NVLink

NVIDIA Launches Blackwell-Powered DGX SuperPOD for Generative AI Supercomputing at Trillion-Parameter Scale

Retrieved on: 
Monday, March 18, 2024
Storage, GTC, FP4, GPU, NVLink, SHARP, Memory, Grace, InfiniBand, B200, AI, Software, DGX, Architecture, TB, San Jose Convention Center, Video game

Each DGX GB200 system features 36 NVIDIA GB200 Superchips — which include 36 NVIDIA Grace CPUs and 72 NVIDIA Blackwell GPUs — connected as one supercomputer via fifth-generation NVIDIA NVLink® .

Key Points: 
  • Each DGX GB200 system features 36 NVIDIA GB200 Superchips — which include 36 NVIDIA Grace CPUs and 72 NVIDIA Blackwell GPUs — connected as one supercomputer via fifth-generation NVIDIA NVLink® .
  • “NVIDIA DGX AI supercomputers are the factories of the AI industrial revolution,” said Jensen Huang, founder and CEO of NVIDIA.
  • NVIDIA also unveiled the NVIDIA DGX B200 system , a unified AI supercomputing platform for AI model training, fine-tuning and inference.
  • NVIDIA DGX SuperPOD with DGX GB200 and DGX B200 systems are expected to be available later this year from NVIDIA’s global partners.

NVIDIA Blackwell Platform Arrives to Power a New Era of Computing

Retrieved on: 
Monday, March 18, 2024
Cloud, Maker, Hewlett Packard Enterprise, Azure, GTC, Google Cloud, Algorithm, GPU, IBM Cloud, ASUS, B200, QCT, YTL Power, Deep learning, LLM, Statistics, Microsoft, Foxconn, NVLink, Partnership, InfiniBand, SAN, Oracle Cloud, Software, Meta AI, AWS, Ansys, TB, Pegatron, Fabric discography, GIGABYTE, Organization, Synopsys, Acceleration, Library, Grace, Quantum computing, Research, Electronic design automation, Architecture, Amazon Web Services, Dell Technologies, Cisco, Gmail, Machine learning, Game theory, Engineering, HGX, Decompression, OpenAI, Data science, Deep learning super sampling, Drug, Supermicro, DGX, Graphics processing unit, Elasticity, National academy, Dell, TSMC, Video game

The NVIDIA GB200 Grace Blackwell Superchip connects two NVIDIA B200 Tensor Core GPUs to the NVIDIA Grace CPU over a 900GB/s ultra-low-power NVLink chip-to-chip interconnect.

Key Points: 
  • The NVIDIA GB200 Grace Blackwell Superchip connects two NVIDIA B200 Tensor Core GPUs to the NVIDIA Grace CPU over a 900GB/s ultra-low-power NVLink chip-to-chip interconnect.
  • It combines 36 Grace Blackwell Superchips, which include 72 Blackwell GPUs and 36 Grace CPUs interconnected by fifth-generation NVLink.
  • The Blackwell product portfolio is supported by NVIDIA AI Enterprise , the end-to-end operating system for production-grade AI.
  • To learn more about the NVIDIA Blackwell platform, watch the GTC keynote and register to attend sessions from NVIDIA and industry leaders at GTC, which runs through March 21.

Applied Digital Secures Contract with AI Customer, Together AI

Retrieved on: 
Thursday, March 14, 2024
Organization, Communication, Digital, NVLink, H100, Partnership, InfiniBand, HPC, Supercomputer, AI, Graphics processing unit, Ecosystem, NVIDIA, Video game

DALLAS, March 14, 2024 (GLOBE NEWSWIRE) -- Applied Digital Corporation (Nasdaq: APLD) ("Applied Digital" or the "Company"), a designer, builder, and operator of next-generation digital infrastructure designed for High-Performance Computing (“HPC”) applications, today announced the onboarding of another AI customer, Together AI. Applied Digital received a contract prepayment of $18 million as part of the $75 million contract, in connection with which it has fully onboarded one compute cluster of GPUs and has provided access to its second cluster.

Key Points: 
  • • Applied Digital's robust infrastructure aligns with Together AI's commitment to innovation, seeking to meet the surging demands of AI and HPC markets.
  • DALLAS, March 14, 2024 (GLOBE NEWSWIRE) -- Applied Digital Corporation (Nasdaq: APLD) ("Applied Digital" or the "Company"), a designer, builder, and operator of next-generation digital infrastructure designed for High-Performance Computing (“HPC”) applications, today announced the onboarding of another AI customer, Together AI .
  • “Our partnership with Together AI highlights the effectiveness of our cloud service in propelling forward-thinking AI ventures towards scalability,” said Applied Digital CEO and Chairman Wes Cummins.
  • We believe Applied Digital is poised to capitalize on this momentum, spearheading advancements in these complementary sectors.

AWS and NVIDIA Extend Collaboration to Advance Generative AI Innovation

Retrieved on: 
Monday, March 18, 2024
Networks, Online Retail, Internet, Hardware, Data Management, Electronic Commerce, Technology, Artificial Intelligence, Semiconductor, Health Technology, Security, Retail, Health, Cloud, GTC, GPU, Artificial intelligence, EC2, NCC, Amazon, NVLink, KMS, Software, AWS, Chemistry, Amazon Elastic Compute Cloud, Catalog, EFA, Amazon SageMaker, Fabric discography, Organization, Drug discovery, Grace, Research, AI, Medtech, Robotics, NCC Group, NVDA, Digital, DGX, Biology, Workflow, Graphics processing unit, Amazon (company), AMZN, Multimedia, CPU, FMS, Video game

“Our collaboration with AWS is accelerating new generative AI capabilities and providing customers with unprecedented computing power to push the boundaries of what's possible."

Key Points: 
  • “Our collaboration with AWS is accelerating new generative AI capabilities and providing customers with unprecedented computing power to push the boundaries of what's possible."
  • Announced at AWS re:Invent 2023, Project Ceiba is a collaboration between NVIDIA and AWS to build one of the world’s fastest AI supercomputers.
  • NVIDIA research and development teams will use Ceiba to advance AI for LLMs, graphics (image/video/3D generation) and simulation, digital biology, robotics, self-driving cars, NVIDIA Earth-2 climate prediction, and more to help NVIDIA propel future generative AI innovation.
  • AWS and NVIDIA have joined forces to offer high-performance, low-cost inference for generative AI with Amazon SageMaker integration with NVIDIA NIM inference microservices, available with NVIDIA AI Enterprise.

Supermicro Grows AI Optimized Product Portfolio with a New Generation of Systems and Rack Architectures Featuring New NVIDIA Blackwell Architecture Solutions

Retrieved on: 
Monday, March 18, 2024
Cloud, HGX, GTC, GPU, Communication, Deep learning super sampling, NVLink, Grace, InfiniBand, SAN, B200, AI, LLM, Architecture, Graphics processing unit, GPT, TB, San Jose Convention Center, NVIDIA, MGX, TDP, Total, Video game

SAN JOSE, Calif., March 18, 2024 /PRNewswire/ -- NVIDIA GTC 2024, -- Supermicro, Inc. (NASDAQ: SMCI), a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, is announcing new AI systems for large-scale generative AI featuring NVIDIA's next-generation of data center products, including the latest NVIDIA GB200 Grace™ Blackwell Superchip, the NVIDIA B200 Tensor Core and B100 Tensor Core GPUs. Supermicro is enhancing its current NVIDIA HGX™ H100/H200 8-GPU systems to be drop-in ready for the NVIDIA HGX™ B100 8-GPU and enhanced to support the B200, resulting in a reduced time to delivery. Additionally, Supermicro will further strengthen its broad NVIDIA MGX™ systems lineup with new offerings featuring the NVIDIA GB200, including the NVIDIA GB200 NVL72, a complete rack level solution with 72 NVIDIA Blackwell GPUs. Supermicro is also adding new systems to its lineup, including the 4U NVIDIA HGX B200 8-GPU liquid-cooled system.

Key Points: 
  • Additionally, Supermicro will further strengthen its broad NVIDIA MGX™ systems lineup with new offerings featuring the NVIDIA GB200, including the NVIDIA GB200 NVL72, a complete rack level solution with 72 NVIDIA Blackwell GPUs.
  • "These new products are built upon Supermicro and NVIDIA's proven HGX and MGX system architecture, optimizing for the new capabilities of NVIDIA Blackwell GPUs.
  • Optimized for the NVIDIA Blackwell architecture, the NVIDIA Quantum-X800, and Spectrum-X800 will deliver the highest level of networking performance for AI infrastructures.
  • Supermicro will also showcase two rack-level solutions, including a concept rack with systems featuring the upcoming NVIDIA GB200 with 72 liquid-cooled GPUs interconnected with fifth-generation NVLink.

Google Cloud and NVIDIA Expand Partnership to Scale AI Development

Retrieved on: 
Monday, March 18, 2024
Cloud, GKE, GTC, Google Cloud, GPU, Runway, Organization, Data science, NVLink, H100, XPK, Grace, Partnership, SAN, AI, Dataflow, DGX, LLM, T4, Graphics processing unit, MLOps, NIM, API, Machine learning, NVIDIA, JAX

SAN JOSE, Calif., March 18, 2024 /PRNewswire/ -- GTC -- Google Cloud and NVIDIA today announced a deepened partnership to enable the machine learning (ML) community with technology that accelerates their efforts to easily build, scale and manage generative AI applications.

Key Points: 
  • To continue bringing AI breakthroughs to its products and developers, Google announced its adoption of the new NVIDIA Grace Blackwell AI computing platform, as well as the NVIDIA DGX Cloud service on Google Cloud.
  • "With expanded infrastructure offerings and new integrations with NVIDIA's full-stack AI, Google Cloud continues to provide customers with an open, flexible platform to easily scale generative AI applications."
  • Support for NVIDIA NeMo: Google Cloud has made it easier to deploy the NVIDIA NeMo framework across its platform via Google Kubernetes Engine (GKE) and Google Cloud HPC Toolkit .
  • Vertex AI and Dataflow expand support for NVIDIA GPUs: To advance data science and analytics, Vertex AI now supports Google Cloud A3 VMs powered by NVIDIA H100 GPUs and G2 VMs powered by NVIDIA L4 Tensor Core GPUs.

Supermicro Grows AI Optimized Product Portfolio with a New Generation of Systems and Rack Architectures Featuring New NVIDIA Blackwell Architecture Solutions

Retrieved on: 
Monday, March 18, 2024
Cloud, HGX, GTC, GPU, Communication, Deep learning super sampling, NVLink, Grace, InfiniBand, SAN, B200, AI, LLM, Architecture, Graphics processing unit, GPT, TB, San Jose Convention Center, NVIDIA, MGX, TDP, Total, Video game

SAN JOSE, Calif., March 18, 2024 /PRNewswire/ -- NVIDIA GTC 2024, -- Supermicro, Inc. (NASDAQ: SMCI), a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, is announcing new AI systems for large-scale generative AI featuring NVIDIA's next-generation of data center products, including the latest NVIDIA GB200 Grace™ Blackwell Superchip, the NVIDIA B200 Tensor Core and B100 Tensor Core GPUs. Supermicro is enhancing its current NVIDIA HGX™ H100/H200 8-GPU systems to be drop-in ready for the NVIDIA HGX™ B100 8-GPU and enhanced to support the B200, resulting in a reduced time to delivery. Additionally, Supermicro will further strengthen its broad NVIDIA MGX™ systems lineup with new offerings featuring the NVIDIA GB200, including the NVIDIA GB200 NVL72, a complete rack level solution with 72 NVIDIA Blackwell GPUs. Supermicro is also adding new systems to its lineup, including the 4U NVIDIA HGX B200 8-GPU liquid-cooled system.

Key Points: 
  • Additionally, Supermicro will further strengthen its broad NVIDIA MGX™ systems lineup with new offerings featuring the NVIDIA GB200, including the NVIDIA GB200 NVL72, a complete rack level solution with 72 NVIDIA Blackwell GPUs.
  • "These new products are built upon Supermicro and NVIDIA's proven HGX and MGX system architecture, optimizing for the new capabilities of NVIDIA Blackwell GPUs.
  • Optimized for the NVIDIA Blackwell architecture, the NVIDIA Quantum-X800, and Spectrum-X800 will deliver the highest level of networking performance for AI infrastructures.
  • Supermicro will also showcase two rack-level solutions, including a concept rack with systems featuring the upcoming NVIDIA GB200 with 72 liquid-cooled GPUs interconnected with fifth-generation NVLink.

IDTechEx Discusses Advanced Semiconductor Packaging Trends in AI and HPC

Retrieved on: 
Friday, February 23, 2024
HPC, Natural language processing, Transmission loss, SRAM, Silicon, NVLink, Forecasting, HBM, 3D, Language, CPU, Growth, HyperTransport, LLM, GPT, Memory, Translation, GPU, TSMC, AMD, DRAM, Graphics processing unit, NLP, Logic, Instinct, OpenAI, Central processing unit, NVIDIA, Computer data storage

The " Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications " report recently published by IDTechEx explores the evolving landscape of semiconductor packaging, with a focus on 2.5D and 3D hybrid bonding packaging.

Key Points: 
  • The " Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications " report recently published by IDTechEx explores the evolving landscape of semiconductor packaging, with a focus on 2.5D and 3D hybrid bonding packaging.
  • It covers technology trends, industry challenges, and the advancements made by key players while forecasting market trends in the semiconductor packaging sector.
  • IDTechEx's new report, " Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications ", delves into the dynamic landscape of 2.5D and 3D packaging, analyzing technology trends, industry barriers, key player's technology roadmap, and market forecasts.
  • Gain invaluable insights into not just AI and HPC applications but also 5G/6G, autonomous vehicles, and consumer electronics sectors, understanding how advanced packaging shapes their trajectory.

IDTechEx Discusses Advanced Semiconductor Packaging Trends in AI and HPC

Retrieved on: 
Friday, February 23, 2024
HPC, Natural language processing, Transmission loss, SRAM, Silicon, NVLink, Forecasting, HBM, 3D, Language, CPU, Growth, HyperTransport, LLM, GPT, Memory, Translation, GPU, TSMC, AMD, DRAM, Graphics processing unit, NLP, Logic, Instinct, OpenAI, Central processing unit, NVIDIA, Computer data storage

The " Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications " report recently published by IDTechEx explores the evolving landscape of semiconductor packaging, with a focus on 2.5D and 3D hybrid bonding packaging.

Key Points: 
  • The " Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications " report recently published by IDTechEx explores the evolving landscape of semiconductor packaging, with a focus on 2.5D and 3D hybrid bonding packaging.
  • It covers technology trends, industry challenges, and the advancements made by key players while forecasting market trends in the semiconductor packaging sector.
  • IDTechEx's new report, " Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications ", delves into the dynamic landscape of 2.5D and 3D packaging, analyzing technology trends, industry barriers, key player's technology roadmap, and market forecasts.
  • Gain invaluable insights into not just AI and HPC applications but also 5G/6G, autonomous vehicles, and consumer electronics sectors, understanding how advanced packaging shapes their trajectory.

AWS and NVIDIA Announce Strategic Collaboration to Offer New Supercomputing Infrastructure, Software, and Services for Generative AI

Retrieved on: 
Tuesday, November 28, 2023
Networks, Internet, Hardware, Artificial Intelligence, Data Management, Technology, Semiconductor, Other Technology, Cloud, Titan, Amazon Elastic Compute Cloud, L4, NVLink, Drug discovery, Memory, Robotics, Amazon, Multimedia, Graphics processing unit, Amazon Robotics, Digital, AMZN, AI, Amazon Virtual Private Cloud, Amazon (company), Amazon SageMaker, NVDA, Machine learning, Ford Barra engine, HPC, Simulation, GPU, LLM, Research, Natural language processing, Nvidia Omniverse, FMS, PCI Express, FP8, EFA, Deep learning super sampling, Central processing unit, VPC, DGX, EC2, Software, 3D, AWS, TB, Amazon Elastic Block Store, Cryptocurrency, Video game, Medical device, Hopper, Design, NVIDIA, G6

The NVIDIA GH200 NVL32 multi-node platform connects 32 Grace Hopper Superchips with NVIDIA NVLink and NVSwitch technologies into one instance.

Key Points: 
  • The NVIDIA GH200 NVL32 multi-node platform connects 32 Grace Hopper Superchips with NVIDIA NVLink and NVSwitch technologies into one instance.
  • • NVIDIA and AWS will collaborate to host NVIDIA DGX Cloud , NVIDIA’s AI-training-as-a-service, on AWS.
  • DGX Cloud on AWS will accelerate training of cutting-edge generative AI and large language models that can reach beyond 1 trillion parameters.
  • NVIDIA DGX Cloud is an AI supercomputing service that gives enterprises fast access to multi-node supercomputing for training the most complex LLM and generative AI models, with integrated NVIDIA AI Enterprise software and direct access to NVIDIA AI experts.