report" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Non Volatile Memory Market Shares by Vendor Report" report has been added to ResearchAndMarkets.com's offering.
  • In addition, the NVSRAM market shares are broken out by vendor for Real Time Clocks (RTC) and NVSRAM from 2017-2022.
  • 2022 was a year of high inflation and downturn for Flash, DRAM and some Non Volatile Memory.
  • This report is vital for the seasoned memory professional as well as the casual market observer.

Winbond introduces the next generation 8Mb Serial Flash for edge devices in space constrained IoT applications

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Monday, June 19, 2023
SPI, MCU, NOR, Internet of things, OTA, Electronics, WLCSP, XIP, PC, Internet, Socs, SIP, RAM, Double data rate, Research, Family, KGD, Flash, Computer data storage, Video game, Winbond

"The Internet of Things is expanding to 50 billion connected devices by 2023," said Alan Niebel, president of WebFeet Research, an independent market-research firm.

Key Points: 
  • "The Internet of Things is expanding to 50 billion connected devices by 2023," said Alan Niebel, president of WebFeet Research, an independent market-research firm.
  • "Winbond's 3V 8Mb Serial Flash is suitable for both automotive and IoT segments.
  • Overall, IoT is poised to grow in this new connected world with all shipments of Serial Flash totaling 12.9B units worldwide by 2027".
  • The company has been supporting the requirements of customers using the 8Mb Serial Flash with the existing generation of W25QxxDV series for several years in applications including instrumentation, networking, PC, printer, automotive and gaming.

The Rising Demand For Electric Vehicles Is Expected To Drive Growth In The Microcontroller Market At A CAGR Of More Than 13% - By The Business Research Company

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Monday, May 1, 2023
Partnership, Bev, Winbond, Electronics, STM32, BEV, EVS, Car, Investment, STMicroelectronics, Growth, Semiconductor, Instrumentation

LONDON, May 1, 2023 /PRNewswire/ -- As per The Business Research Company's microcontroller market forecast, the global microcontroller market size will grow from $19.5 billion in 2022 to $22.1 billion in 2023 at a compound annual growth rate (CAGR) of 13%. The microcontroller market size is then expected to grow to $36.5 billion in 2027 at a CAGR of more than 13.3%.

Key Points: 
  • The microcontroller market size is then expected to grow to $36.5 billion in 2027 at a CAGR of more than 13.3%.
  • The growth in the market is attributed to the growing demand for electric vehicles (EVs), creative lucrative microcontrollers market opportunities for players.
  • Therefore, the increasing demand for electric vehicles is expected to propel the growth of the microcontroller market during the forecast period.
  • Microcontroller manufacturers are focusing on developing more innovative and advanced products to keep up with the rising demand.

The Rising Demand For Electric Vehicles Is Expected To Drive Growth In The Microcontroller Market At A CAGR Of More Than 13% - By The Business Research Company

Retrieved on: 
Monday, May 1, 2023
Partnership, Bev, Winbond, Electronics, STM32, BEV, EVS, Car, Investment, STMicroelectronics, Growth, Semiconductor, Instrumentation

LONDON, May 1, 2023 /PRNewswire/ -- As per The Business Research Company's microcontroller market forecast, the global microcontroller market size will grow from $19.5 billion in 2022 to $22.1 billion in 2023 at a compound annual growth rate (CAGR) of 13%. The microcontroller market size is then expected to grow to $36.5 billion in 2027 at a CAGR of more than 13.3%.

Key Points: 
  • The microcontroller market size is then expected to grow to $36.5 billion in 2027 at a CAGR of more than 13.3%.
  • The growth in the market is attributed to the growing demand for electric vehicles (EVs), creative lucrative microcontrollers market opportunities for players.
  • Therefore, the increasing demand for electric vehicles is expected to propel the growth of the microcontroller market during the forecast period.
  • Microcontroller manufacturers are focusing on developing more innovative and advanced products to keep up with the rising demand.