Central Taiwan Science Park

Winbond TrustME W77Q wins OFweek China IoT Innovative Product Awards 2022

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Monday, November 21, 2022
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TAICHUNG, Taiwan, Nov. 21, 2022 /PRNewswire/ --Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, announced today that TrustME W77Q Secure Flash has been selected as the winner of China OFweek 7th IoT& AI Innovative Technology Product Awards 2022.

Key Points: 
  • TAICHUNG, Taiwan, Nov. 21, 2022 /PRNewswire/ --Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, announced today that TrustME W77Q Secure Flash has been selected as the winner of China OFweek 7th IoT& AI Innovative Technology Product Awards 2022.
  • Established by OFweek, a well-known technology-focused media in China, the OFweek IoT Innovative Technology Product Awards has been recognized as one of the most professional, influential, and representative evolutions in Chinses high-tech industry since 2016.
  • The IoT Innovative Technology Product Awards aims to recognize products, technology, use cases, and enterprises that have made outstanding contributions to the Internet industry to encourage more enterprises further to invest in product and technology innovation and enable the whole industry's benign development.
  • Winbond's W77Q Serial Flash contains all the elements required for a safe, secure and resilient connected platforms, including IoT, Industrial and Automotive.

Winbond Adopts Low Temperature Soldering (LTS) to Slow the Pace of Global Warming

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Wednesday, November 16, 2022
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Winbond is at the forefront of this global trend as the Flash Memory provider to offer this process.

Key Points: 
  • Winbond is at the forefront of this global trend as the Flash Memory provider to offer this process.
  • "As a leader in Flash Memory products, Winbond has an opportunity to leverage its position to help drive carbon neutrality and slow global warming," said Winbond.
  • Simpler and faster SMT process for PCBs with plug-in components Theplug-in components only can withstand the lower soldering temperature.
  • Based on Taichung and new Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.

NSTC Markets Taiwan's Precision Health Research and Development Capabilities to Europe, Allowing Taiwan to Shine at MEDICA 2022, the World's Largest Event for the Medical Sector

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Tuesday, November 15, 2022
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Furthermore, the delegation team participated in the 11th MEDICA Start-up Competition, allowing Taiwan's cutting-edge technological products to reach key European biomedical markets.

Key Points: 
  • Furthermore, the delegation team participated in the 11th MEDICA Start-up Competition, allowing Taiwan's cutting-edge technological products to reach key European biomedical markets.
  • Other representatives included MEDICA, Fraunhofer (the largest applied scientific research institution in Europe), and the Europe-Taiwan Biotech Association (ETBA).
  • The two companies are ready to introduce their products to the European markets through MEDICA, according to Taiwan Tech Arena.
  • Although Taiwanese teams possess advanced technology research and development capabilities, they currently need the recognition of European markets.

Winbond became the world's first memory vendor to receive the ISO/SAE 21434 certification for Road vehicles Cybersecurity Management System

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Thursday, September 1, 2022
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TAICHUNG, Taiwan, Sept. 1, 2022 /PRNewswire/ -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced that they had received the ISO/SAE 21434 certification from TV NORD for Road vehicles Cybersecurity Management System (CSMS), making them the world's first memory vendor to receive the ISO/SAE 21434 standard certification for Road vehicles Cybersecurity Management System (CSMS).

Key Points: 
  • TAICHUNG, Taiwan, Sept. 1, 2022 /PRNewswire/ -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced that they had received the ISO/SAE 21434 certification from TV NORD for Road vehicles Cybersecurity Management System (CSMS), making them the world's first memory vendor to receive the ISO/SAE 21434 standard certification for Road vehicles Cybersecurity Management System (CSMS).
  • ISO/SAE 21434 standard protects vehicle and automotive security by specifying the requirements to make automotive systems more robust against cyber-attacks.
  • Winbond is the first memory manufacturer to receive this Road vehicles CyberSecurity certification.
  • With their Product Longevity Program (WPLP)for automotive applications requiring long-term support, Winbond is the world's preferred memory provider.

Winbond's LPDDR4/4X 100BGA achieves JEDEC standard for improved energy conservation and carbon reduction in a smaller package size

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Wednesday, July 27, 2022
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TAICHUNG, Taiwan, July 27, 2022 /PRNewswire/ -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions,today announced that its new package 100BGA LPDDR4/4X had achieved the JEDEC JED209-4 standard to ensure energy conservation and carbon reduction.

Key Points: 
  • TAICHUNG, Taiwan, July 27, 2022 /PRNewswire/ -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions,today announced that its new package 100BGA LPDDR4/4X had achieved the JEDEC JED209-4 standard to ensure energy conservation and carbon reduction.
  • The LPDDR4/4X is now available in a space-saving 100BGA package measuring only 7.5X10mm2.
  • The deviceis ideal for IoT applications requiring higher throughput in a small package to allow designers to reduce the PCB size for more compact IoT designs.
  • Winbond's LPDDR4/4X memory is available in density of 1Gb and 2Gb, supporting speeds of up to 4267Mbps.

Winbond TrustME® W77Q Secure Flash Obtains SESIP Level 2 with Physical Attacker Resistance Certification

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Wednesday, June 1, 2022
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TAICHUNG, Taiwan, June 1, 2022 /PRNewswire/ -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced that the Company's TrustME® W77Q Secure Flash had obtained Security Evaluation Standard for IoT Platforms (SESIP) Level 2 with Physical Attacker Resistance Certification. This is the first certification using GlobalPlatform® SESIP Profile for Secure External Memories, and NIST 8259A (IoT device cybersecurity capability core baseline). The certification also claims compliance with IEC 62443 (security for industrial automation and control systems). With the prestigious industry-recognized security certification, TrustME W77Q Secure Flash can simultaneously satisfy emerging cybersecurity demands in IoT applications.

Key Points: 
  • OTA server) and the W77Q even when the host processor or SoC has been compromised.
  • "We would like to congratulate GlobalPlatform Full Member Winbond for achieving SESIP Level 2 certification," adds Ana Tavares Lattibeaudiere, Executive Director of GlobalPlatform.
  • "SESIP is helping IoT product manufacturers, like Winbond, comply with specific security requirements and regulations.
  • As an optimized version of CC applied to IoT market, SESIP is providing evidence of secure products by design.

Winbond Keeps Expanding DDR3 SDRAM Production

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Wednesday, April 20, 2022
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TAICHUNG, Taiwan, April 20, 2022 /PRNewswire/ -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced key enhancements to its DDR3 product on the ultra-high-speed performance.

Key Points: 
  • Now, Winbond DDR3 shipments is 30% of total DRAM revenue and is projected to increase to 50% in 2024.
  • "Winbond has been delivering competitive DDR3 products for 10 years and will keep delivering DDR3 in coming 10+ years with superior customer support and product quality," says Winbond.
  • "Today, our customers continue to require DDR3 SDRAM products and our goal is to continue that proven legacy to ensure we can meet customer longevity demand," Winbond added.
  • Based on Taichung and new Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.

Winbond & Infineon Technologies Collaborate to Double Bandwidth for IoT Applications with HYPERRAM 3.0

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Tuesday, April 19, 2022
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TAICHUNG, Taiwan, April 19, 2022 /PRNewswire/ -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, together with Infineon Technologies, a world leader in semiconductor, microelectronics and IoT solutions, have announced the expansion of their HYPERRAM™ product collaboration with the new higher bandwidth HYPERRAM™ 3.0.  

Key Points: 
  • The HYPERRAM product range offers compact alternatives to traditional pseudo-SRAM and is well-suited to low power, space-constrained IoT applications that require an off-chip external RAM.
  • "As a leading provider of memory solutions, Infineon provides a family of solutions that deliver high performance in smaller form factors for next-generation IoT applications," said Ramesh Chettuvetty, Sr. Director of Marketing and Applications at Infineon Technologies.
  • Infineon Technologies is pleased to collaborate with Winbond to enable broader adoption of this new memory technology."
  • The HYPERRAM family is ideal for low-power IoT applications, such as wearables, instrument clusters in automotive applications, infotainment and telematics systems, industrial machine vision, HMI displays and communication modules.

Winbond extends code storage capacity of its ultra-low power 1.2V SPI NOR Flash family with launch of new 64Mb part

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Wednesday, March 16, 2022
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TAICHUNG, Taiwan, March 16, 2022 /PRNewswire/ -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the W25Q64NE, a 1.2V SpiFlash® NOR Flash IC in a 64Mb density which offers the large code storage capacity and active mode power savings needed by the latest generation of smart wearable and mobile devices.

Key Points: 
  • By extending the 1.2V NOR Flash family to include a 64Mb part, Winbond addresses the requirements of smart devices with a larger code footprint.
  • The new W25Q64NE is available for sampling and offer small package size like USON8-3x4 and WLCSP in industry-standard packages and pin-outs.
  • The Winbond 1.2V parts reduce active mode power consumption by a third compared to equivalent 1.8V devices.
  • By using a 1.2V Flash, the SoC can connect directly to the SPI Flash without a level shifter, reducing the BOM cost and PCB space.

Winbond W77Q Secure Flash gains further endorsement with FIPS 140-3 Automated Cryptographic Validation Test System

Retrieved on: 
Wednesday, November 3, 2021
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TAICHUNG, Taiwan, Nov. 3, 2021 /PRNewswire/ -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced that their TrustME W77Q Secure Flash has received FIPS 140-3 Automated Cryptographic Validation Test System (ACVTS) certification.

Key Points: 
  • TAICHUNG, Taiwan, Nov. 3, 2021 /PRNewswire/ -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced that their TrustME W77Q Secure Flash has received FIPS 140-3 Automated Cryptographic Validation Test System (ACVTS) certification.
  • FIPS 140-3 is the latest FIPS 140 standard and is thoroughly aligned with the international ISO/IEC standards.
  • FIPS 140-3 ACVTS is the NIST Cryptographic Algorithm Validation Program which provides validation testing of approved cryptographic algorithms and their individual components.
  • "Acumen Security congratulates Winbond Electronics Corporation on receiving their Cryptographic Algorithm Validation Program (CAVP) certificates for the W77Q TrustME Secure Flash memory.