Xpu Há

Avicena demonstrates first microLED based Transceiver IC in 16nm finFET CMOS for chip-to-chip communications at ECOC 2023

Retrieved on: 
Monday, October 2, 2023
Technology, Hardware, Artificial Intelligence, Semiconductor, Graphics processing unit, HBM, LLM, Processor (computing), PD, Xpu Há, Communes of Burundi, ChatGPT, Silicon photonics, Multimedia, ICS, European Conference on Information Retrieval, CMOS, Artificial intelligence, AI, ECOC, Memory, Conference, Video game, Computer data storage, Avicenna

Avicena, a privately held company headquartered in Sunnyvale, CA, is demonstrating its LightBundleTM multi-Tbps chip-to-chip interconnect technology at the European Conference for Optical Communications (ECOC) 2023 in Glasgow, Scotland ( https://www.ecocexhibition.com/ ).

Key Points: 
  • Avicena, a privately held company headquartered in Sunnyvale, CA, is demonstrating its LightBundleTM multi-Tbps chip-to-chip interconnect technology at the European Conference for Optical Communications (ECOC) 2023 in Glasgow, Scotland ( https://www.ecocexhibition.com/ ).
  • Today, HBM modules must be co-packaged with GPUs because the GPU-memory electrical interconnect is limited to just a few millimeters in length.
  • Conventional optical interconnects based on VCSELs or Silicon Photonics (SiPh) promise to extend the interconnect reach.
  • By contrast, Avicena’s microLED-based LightBundle interconnects provide much lower power and latency, much higher bandwidth density, and can achieve very low costs.

Lightelligence Introduces Optical Interconnect for Composable Data Center Architectures, Unlocking Infrastructure Scalability, Disaggregation

Retrieved on: 
Tuesday, August 8, 2023
Optical networking, CXL, Compute Express Link, Emancipation Memorial (Boston), Stanford University, AMD, LLM, Onet.pl, Xpu Há, PCI Express, Santa Clara Convention Center, Hot, Epyc, OCP, Memory, Workload, SFF, Emergency & I, PACE, OMAC, Computer data storage, Video game, Engineering, Samsung

Photowave, an Optical Networking (oNET) transceiver leveraging the significant latency and energy efficiency of photonics technology, empowers data center managers to scale resources within or across server racks.

Key Points: 
  • Photowave, an Optical Networking (oNET) transceiver leveraging the significant latency and energy efficiency of photonics technology, empowers data center managers to scale resources within or across server racks.
  • “We are more than excited to unveil the next piece of our product portfolio,” comments Yichen Shen, CEO of Lightelligence.
  • The current Ethernet-based infrastructure carries too much latency overhead to enable this disaggregation.
  • This facilitates scalable CXL fabrics in the composable data center.

Supermicro Expands Storage Solutions Portfolio for Intensive I/O Workloads with Industry Standard Based All-Flash Servers Utilizing EDSFF E3.S, and E1.S Storage Drives Across Multiple Product Lines

Retrieved on: 
Tuesday, March 14, 2023
Cloud, SAN, NIC, PCI Express, Intel, NUMA, GPU, TB, CPU, Memory, TCO, Xpu Há, SNIA, Total, Storage, Bay, NVM Express, TDP, Education minister, EDSFF, AMD, Enterprise, Video game, Computer data storage, Supermicro

SAN JOSE, Calif., March 14, 2023 /PRNewswire/ -- Supermicro, Inc. (NASDAQ: SMCI), a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing the latest addition to its revolutionary ultra-high performance, high-density petascale class all-flash NVMe server family. Supermicro systems in this high-performance storage product family will support the next-generation EDSFF form factor, including the E3.S and E1.S devices, in form factors that accommodate 16- and 32 high-performance PCIe Gen5 NVMe drive bays.

Key Points: 
  • All of the Supermicro systems that support either the E1.S or E3.s form factors enable customers to realize the benefits in various application-optimized servers.
  • EDSFF (Enterprise and Datacenter Standard Form Factor) is an industry standard developed by and maintained by the SNIA.
  • The EDSFF specified storage devices are available in a range of capacities and performance and have increased scalability and serviceability compared to previous generations of storage devices.
  • "Supermicro continues to address our users' requirements with innovative solutions for today's and tomorrow's workloads," said Charles Liang, president and CEO of Supermicro.

Supermicro Expands Storage Solutions Portfolio for Intensive I/O Workloads with Industry Standard Based All-Flash Servers Utilizing EDSFF E3.S, and E1.S Storage Drives Across Multiple Product Lines

Retrieved on: 
Tuesday, March 14, 2023
Cloud, SAN, NIC, PCI Express, Intel, NUMA, GPU, TB, CPU, Memory, TCO, Xpu Há, SNIA, Total, Storage, Bay, NVM Express, TDP, Education minister, EDSFF, AMD, Enterprise, Video game, Computer data storage, Supermicro

SAN JOSE, Calif., March 14, 2023 /PRNewswire/ -- Supermicro, Inc. (NASDAQ: SMCI), a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing the latest addition to its revolutionary ultra-high performance, high-density petascale class all-flash NVMe server family. Supermicro systems in this high-performance storage product family will support the next-generation EDSFF form factor, including the E3.S and E1.S devices, in form factors that accommodate 16- and 32 high-performance PCIe Gen5 NVMe drive bays.

Key Points: 
  • All of the Supermicro systems that support either the E1.S or E3.s form factors enable customers to realize the benefits in various application-optimized servers.
  • EDSFF (Enterprise and Datacenter Standard Form Factor) is an industry standard developed by and maintained by the SNIA.
  • The EDSFF specified storage devices are available in a range of capacities and performance and have increased scalability and serviceability compared to previous generations of storage devices.
  • "Supermicro continues to address our users' requirements with innovative solutions for today's and tomorrow's workloads," said Charles Liang, president and CEO of Supermicro.

Avicena Demonstrates Hottest Optical Link at OFC 2023

Retrieved on: 
Tuesday, March 7, 2023
Technology, Wearables, Mobile Technology, Semiconductor, IOT (Internet of Things), Apps, Applications, Satellite, Other Technology, Software, Audio, Video, Networks, 5G, Mobile, Wireless, Batteries, Hardware, Electronic Design Automation, Data Management, Artificial Intelligence, Gallium arsenide, MicroLED, OFC, Memory, Communication, Lighting, Indium phosphide, Marketing, Laser, Optics, Immunity, Gallium nitride, EMI, Architecture, ICS, Conference, Xpu Há, PD, LED, Temperature, CMOS, HPC, Printed circuit board, Avicenna

Avicena, a privately held company headquartered in Sunnyvale, CA, is demonstrating the world’s highest temperature optical link operating at up to 235°C using its LightBundleTM communication architecture and technology at the Optical Fiber Communication Conference (OFC) 2023 in San Diego, CA ( https://www.ofcconference.org/en-us/home/ ).

Key Points: 
  • Avicena, a privately held company headquartered in Sunnyvale, CA, is demonstrating the world’s highest temperature optical link operating at up to 235°C using its LightBundleTM communication architecture and technology at the Optical Fiber Communication Conference (OFC) 2023 in San Diego, CA ( https://www.ofcconference.org/en-us/home/ ).
  • Over the past three decades, optical links have gradually replaced copper interconnects in many segments of wired communications due to their much longer reach, lower power requirements, lighter weight, and immunity to EMI.
  • Today most optical links use semiconductor edge-emitting lasers or vertical cavity surface-emitting lasers (VCSELs).
  • This is igniting interest among our partners and customers in numerous market segments in the automotive, defense, and aerospace industries.”

Avicena Partners With ams OSRAM to Enable High-Volume Future Production of Ultra-Low Energy Chip-to-Chip Interconnects

Retrieved on: 
Monday, March 6, 2023
Aerospace, Technology, Manufacturing, Semiconductor, Telecommunications, Other Manufacturing, Software, Artificial Intelligence, Networks, Mobile, Wireless, Hardware, DALL-E, MicroLED, OSRAM, Memory, U-JIN Tech Corp., Gallium nitride, Multimedia, IC, Xpu Há, ChatGPT, Ams-OSRAM, CMOS, HPC, Electronics, Computer data storage, Cryptocurrency, Nanosys, Avicenna

Avicena Tech Corp., a privately held company in Sunnyvale, CA, has partnered with ams OSRAM to develop high-volume manufacturing of GaN microLED arrays for its industry-leading LightBundle™ communication architecture.

Key Points: 
  • Avicena Tech Corp., a privately held company in Sunnyvale, CA, has partnered with ams OSRAM to develop high-volume manufacturing of GaN microLED arrays for its industry-leading LightBundle™ communication architecture.
  • Attempts to scale current architectures are running headlong into physical limits leading to slower throughput growth, power-hungry and hard to cool systems.
  • This leverages emerging microLED manufacturing ecosystems, in which ams OSRAM is a major player.
  • “As a global leader in GaN LEDs, we are excited to partner with Avicena to transform these very large and important markets.”

Supermicro Expands Storage Solutions Portfolio for Intensive I/O Workloads with All-Flash Servers Utilizing EDSFF E3.S and E1.S Storage Drives Across Multiple Product Lines

Retrieved on: 
Tuesday, March 7, 2023
Cloud, EDSFF, NVM Express, Memory, SAN, Education minister, Intel, CPU, OCP, TDP, AMD, TB, NUMA, Total, Xpu Há, TCO, GPU, Storage, NIC, Bay, Video game, Computer data storage, Supermicro

SAN JOSE, Calif., March 7, 2023 /PRNewswire/ -- Supermicro, Inc. (NASDAQ: SMCI), a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing the latest addition to its revolutionary ultra-high performance, high-density petascale class all-flash NVMe server family. Supermicro systems in this high performance storage product family will support the next-generation EDSFF form factor, including the E3.S and E1.S devices, in form factors that accommodate 16- and 32 high-performance PCIe Gen5 NVMe drive bays.

Key Points: 
  • "Supermicro continues to address our users' requirements with innovative solutions for today's and tomorrow's workloads," said Charles Liang, president and CEO of Supermicro.
  • "With up to a petabyte of storage in a standard rackmount system, users can quickly access tremendous amounts of data at their fingertips.
  • The new storage system is compact and energy efficient and will give our users the lowest latency and highest bandwidth in the industry.
  • The symmetrical design also facilitates smooth airflow over the entire system, allowing the use of more powerful processors.

Supermicro Expands Storage Solutions Portfolio for Intensive I/O Workloads with All-Flash Servers Utilizing EDSFF E3.S and E1.S Storage Drives Across Multiple Product Lines

Retrieved on: 
Tuesday, March 7, 2023
Cloud, EDSFF, NVM Express, Memory, SAN, Education minister, Intel, CPU, OCP, TDP, AMD, TB, NUMA, Total, Xpu Há, TCO, GPU, Storage, NIC, Bay, Video game, Computer data storage, Supermicro

SAN JOSE, Calif., March 7, 2023 /PRNewswire/ -- Supermicro, Inc. (NASDAQ: SMCI), a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing the latest addition to its revolutionary ultra-high performance, high-density petascale class all-flash NVMe server family. Supermicro systems in this high performance storage product family will support the next-generation EDSFF form factor, including the E3.S and E1.S devices, in form factors that accommodate 16- and 32 high-performance PCIe Gen5 NVMe drive bays.

Key Points: 
  • "Supermicro continues to address our users' requirements with innovative solutions for today's and tomorrow's workloads," said Charles Liang, president and CEO of Supermicro.
  • "With up to a petabyte of storage in a standard rackmount system, users can quickly access tremendous amounts of data at their fingertips.
  • The new storage system is compact and energy efficient and will give our users the lowest latency and highest bandwidth in the industry.
  • The symmetrical design also facilitates smooth airflow over the entire system, allowing the use of more powerful processors.

Avicena Acquires microLED Fab Facility and Engineering Team From Nanosys

Retrieved on: 
Tuesday, October 18, 2022
Other Manufacturing, Mobile, Wireless, Technology, Semiconductor, Engineering, Aerospace, Software, Manufacturing, Networks, Hardware, CA, ASIC, Television, NVLink, Silicon, Xpu Há, PD, 2014 UCI Road World Championships, Multimedia, Investment, MicroLED, Partnership, HPC, Gallium nitride, CMOS, Acquisition, CEO, Bow, Interconnect, Artificial intelligence, Tablet, ICS, Video game console, Computer data storage, Avicenna, Nanosys

Avicena, the leader in high-performance microLED-based chip-to-chip interconnects, today announced that it has completed the acquisition of a microLED fabrication facility and associated engineering team from Nanosys.

Key Points: 
  • Avicena, the leader in high-performance microLED-based chip-to-chip interconnects, today announced that it has completed the acquisition of a microLED fabrication facility and associated engineering team from Nanosys.
  • Avicena had been using the Nanosys fab for the development of unique ultra-fast microLEDs.
  • The acquisition of the fab and associated engineering team significantly increases the development and manufacturing capabilities.
  • We thank the microLED fab team for their partnership in developing and manufacturing microLEDs as part of Nanosys and wish them well in their future with Avicena, said Jason Hartlove, President and CEO of Nanosys.

Avicena demonstrates ultra-fast microLED-array based interconnects for chip-to-chip communications at ECOC 2022

Retrieved on: 
Monday, September 19, 2022
Technology, Semiconductor, Engineering, Manufacturing, Software, Networks, Hardware, Other Science, Science, TBPS, MicroLED, Mountain View, California, Temperature, CMOS, ICS, 2013 UCI Road World Championships – Women's team time trial, ELS, NVLink, ECOC, PD, CEO, Technology, CA, Family, Application-specific integrated circuit, European Conference on Information Systems, Communes of Burundi, Gallium nitride, Conference, Interconnect, HPC, Multimedia, Bow, Xpu Há, Artificial intelligence, Computer data storage, Avicenna

Avicena, a privately held company in Mountain View, CA, is demonstrating its LightBundleTM multi-Tbps chip-to-chip interconnect technology at the European Conference for Optical Communications (ECOC) 2022 in Basel, Switzerland ( https://www.ecocexhibition.com/ ).

Key Points: 
  • Avicena, a privately held company in Mountain View, CA, is demonstrating its LightBundleTM multi-Tbps chip-to-chip interconnect technology at the European Conference for Optical Communications (ECOC) 2022 in Basel, Switzerland ( https://www.ecocexhibition.com/ ).
  • Highly variable workloads are driving the evolution of densely interconnected, heterogeneous, software-defined clusters of XPUs, Smart NICs, hardware accelerators, and high-performance shared memory.
  • Ever growing Artificial Intelligence (AI)/Machine Learning (ML) and High-Performance Computing (HPC) workloads are driving the need for interconnects with ultra-high bandwidth density, ultra-low power consumption, and low latency.
  • We have already demonstrated LightBundleTM links running at less than 1pJ/bit, says Bardia Pezeshki, founder and CEO of Avicena, Here at ECOC 2022 we are demonstrating individual microLED links running at 14Gbps.