Multi-chip module

Electronic System Design Industry Posts Record $4.7 Billion in Revenue in Q3 2023, ESD Alliance Reports

Retrieved on: 
Monday, January 8, 2024
Computer-aided engineering, EDA, MCM, ESD Alliance, PCB, ESD, Printed circuit board, SIP, Multi-chip module, EDMD, CAE, Semiconductor, Arms industry

"Electronic design automation (EDA) reported record revenue growth in Q3 23," said Walden C. Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report.

Key Points: 
  • "Electronic design automation (EDA) reported record revenue growth in Q3 23," said Walden C. Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report.
  • The Americas, the largest reporting region by revenue, procured $1,984.1 million of electronic system design products and services in Q3 2023, a 22.8% jump.
  • Europe, Middle East, and Africa (EMEA) procured $551.1 million of electronic system design products and services in Q3 2023, a 21.5% increase.
  • Asia Pacific (APAC) procured $1,858 million of electronic system design products and services in Q3 2023, a 28.1% increase.

Electronic System Design Industry Posts Record $4.7 Billion in Revenue in Q3 2023, ESD Alliance Reports

Retrieved on: 
Monday, January 8, 2024
Computer-aided engineering, EDA, MCM, ESD Alliance, PCB, ESD, Printed circuit board, SIP, Multi-chip module, EDMD, CAE, Semiconductor, Arms industry

"Electronic design automation (EDA) reported record revenue growth in Q3 23," said Walden C. Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report.

Key Points: 
  • "Electronic design automation (EDA) reported record revenue growth in Q3 23," said Walden C. Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report.
  • The Americas, the largest reporting region by revenue, procured $1,984.1 million of electronic system design products and services in Q3 2023, a 22.8% jump.
  • Europe, Middle East, and Africa (EMEA) procured $551.1 million of electronic system design products and services in Q3 2023, a 21.5% increase.
  • Asia Pacific (APAC) procured $1,858 million of electronic system design products and services in Q3 2023, a 28.1% increase.

Electronic System Design Industry Logs $4 Billion in Revenue in Q1 2023, ESD Alliance Reports

Retrieved on: 
Monday, July 10, 2023
CAE, EDMD, Printed circuit board, EDA, Multi-chip module, Sea Ice Physics and Ecosystem eXperiment, Computer-aided engineering, ESD Alliance, MCM, SIP, PCB, Semiconductor, ESD, Video game, Mobile phone, Arms industry

"The electronic design automation (EDA) industry continued to post double-digit gains in Q1 2023, with increases in all product categories and geographic regions," said Walden C. Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report.

Key Points: 
  • "The electronic design automation (EDA) industry continued to post double-digit gains in Q1 2023, with increases in all product categories and geographic regions," said Walden C. Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report.
  • The Americas, the largest reporting region by revenue, procured $1,698.2 million of electronic system design products and services in Q1 2023, a 12.7% increase.
  • Europe, Middle East, and Africa (EMEA) procured $530.1 million of electronic system design products and services in Q1 2023, a 21.6% increase.
  • Asia Pacific (APAC) procured $1,449.9 million of electronic system design products and services in Q1 2023, a 9.6% increase.

Electronic System Design Industry Logs $4 Billion in Revenue in Q1 2023, ESD Alliance Reports

Retrieved on: 
Monday, July 10, 2023
CAE, EDMD, Printed circuit board, EDA, Multi-chip module, Sea Ice Physics and Ecosystem eXperiment, Computer-aided engineering, ESD Alliance, MCM, SIP, PCB, Semiconductor, ESD, Video game, Mobile phone, Arms industry

"The electronic design automation (EDA) industry continued to post double-digit gains in Q1 2023, with increases in all product categories and geographic regions," said Walden C. Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report.

Key Points: 
  • "The electronic design automation (EDA) industry continued to post double-digit gains in Q1 2023, with increases in all product categories and geographic regions," said Walden C. Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report.
  • The Americas, the largest reporting region by revenue, procured $1,698.2 million of electronic system design products and services in Q1 2023, a 12.7% increase.
  • Europe, Middle East, and Africa (EMEA) procured $530.1 million of electronic system design products and services in Q1 2023, a 21.6% increase.
  • Asia Pacific (APAC) procured $1,449.9 million of electronic system design products and services in Q1 2023, a 9.6% increase.

Advantest to Showcase Latest Semiconductor Test Solutions at SEMICON Korea, February 1-3 in Seoul

Retrieved on: 
Tuesday, January 24, 2023
Grand, Nanotechnology, Advantest, AI, Socs, Manhattan Center, COEX, HPC, InterContinental, ESG, Grande Ballroom, RDK, TSE, Korea, Multi-chip module, Exhibition, Printed circuit board

TOKYO, Jan. 24, 2023 (GLOBE NEWSWIRE) -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) will feature its latest test solutions for advanced ICs at SEMICON Korea on Feb. 1-3 at COEX in Seoul, South Korea.

Key Points: 
  • TOKYO, Jan. 24, 2023 (GLOBE NEWSWIRE) -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) will feature its latest test solutions for advanced ICs at SEMICON Korea on Feb. 1-3 at COEX in Seoul, South Korea.
  • Advantest will highlight its contributions to leading-edge test technology, including advanced memory, 5G, AI, high-performance computing (HPC) and nanotechnology, as well as its ESG initiatives.
  • Advantest's product showcase in booth #C510 will feature how the company is adding customer value to the evolving semiconductor value chain through its broad range of test solutions and services.
  • For the latest updates, visit the Advantest Facebook and LinkedIn page or follow @Advantest_ATE on Twitter for live tweets during events.

proteanTecs to Showcase Interconnect Reliability Monitoring at the Chiplet Summit

Retrieved on: 
Thursday, January 19, 2023
Technology, Hardware, Semiconductor, Ecosystem, Marvell, Socs, Session, Cadence Design Systems, Silicon, Electronics, Consortium, Advanced Electronics Company Limited, GUC, Global Unichip Corporation, Multimedia, Video game, Medical device, Multi-chip module

Held from January 24-26 in San Jose, Chiplet Summit is the only event exclusively dedicated to the skyrocketing chiplet market, which is projected to reach $57 billion in revenue by 2035.

Key Points: 
  • Held from January 24-26 in San Jose, Chiplet Summit is the only event exclusively dedicated to the skyrocketing chiplet market, which is projected to reach $57 billion in revenue by 2035.
  • View the full release here: https://www.businesswire.com/news/home/20230119005856/en/
    proteanTecs to exhibit and present at the inaugural Chiplet Summit.
  • In collaboration with Global Unichip Corporation (GUC), proteanTecs unveiled a case study and silicon results from the use of proteanTecs’ interconnect monitoring solutions in GUC’s high bandwidth interfaces.
  • In proteanTecs’ Chiplet Summit booth (#34), technical experts will showcase the company’s interconnect monitoring solutions for die-to-die interfaces.

Chiplet Summit Helps Chip Designers with Heterogeneous Integration

Retrieved on: 
Wednesday, January 18, 2023
Semiconductor, Hardware, Electronic Design Automation, Technology, Artificial Intelligence, AI, Ecosystem, FPGA, IP, Multi-chip module, Software, Printed circuit board

The new Chiplet Summit will help designers develop new chips faster and cheaper.

Key Points: 
  • The new Chiplet Summit will help designers develop new chips faster and cheaper.
  • However, it also introduces the new stage of heterogeneous integration in which everything must be put back together.
  • Chiplet Summit will have pre-conference tutorials on packaging, interfaces, and test and integration.
  • But the idea only works if product developers can integrate them quickly and cheaply,“ said Chuck Sobey, Summit General Chair.

Advantest to Showcase Latest IC Test Solutions at SEMICON Japan, December 14-16 in Tokyo

Retrieved on: 
Wednesday, December 7, 2022
Artificial intelligence, IOT, ACS, IEEE Transactions on Advanced Packaging, RDK, Social responsibility, APCS, Semiconductor, Internet of things, Machine learning, TSE, ICS, Tokyo Big Sight, Socs, AI, HPC, ESG, Video game console, Multi-chip module, Advantest

TOKYO, Dec. 07, 2022 (GLOBE NEWSWIRE) -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) will feature over a dozen of its latest products and services at the SEMICON Japan trade show on December 14-16 in Tokyo.

Key Points: 
  • TOKYO, Dec. 07, 2022 (GLOBE NEWSWIRE) -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) will feature over a dozen of its latest products and services at the SEMICON Japan trade show on December 14-16 in Tokyo.
  • SEMICON Japan will be held as an in-person event this year at the Tokyo Big Sight.
  • In addition to showcasing advanced test technologies, Advantest will also highlight its ESG initiatives and action plans.
  • Like previous years, Advantest is expressing its steadfast support for the industry as a gold-level sponsor of this year’s SEMICON Japan.

Ventana Introduces Veyron, World's First Data Center Class RISC-V CPU Product Family

Retrieved on: 
Tuesday, December 13, 2022
Memory, SDK, Multi-chip module, Acceleration, IP, Composable disaggregated infrastructure, IOMMU, Architecture, Family, Economics, RAS, AI, Data center, Software development kit, Veyron, CPU, IO, Module (mathematics), Video game console, Automotive industry

CUPERTINO, Calif., Dec. 13, 2022 /PRNewswire/ -- Ventana Micro Systems Inc. today announced its Veyron family of high performance RISC-V processors. The Veyron V1 is the first member of the family, and the highest performance RISC-V processor available today. It will be offered in the form of high performance chiplets and IP. Ventana Founder and CEO Balaji Baktha will make the public announcement during his RISC-V Summit keynote today.

Key Points: 
  • CUPERTINO, Calif., Dec. 13, 2022 /PRNewswire/ -- Ventana Micro Systems Inc. today announced its Veyron family of high performance RISC-V processors.
  • The Veyron V1 is the first member of the family, and the highest performance RISC-V processor available today.
  • Ventana Founder and CEO Balaji Baktha will make the public announcement during his RISC-V Summit keynote today.
  • The Veyron V1 is the first RISC-V processor to provide single thread performance that is competitive with the latest incumbent processors for Data Center, Automotive, 5G, AI, and Client applications.

CEVA NeuPro-M Edge AI Processor Architecture Recognized at EE Awards Asia 2022

Retrieved on: 
Tuesday, December 13, 2022
Rotigotine, Memory, Halide, Ultra, Image, TensorFlow, DSP, Human, AR, Environment, Edge computing, Interrupt, PyTorch, ONNX, Hillcrest Labs, Architecture, Intelligence, NB, Robotics, Experiential learning, AI, PC, CEVA, Original equipment manufacturer, UWB, Artificial intelligence, SOC, Wi-Fi, Engineering, Semiconductor, Electronics, Machine learning, GNSS, IOT, Algorithm, Medical device, Video game console, Mobile phone, Bluetooth, Multi-chip module

ROCKVILLE, Md., Dec. 13, 2022 /PRNewswire/ -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies and co-creation solutions announced today that NeuPro-M AI Processor architecture for artificial intelligence and machine learning (AI/ML) inference workloads has received industry recognition with 'Most Promising Product' at the EE Awards Asia 2022.

Key Points: 
  • 'Creating the future with the electronics industry and changing the world with engineers' is the cited aim of the EE Awards Asia 2022, with the program garnering considerable interest from leading companies across the electronics industry.
  • Ran Snir, Vice President and General Manager of the Vision Business Unit at CEVA, commented: "To be recognized for our NeuPro-M AI/ML architecture, among the engineering community is a big honor for CEVA.
  • Targeting the broad markets of Edge AI and Edge Compute, NeuPro-M is a self-contained heterogeneous architecture.
  • Together with CEVA's multi award-winning neural network AI compiler CDNN and its robust software development environment, NeuPro-M provides a fully programmable hardware/software AI development environment for customers to maximize their AI performance.